APEX EXPO 2017 Agenda Planner

Mon, Feb 13, 2017 - 1:30 PM to 3:00 PM 3-12D: Woven Glass Reinforcement Task Group Presenter/Committee Chair: Mike Bryant, Vice President R&D, BGF Industries Inc. Seminar Type: Standards Development Committee Meeting Track: PCB Fabrication and Materials General Committee: Base Materials Location: 11A
Mon, Feb 13, 2017 - 1:30 PM to 3:00 PM 5-32A: Ion Chromatography/Ionic Conductivity Task Group-Canceled This meeting has been canceled Presenter/Committee Chair: John Radman, Senior Applications Engineer, NTS - Denver Presenter/Committee Chair: Joseph Russeau Seminar Type: Standards Development Committee Meeting General Committee: Cleaning and Coating
Mon, Feb 13, 2017 - 1:30 PM to 3:00 PM 7-31M: Fiber Optic Cable Acceptability Task Group Presenter/Committee Chair: Robert Cooke, Aerospace Engineer, NASA Johnson Space Center Presenter/Committee Chair: Sean Keating CIT Seminar Type: Standards Development Committee Meeting Track: Quality, Reliability and Test General Committee: Product Assurance Location: 17B
Mon, Feb 13, 2017 - 1:30 PM to 5:00 PM B-10A: Joint Meeting: Plastic Chip Carrier Cracking Task Group and JEDEC JC-14.1 Presenter/Committee Chair: Steven Martell, Advanced Applications Support Manager, Sonoscan Inc. Seminar Type: Standards Development Committee Meeting General Committee: Packaged Electronic Components Location: 12
Mon, Feb 13, 2017 - 1:30 PM to 3:00 PM D-21: High Speed/High Frequency Design Subcommittee Presenter/Committee Chair: Scott Bowles, Staff Engineer - Printed Board SME, L-3 Fuzing and Ordnance Systems, Cincinnati Presenter/Committee Chair: Dana Korf Seminar Type: Standards Development Committee Meeting Track: Design General Committee: High Speed/High Frequency Interconnections Location: 9
Mon, Feb 13, 2017 - 2:00 PM to 5:00 PM PD19: DFX-Design For Excellence: DFM, DFA, DFT and more - Part 2 Presenter/Committee Chair: Dale Lee, Senior Staff DFX Strategy Engineer, Plexus Corp. Seminar Type: Professional Development Track: Design Level: Intermediate Location: 1A PD19_APEXEXPO17_DaleLee
Mon, Feb 13, 2017 - 2:00 PM to 5:00 PM PD20: PCB Fabrication Basics: Process and Specifications Presenter/Committee Chair: Jim Vanden Hogen, Sr. Designer, Plexus Corporation Seminar Type: Professional Development Track: PCB Fabrication and Materials Level: Basic Location: 1B PD20_APEXEXPO17_Jim Vanden Hogen
Mon, Feb 13, 2017 - 2:00 PM to 5:00 PM PD21: Power Distribution and Decoupling Presenter/Committee Chair: Richard Hartley CID, Sr. Principal Engineer, RHartley Enterprises Seminar Type: Professional Development Track: Design Level: Intermediate Location: 2 PD21_APEXEXPO17_Rick Hartley
Mon, Feb 13, 2017 - 2:00 PM to 5:00 PM PD22: 3D Packaging and Fan-Out Wafer-Level Packaging Presenter/Committee Chair: John Lau Ph.D., Sr. Technical Advisor, ASM Assembly Materials Ltd. Seminar Type: Professional Development Track: Emerging Technologies Level: Intermediate Location: 3 PD22_APEXEXPO17_John Lau
Mon, Feb 13, 2017 - 2:00 PM to 5:00 PM PD23: Reliability: Failure Analysis for Improvement Presenter/Committee Chair: Bhanu Sood, Commodity Risk Assessment Engineer (PCB), NASA Goddard Space Flight Center Seminar Type: Professional Development Track: Quality, Reliability and Test Level: Intermediate Location: 4 PD23_APEXEXPO17_Bhanu Sood