APEX EXPO 2017 Agenda Planner - Programs

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IPC APEX EXPO 2017

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Programs: 31 - 40 of 256

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	Sun, Feb 12, 2017 - 4:30 PM to 6:00 PM CCC: Committee Chairman Council (By Invitation) Seminar Type: Management General Committee: Management Location: 15A
	Sun, Feb 12, 2017 - 6:00 PM to 7:00 PM IPC Committee Chairmen's Reception(By Invitation ) Seminar Type: Standards Development Committee Meeting Location: West Terrace(located on the upper level)
	Mon, Feb 13, 2017 - 7:30 AM to 1:00 PM Design Forum Presenter/Committee Chair: Gary Carter, Independent Consultant Presenter/Committee Chair: Happy Holden, Director of Electronics-RETIRED Presenter/Committee Chair: Daniel Gamota, President, Printovate Technologies, Inc. Presenter/Committee Chair: Gary Ferrari MIT, Director of Technical Support, FTG Circuits Presenter/Committee Chair: Stephen Chavez CID+, Lead Electricial Designer, CID+, UTC Aerospace Systems Presenter/Committee Chair: Michael Jouppi, President, Thermal Management, LLC. Presenter/Committee Chair: Edward Acheson, Principle Product Engineer, Cadence Design Systems, Inc. Presenter/Committee Chair: Ariel Zauer, Frontline PCB Solutions Seminar Type: Designer Track: Design Location: 6F Gary Ferrari_IPC 2017 DC Update_APEXEXPO2017 Happy Holden_APEXEXPO2017_New Innovations for Density Mike Jouppi_Managing PWB Conductor Power and Parallel Conductors_APEXEXPO17 Stephen Chavez_Incorporating IPC Standards in Your Daily World_APEXEXPO17 Gary J. Carter_DMDII_15-05_APEXEXPO201 7 Dan Gamota_Design Forum_APEX2017
	Mon, Feb 13, 2017 - 8:00 AM to 5:00 PM 2-18B: Materials Declaration Task Group Presenter/Committee Chair: Mark Frimann, SC Product Stewardship Mng, Texas Instruments Inc. Presenter/Committee Chair: Aidan Turnbull Ph.D., Managing Director, BomCheck Seminar Type: Standards Development Committee Meeting Track: Environmental Issues and Compliance General Committee: Electronic Product Data Description Location: 14A
	Mon, Feb 13, 2017 - 8:00 AM to 12:00 PM 3-11: Laminate/Prepreg Materials Subcommittee Presenter/Committee Chair: Doug Sober, Founder/President, Essex Technologies Group Inc. Presenter/Committee Chair: Tony Senese, Manager, Business Development, Panasonic Industrial Devices Sales Company of America (PIDSA) Seminar Type: Standards Development Committee Meeting Track: PCB Fabrication and Materials General Committee: Base Materials Location: 11A
	Mon, Feb 13, 2017 - 8:00 AM to 10:00 AM 5-21H: Bottom Termination Components (BTC) Task Group Presenter/Committee Chair: Ray Prasad, Consultant, Ray Prasad Consultancy Group Presenter/Committee Chair: Matt Kelly, IBM Seminar Type: Standards Development Committee Meeting Track: Assembly Processes for Lead Free and Tin-Lead General Committee: Assembly and Joining Location: 12
	Mon, Feb 13, 2017 - 8:00 AM to 10:00 AM 5-23B: Component and Wire Solderability Specification Task Group Presenter/Committee Chair: David Hillman, Principal Material & Process Engineer, Rockwell Collins Presenter/Committee Chair: Dennis Fritz Seminar Type: Standards Development Committee Meeting Track: Assembly Processes for Lead Free and Tin-Lead General Committee: Assembly and Joining Location: 11B
	Mon, Feb 13, 2017 - 8:00 AM to 10:00 AM 5-32C: Bare Board Cleanliness Assessment Task Group-CANCELLED Presenter/Committee Chair: David Lober, Process Chemist, Kyzen Corporation Presenter/Committee Chair: Joseph Russeau Seminar Type: Standards Development Committee Meeting Track: Cleaning/Coating/Contamination General Committee: Cleaning and Coating Location: 8
	Mon, Feb 13, 2017 - 8:00 AM to 9:00 AM 7-30: Product Assurance Committee - By Invitation Only Presenter/Committee Chair: Debbie Wade MIT Presenter/Committee Chair: Robert Cooke, Aerospace Engineer, NASA Johnson Space Center Seminar Type: Standards Development Committee Meeting Track: Quality, Reliability and Test General Committee: Product Assurance Location: 7A
	Mon, Feb 13, 2017 - 8:00 AM to 10:00 AM D-35: Printed Board Storage and Handling Subcommittee Presenter/Committee Chair: Don Dupriest, LM Fellow, Lockheed Martin Missiles & Fire Control Presenter/Committee Chair: Joseph Kane, Sr. Principal Engineer, BAE Systems Platform Solutions Seminar Type: Standards Development Committee Meeting Track: PCB Fabrication and Materials General Committee: Rigid Printed Boards Location: 9

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Programs: 31 - 40 of 256

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