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Date
Wed, Feb 8th, 2017
Thu, Feb 9th, 2017
Fri, Feb 10th, 2017
Sat, Feb 11th, 2017
Sun, Feb 12th, 2017
Mon, Feb 13th, 2017
Tue, Feb 14th, 2017
Wed, Feb 15th, 2017
Thu, Feb 16th, 2017
Fri, Feb 17th, 2017
Type
Special Event
Professional Development
Management
Designer
Buzz Session
Technical Conference Session
Poster
Standards Development Committee Meeting
Track
Assembly Processes for Lead Free and Tin-Lead
Assembly Processes for Lead-Free and Tin Lead
Cleaning/Coating/Contamination
Design
Emerging Technologies
Environmental Issues and Compliance
PCB Fabrication and Materials
PCB Fabrication and Materials & Emerging Technologies
Printed Electronics
Quality, Reliability and Test
Quality, Reliability and Test & Assembly Processes for Lead-Free and Tin Lead
Quality, Reliability and Test & PCB Fabrication and Materials
Supply Chain/Business Issues
Speaker
Ah Feau Ng, TechMent Consultancy Sdn. Bhd.
Aidan Turnbull Ph.D., BomCheck
Ajith Krishnamurthy, Siemens PLM
Alan Burk, ALMAX
Alan Rae Ph.D., IncubatorWorks
Albert Block Jr., National Instruments
Alex Lambert, University of North Texas Chemistry Department Interfacial
Amir Nobari, 5N Plus Inc.
Amy Hagnauer, Raytheon Company
Andrew Piotrowski, ICL-IP America
Anna Lifton
Anne Marie Mulvihill, IPC
Anthony Lentz, FCT Assembly, Inc.
Ariel Zauer, Frontline PCB Solutions
Art Dobie, Ikonics Corp.
Ayana Nickerson, IPC
Aysegul Nebioglu Ph.D., Dymax Corporation
Azita Yazdani, Exergy Technologies Corporation
Ben Leever, NextFlex
Bernard Candaele, Thales Communications & Security
Beverley Christian Ph.D., HDP User Group
Bhanu Sood, NASA Goddard Space Flight Center
Bill Bader, iNEMI
Bill Leong, Hewlett-Packard Company
Bob Klenke, ITM Consulting Inc.
Bob Wettermann MIT, BEST-Michigan
Brad Bourne, FTG Circuits
Brenda Martin, Zollner Electronics
Bret Bruhn, TTM Technologies
Brett Miller, USA Harness, Inc.
Brian Butler
Brian Chislea, Dow Corning Corporation,
Brian Toleno Ph.D., Microsoft Corporation
Brook Sandy-Smith, Indium Corporation
Bruce Hughes
Bryan Fry, Ph.D., Quantum Silicones
Bud Bowen
Cameron Shearon, AT&T Services, Inc
Carlo Viola, Northrop Grumman Mission Systems
Catherine Shearer, Ormet Circuits, Inc.
Chetan Shah, Flex Interconnect
Christian Schauer, InnoLas Solutions GmbH
Christian Whitchurch, Defense Threat Reduction Agency
Christoph Wimmer, Microscan Systems Inc.
Christopher Hunt Ph.D., Gen3 Systems
Clark Webster, ALL Flex LLC
Clifford Maddox
Clive Ashmore, ASM Assembly Systems
Cong Zhao, Auburn University
Constantino Gonzalez MIT, ACME Training & Consulting
Dale Lee, Plexus Corp.
Dan Feinberg, Fein-Line Associates
Dan Schnur, University of Southern California
Dan Welch
Dana Korf
Daniel Foster CIT, Missile Defense Agency
Daniel Gamota, Jabil Circuit, Inc. (HQ)
Daniel Gamota, Printovate Technologies, Inc.
Dave Harrell CIT
David Adams
David Bergman, IPC
David Carnevale, Dolby Laboratories
David Geiger, Flextronics International
David Hillman, Rockwell Collins
David Hoover, TTM Technologies
David Lober, Kyzen Corporation
David Wolf, Conductor Analysis Technologies, Inc.
David Wynants, Taconic Advanced Dielectric Division
Debbie Wade MIT
Debora Obitz MIT, National Technical Systems Anaheim
Denis Jean, Kester
Dennis Fritz
Desmond Wong, TransSiP, Inc.
Dock Brown, DfR Solutions
Don Dupriest, Lockheed Martin Missiles & Fire Control
Doug Sober, Essex Technologies Group Inc.
Douglas Pauls, Rockwell Collins
Dudi Amir
Eddie Hofer, Rockwell Collins
Edward Acheson, Cadence Design Systems, Inc.
Edward Sandor, Taconic Advanced Dielectric Division
Eric Bastow, Indium Corporation
Eric Camden, Foresite, Inc.
Eric Straw, Rockwell Collins
Fei Peng Ph.D., MacDermid Enthone Electronics Solutions
Fern Abrams, IPC Government Relations
Fonda Wu
Forrest Christian, Innovation Machine Ltd.
Fredrik Lofthagen, Interel
Gabriel Briceno Ph.D., Qual-Pro Corporation
Garry McGuire, NASA Marshall Space Flight Center
Gary Carter
Gary Ferrari MIT, FTG Circuits
Gary Latta, SAIC
Gene Weiner, Weiner International Associates
George Milad, Uyemura International Corp.
George Millman Jr. MIT
Gerard O'Brien, Solderability Testing & Solutions, Inc.
Gerjan Diepstraten CIT, Vitronics Soltec
Gerold Mueller-Ensslin, GME Engineering & Consulting GMBH
Glenn Oliver, DuPont - RTP
Graham Naisbitt
Greg Smith, FCT Assembly, Inc.
Greg Wade, Indium Corporation
Gustaf Maertensson Ph.D., Chalmers University of Technology
Gustavo Arredondo, Para Tech Coating Inc.
Hamed El-Abd, WKK Distribution Ltd.
Hans Peter Tranitz Ph.D., Continental Automotive GmbH
Happy Holden
Helen Holder
JB Hollister, Apple Inc.
Jack Fisher, Interconnect Technology Analysis, Inc.
Jagadeesh Radhakrishnan, Intel Corporation
James Barnhart MIT, BEST Inc.
James Fuller, Sanmina Corporation
James Monarchio, TTM Technologies, Inc.
Jan Pedersen CIT, Elmatica AS
Jasbir Bath
Jason Fullerton, Alpha
Jason Gooden, Anthesis
Jason Keeping, Celestica
Jason Spera, Aegis Software
Jean-Pierre Theret, Dassault Systemes
Jeff Schake, ASM Assembly Systems
Jeff Shubrooks, Raytheon Company
Jeffrey Lee Sr. CIT, iST - Integrated Service Technology
Jeffrey Rupert, ScanCAD International, Inc.
Jennie Hwang Ph.D., Sc.D., H-Technologies Group
Jennifer Nguyen, JNK Engineering and Consulting LLC
Jerry Magera
Jesse Greenwood, Hazardous Print Consulting Inc.
Jim Vanden Hogen, Plexus Corporation
Jimmy Baccam CID+
Jimmy Villalvazo, InterLatin Inc.
Joan Vrtis Ph.D., Multek Inc.
Jody Cowan, Siemens Product Lifecycle Management Software Inc.
Joel Schrauben, Electro Scientific Industries, Inc.
Joerg Nolte, ERSA GmbH
John Ciba Jr.
John Coonrod, Rogers Corporation
John Fisher, Interconnect Technology Analysis, Inc.
John Lau Ph.D., ASM Assembly Materials Ltd.
John Mitchell Ph.D.
John Radman, NTS - Denver
John Sharp, Qorvo
John Waryold, HumiSeal Division of Chase Corporation
Jose Rios
Joseph Kane, BAE Systems Platform Solutions
Joseph Russeau
Julie Silk, Keysight Technologies Inc.
Jun Balangue Jr., Keysight Technologies
Junaid Shafaat, Schneider Electric
Karen McConnell CID, Northrop Grumman Corporation
Karen Tellefsen Ph.D., Alpha
Karl Sauter, Oracle America, Inc.
Katherine Griggs, Northrop Grumman
Kathy Johnston MIT, Raytheon Missile Systems
Kazuki Kammuri, Nippon Mining & Metals Co. Ltd
Keith Sellers, NTS - Baltimore
Keith Sweatman, Nihon Superior Co., Ltd.
Kevin Faulconer, Mayor of San Diego
Kevin Kusiak, Lockheed Martin Space Systems Company
Kevin Lewis, Ph.D., Quantum Silicones
Kristopher Moyer CID+, Aerojet Rocketdyne
Lance Auer, Raytheon Missile Systems
Lance Brack, Raytheon Missile Systems
Lars Bruno, Ericsson AB
Lee Hitchens, SCH Services Ltd.
Lenora Clark, MacDermid Enthone Electronics Solutions
Leo Lambert MIT, EPTAC Corporation
Leonard Allison, Engineered Materials Systems, Inc.
Linda Woody
Louis Ungar, Advanced Test Engineering Solutions, Inc.
Luis Lopez, Northrop Grumman Corporation
Lynnette Colby, Kester
Mahendra Gandhi
Mahesh Narayanaswamy, GE Healthcare
Mahi Duggirala, Flextronics International
Marc Peo, Heller Industries Inc.
Maria Durham, Indium Corporation
Maria Mosto, Siemens PLM Software, Inc,
Mark Buechner, BAE Systems
Mark Finstad CID, Flexible Circuit Technologies, Inc.
Mark Frimann, Texas Instruments Inc.
Mark Osborn, Colonial Circuits
Mark Routley, Gen3 Systems Limited
Martin Anselm Ph.D., Rochester Institute of Technology
Martin Goetz, Northrop Grumman Corporation
Martin Wickham, NPL
Mary Cummings
Mary Muller, Crane Aerospace & Electronics
MaryAlice Gill, Jabil Circuit, Inc.
Matt Kelly, IBM
Maxim Serebreni, DfR Solutions
Mayim Hoya Bialik
Michael Carano, RBP Chemical Technology, Inc.
Michael Creeden CID+, San Diego PCB, Inc.
Michael Ford, Mentor Graphics Corporation
Michael Jawitz, Orbital ATK
Michael Jouppi, Thermal Management, LLC.
Michael Kirschner, Design Chain Associates, LLC
Michael Miller
Michah Pledger
Mike Bixenman DBA, Kyzen Corporation
Mike Bryant, BGF Industries Inc.
Mike O’Reilly, Optomec
Mitchell Holtzer, Alpha
N. Nagaraj Ph.D., Papros, Inc.
Nancy Jaster, IPC
Neil Bolding, MacDermid Enthone Electronics Solutions
Neil Hubble, Akrometrix LLC
Nicholas Meeker
Nick Koop CID, TTM Technologies
Ning-Cheng Lee Ph.D., Indium Corporation
Norman Mier Jr. MIT, BEST Inc.
Pamela Gordon, Technology Forecasters
Pat Stroman CEPM, Sparton Corporation
Paul Semenza, Nextflex
Paul Wood, OK International
Paul Zutter, U.S. Army Aviation & Missile Command
Peter Bigelow, IMI Inc
Phil Zarrow, ITM Consulting Inc.
Philip Henault, Raytheon Company
Phillip McDermott, Quantum Silicones
Pierre Eckold, Robert Bosch GmbH
Prabjit Singh, IBM Corporation
Rainer Thueringer Ph.D., CID+, MIT, FED-Fachverband Elektronik Design e.V.
Rajesh Kumar, TTM Technologies
Randy Cherry, IPC
Randy Reed, R. Reed Consultancy LLC
Ravi Parthasarathy, ZESTRON Americas
Ray Prasad, Ray Prasad Consultancy Group
Reza Ghaffarian Ph.D., Jet Propulsion Laboratory
Richard Hartley CID, RHartley Enterprises
Richard Lies, Chemcut Corporation
Richard Rumas, Honeywell Canada
Richard Snogren
Rick Nichols, Atotech Deutschland GmbH
Rick Shanks, Pratt & Whitney
Robert Cooke, NASA Johnson Space Center
Robert Fornefeld MIT, L-3 Communications
Robert Peet, Seica Inc.
Robert Roush, OK International
Robert Rowland
Rolland Savage, Savage Consulting
Russell Nowland, Nokia
Russell Shepherd MIT, National Technical Systems Anaheim
Russell Steiner CID+, Allegion
Ryo Murakami Ph.D., Fujitsu Laboratories
S. Manian Ramkumar Ph.D., College of Applied Science and Technology
Saminda Dharmarathna Ph.D., MacDermid Enthone Electronics Solutions
Samuel LeBlanc, nScrypt Inc.
Scott Bowles, L-3 Fuzing and Ordnance Systems, Cincinnati
Scott McCurdy, Freedom CAD Services, Inc.
Scott Wischoffer, Fuji America Corporation
Sean Keating CIT
Seiya Kido, MEC Company, Ltd.
Shantanu Joshi, Koki Solder America Inc.
Shawn Stone, International Electronic Components, Inc
Sivakumar Vijayakumar, Keysight Technologies
Stephen Chavez CID+, UTC Aerospace Systems
Stephen Tisdale, Intel Corporation
Steve Butkovich, Test Innovation, LLC.
Steven Bowles, L-3 Fuzing and Ordnance Systems, Cincinnati
Steven Martell, Sonoscan Inc.
Steven Perng, Cisco Systems Inc.
Susy Webb CID, Design Science
Symon Franklin CIT, Custom Interconnect Ltd
Terry Fischer, Hitachi Chemical Co. America, Ltd.
Timothy Estes
Timothy O'Neill, AIM, Inc.
Tom Rogers, Polyonics
Tom Watson, Kimball Electronics
Tommy Fox, Optimal Electronics Corporation
Tony Senese, Panasonic Industrial Devices Sales Company of America (PIDSA)
Tord Dennis, WSP | Parsons Brinckerhoff
Torsten Schmidt, Hella KGaA Hueck & Co Operations Processes Development Metals
Udi Zamwel, Nano Dimension
Udo Welzel, Robert Bosch GmbH
Umut Tosun, ZESTRON Americas
Vasu Vasudevan
Vern Solberg, Solberg Technical Consulting
Vicka Hammill, Honeywell Inc. Air Transport Systems
W. James Hall, ITM Consulting Inc.
Walter Jager, ECD Compliance
William Kunkle
William Loving, ScanCAD International, Inc.
William Ortloff Sr., Raytheon Company
Xiaoning Ye, Intel Corporation
YongJin Choi, Hewlett-Packard Enterprise
Zenaida Valianu MIT
Location
10
11A
11B
12
13
14A
14B
15A
17B
18
1A
1B
2
3
4
5A
5B
6A
6C
6D
6E
6F
7A
7B
8
9
Booth 4135
Booth 723
Booth 727
Outside of 6A
San Diego PCB
San Diego Wine and Culinary Center
West Terrace(located on the upper level)
General Committee
Assembly and Joining
Base Materials
Cleaning and Coating
Electronic Documentation Technology
Electronic Product Data Description
Embedded Devices
Environment, Health & Safety (EHS)
Fabrication Processes
Flexible and Rigid-Flex Printed Boards
High Speed/High Frequency Interconnections
Management
Managment
Packaged Electronic Components
Printed Board Design Technology
Printed Electronics
Process Control
Product Assurance
Product Reliability
Rigid Printed Boards
Terms and Definitions
Testing
Level
Advanced
Basic
Intermediate
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Programs: 61 - 70 of 256
Programs per Page
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Mon, Feb 13, 2017 - 1:30 PM to 3:00 PM
3-12D: Woven Glass Reinforcement Task Group
Presenter/Committee Chair: Mike Bryant, Vice President R&D, BGF Industries Inc.
Seminar Type: Standards Development Committee Meeting
Track: PCB Fabrication and Materials
General Committee: Base Materials
Location: 11A
Mon, Feb 13, 2017 - 1:30 PM to 3:00 PM
5-32A: Ion Chromatography/Ionic Conductivity Task Group-
Canceled
This meeting has been canceled
Presenter/Committee Chair: John Radman, Senior Applications Engineer, NTS - Denver
Presenter/Committee Chair: Joseph Russeau
Seminar Type: Standards Development Committee Meeting
General Committee: Cleaning and Coating
Mon, Feb 13, 2017 - 1:30 PM to 3:00 PM
7-31M: Fiber Optic Cable Acceptability Task Group
Presenter/Committee Chair: Robert Cooke, Aerospace Engineer, NASA Johnson Space Center
Presenter/Committee Chair: Sean Keating CIT
Seminar Type: Standards Development Committee Meeting
Track: Quality, Reliability and Test
General Committee: Product Assurance
Location: 17B
Mon, Feb 13, 2017 - 1:30 PM to 5:00 PM
B-10A: Joint Meeting: Plastic Chip Carrier Cracking Task Group and JEDEC JC-14.1
Presenter/Committee Chair: Steven Martell, Advanced Applications Support Manager, Sonoscan Inc.
Seminar Type: Standards Development Committee Meeting
General Committee: Packaged Electronic Components
Location: 12
Mon, Feb 13, 2017 - 1:30 PM to 3:00 PM
D-21: High Speed/High Frequency Design Subcommittee
Presenter/Committee Chair: Scott Bowles, Staff Engineer - Printed Board SME, L-3 Fuzing and Ordnance Systems, Cincinnati
Presenter/Committee Chair: Dana Korf
Seminar Type: Standards Development Committee Meeting
Track: Design
General Committee: High Speed/High Frequency Interconnections
Location: 9
Mon, Feb 13, 2017 - 2:00 PM to 5:00 PM
PD19: DFX-Design For Excellence: DFM, DFA, DFT and more - Part 2
Presenter/Committee Chair: Dale Lee, Senior Staff DFX Strategy Engineer, Plexus Corp.
Seminar Type: Professional Development
Track: Design
Level: Intermediate
Location: 1A
PD19_APEXEXPO17_DaleLee
Mon, Feb 13, 2017 - 2:00 PM to 5:00 PM
PD20: PCB Fabrication Basics: Process and Specifications
Presenter/Committee Chair: Jim Vanden Hogen, Sr. Designer, Plexus Corporation
Seminar Type: Professional Development
Track: PCB Fabrication and Materials
Level: Basic
Location: 1B
PD20_APEXEXPO17_Jim Vanden Hogen
Mon, Feb 13, 2017 - 2:00 PM to 5:00 PM
PD21: Power Distribution and Decoupling
Presenter/Committee Chair: Richard Hartley CID, Sr. Principal Engineer, RHartley Enterprises
Seminar Type: Professional Development
Track: Design
Level: Intermediate
Location: 2
PD21_APEXEXPO17_Rick Hartley
Mon, Feb 13, 2017 - 2:00 PM to 5:00 PM
PD22: 3D Packaging and Fan-Out Wafer-Level Packaging
Presenter/Committee Chair: John Lau Ph.D., Sr. Technical Advisor, ASM Assembly Materials Ltd.
Seminar Type: Professional Development
Track: Emerging Technologies
Level: Intermediate
Location: 3
PD22_APEXEXPO17_John Lau
Mon, Feb 13, 2017 - 2:00 PM to 5:00 PM
PD23: Reliability: Failure Analysis for Improvement
Presenter/Committee Chair: Bhanu Sood, Commodity Risk Assessment Engineer (PCB), NASA Goddard Space Flight Center
Seminar Type: Professional Development
Track: Quality, Reliability and Test
Level: Intermediate
Location: 4
PD23_APEXEXPO17_Bhanu Sood
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Programs: 61 - 70 of 256
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