APEX EXPO 2017 Agenda Planner - Programs

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IPC APEX EXPO 2017

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	Mon, Feb 13, 2017 - 8:00 AM to 10:00 AM D-36A: IPC-PCQR2 DAUG -(By Invitation) Presenter/Committee Chair: David Wolf, VP - Technical Marketing, Conductor Analysis Technologies, Inc. Presenter/Committee Chair: Timothy Estes Seminar Type: Standards Development Committee Meeting Track: Quality, Reliability and Test General Committee: Rigid Printed Boards Location: 10
	Mon, Feb 13, 2017 - 8:00 AM to 12:00 PM E-21/E-22: Joint Meeting - EMS Intellectual Property and PC Fab Intellectual Property Subcommittee Presenter/Committee Chair: Dennis Fritz Presenter/Committee Chair: Pat Stroman CEPM, Supplier Quality Engineer, Sparton Corporation Presenter/Committee Chair: Rajesh Kumar, VP of Technology Solutions, C&C, TTM Technologies Seminar Type: Standards Development Committee Meeting Track: Supply Chain/Business Issues General Committee: Management Location: 17B
	Mon, Feb 13, 2017 - 8:00 AM to 5:00 PM EMS Executive Management Meeting Seminar Type: Management Location: 6D APEX Presentation 2017_1.31.16 CBA EMS Mgmt IPC APEX 2017 no notes Workshop Lean IPC-Expo 2016 Steve Williams APEX EMS_John Myers
	Mon, Feb 13, 2017 - 8:00 AM to 12:00 PM IPC/WHMA-A-620 Space Electronic Assemblies Addendum Task Group Seminar Type: Standards Development Committee Meeting Location: 15A
	Mon, Feb 13, 2017 - 8:00 AM to 5:00 PM PCB Executive Forum Presented by IPC Hall of Fame Presenter/Committee Chair: John Mitchell Ph.D. Presenter/Committee Chair: Richard Lies, President, Chemcut Corporation Presenter/Committee Chair: Chetan Shah, President, Flex Interconnect Presenter/Committee Chair: Shawn Stone, President, International Electronic Components, Inc Presenter/Committee Chair: Peter Bigelow, President, IMI Inc Presenter/Committee Chair: Mark Osborn, President, Colonial Circuits Presenter/Committee Chair: Jack Fisher, President, Interconnect Technology Analysis, Inc. Presenter/Committee Chair: Alan Rae Ph.D., Executive Director, IncubatorWorks Presenter/Committee Chair: Paul Semenza, Nextflex Presenter/Committee Chair: Hamed El-Abd, President, WKK Distribution Ltd. Presenter/Committee Chair: Dan Feinberg, Owner, Fein-Line Associates Presenter/Committee Chair: Joan Vrtis Ph.D., CTO, Multek Inc. Presenter/Committee Chair: Brad Bourne, President & CEO, FTG Circuits Presenter/Committee Chair: Kevin Faulconer, Mayor of San diego, Mayor of San Diego Presenter/Committee Chair: Gene Weiner, President, Weiner International Associates Seminar Type: Management Location: 6C Fisher, Jack - Panel Discussion Moderator Semenza, Paul - Overview of NextFlex Institute Vrtis, Joan - Multek - Accelerating Innovation Lies, Rick - Chemcut-Panelist Bigelow, Peter - IMI - Panelist Bourne, Brad - FTG - How We Did It Osborne, Mark - Colonial Circuits - Panelist Feinberg, Dan - FeinLine - Disruptive Technologies Rae, Alan - DIscovering and Commercializing New Products Dept of Commerce - State of the US Bare Board Industry Dept of Commerce list of publications 02 03 17 Agenda El-Abd, Hamed - Part 1 - WKK El-Abd, Hamed - Part 2 - WKK Stone, Shawn - IEC - Panelist
	Mon, Feb 13, 2017 - 9:00 AM to 5:00 PM 5-22A/7-31B: Synergy Meeting - J-STD-001 & IPC-A-610 Task Groups Presenter/Committee Chair: Constantino Gonzalez MIT, President/EMS-OEM Consultant, ACME Training & Consulting Presenter/Committee Chair: Mary Muller, Sr. Supplier Quality Engineer, Crane Aerospace & Electronics Presenter/Committee Chair: Kathy Johnston MIT, Q&MA Mgr., Raytheon Missile Systems Presenter/Committee Chair: Daniel Foster CIT, Quality Assurance Specialist, Missile Defense Agency Presenter/Committee Chair: Robert Fornefeld MIT, Supervisor Master IPC Trainer, L-3 Communications Seminar Type: Standards Development Committee Meeting Track: Assembly Processes for Lead Free and Tin-Lead General Committee: Assembly and Joining Location: 7A
	Mon, Feb 13, 2017 - 9:00 AM to 12:00 PM PD13: DFX-Design For Excellence: DFM, DFA, DFT and more - Part 1 Presenter/Committee Chair: Dale Lee, Senior Staff DFX Strategy Engineer, Plexus Corp. Seminar Type: Professional Development Track: Design Level: Intermediate Location: 1A PD13_APEXEXPO17_DaleLee
	Mon, Feb 13, 2017 - 9:00 AM to 12:00 PM PD14: Selective Soldering: Enhanced Reliability, Quality, and Flexibility with Closed-Loop Process Control Presenter/Committee Chair: Bob Klenke, Principal Consultant, ITM Consulting Inc. Seminar Type: Professional Development Track: Assembly Processes for Lead Free and Tin-Lead Level: Intermediate Location: 1B PD14_APEXEXPO17_Bob Klenke
	Mon, Feb 13, 2017 - 9:00 AM to 12:00 PM PD15: Stencil Printing Process and Solder Paste Inspection: A Comprehensive Review - for Increased Efficiency Presenter/Committee Chair: S. Manian Ramkumar Ph.D., Dean, College of Applied Science and Technology Seminar Type: Professional Development Track: Assembly Processes for Lead Free and Tin-Lead Level: Intermediate Location: 2 PD15_APEXEXPO17_S.Manian Ramkumar
	Mon, Feb 13, 2017 - 9:00 AM to 12:00 PM PD16: Cleaning and Contamination Control for Reliability Presenter/Committee Chair: Mike Bixenman DBA, CTO, Kyzen Corporation Seminar Type: Professional Development Track: Cleaning/Coating/Contamination Level: Intermediate Location: 3 PD16_APEXEXPO17_Mike Bixenman

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Programs: 41 - 50 of 256

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