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Date
Sun, Feb 12th, 2017
Mon, Feb 13th, 2017
Thu, Feb 16th, 2017
Type
Professional Development
Track
Assembly Processes for Lead Free and Tin-Lead
Cleaning/Coating/Contamination
Design
Emerging Technologies
PCB Fabrication and Materials
Quality, Reliability and Test
Speaker
Ah Feau Ng, TechMent Consultancy Sdn. Bhd.
Bhanu Sood, NASA Goddard Space Flight Center
Bob Klenke, ITM Consulting Inc.
Dale Lee, Plexus Corp.
Douglas Pauls, Rockwell Collins
Gustaf Maertensson Ph.D., Chalmers University of Technology
Happy Holden
James Barnhart MIT, BEST Inc.
Jennie Hwang Ph.D., Sc.D., H-Technologies Group
Jim Vanden Hogen, Plexus Corporation
John Lau Ph.D., ASM Assembly Materials Ltd.
Lee Hitchens, SCH Services Ltd.
Louis Ungar, Advanced Test Engineering Solutions, Inc.
Mark Finstad CID, Flexible Circuit Technologies, Inc.
Martin Anselm Ph.D., Rochester Institute of Technology
Michael Carano, RBP Chemical Technology, Inc.
Michael Creeden CID+, San Diego PCB, Inc.
Mike Bixenman DBA, Kyzen Corporation
Nick Koop CID, TTM Technologies
Ning-Cheng Lee Ph.D., Indium Corporation
Norman Mier Jr. MIT, BEST Inc.
Phil Zarrow, ITM Consulting Inc.
Rainer Thueringer Ph.D., CID+, MIT, FED-Fachverband Elektronik Design e.V.
Ray Prasad, Ray Prasad Consultancy Group
Richard Hartley CID, RHartley Enterprises
S. Manian Ramkumar Ph.D., College of Applied Science and Technology
Susy Webb CID, Design Science
Umut Tosun, ZESTRON Americas
Vern Solberg, Solberg Technical Consulting
W. James Hall, ITM Consulting Inc.
Location
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11B
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5A
7B
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9
Level
Advanced
Basic
Intermediate
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Sun, Feb 12, 2017 - 9:00 AM to 12:00 PM
PD01: Residue Assessment, Impact and Control in Manufacturing High-Performance Products
Presenter/Committee Chair: Douglas Pauls, Principle Materials Process Engineer, Rockwell Collins
Seminar Type: Professional Development
Track: Cleaning/Coating/Contamination
Level: Intermediate
Location: 1A
PD01_APEXEXPO17_Doug Pauls
ROSE_Alternative_Proposal_Draf t_7Feb17
ROSE Alternative Companion paper Draft 18 Nov 2016
Summary of Papers at Cleaning and Coating Conferences Rev A
Sun, Feb 12, 2017 - 9:00 AM to 12:00 PM
PD02: Choosing Solders for the New Era - Part 1
Presenter/Committee Chair: Ning-Cheng Lee Ph.D., VP of Technology, Indium Corporation
Seminar Type: Professional Development
Track: Assembly Processes for Lead Free and Tin-Lead
Level: Advanced
Location: 1B
PD02_APEXEXPO17_Ning-Chen Lee
Sun, Feb 12, 2017 - 9:00 AM to 12:00 PM
PD03: Defect Analysis and Process Troubleshooting - Part 1
Presenter/Committee Chair: S. Manian Ramkumar Ph.D., Dean, College of Applied Science and Technology
Seminar Type: Professional Development
Track: Assembly Processes for Lead Free and Tin-Lead
Level: Intermediate
Location: 2
PD03_APEXEXPO17_S.Manian Ramkumar
Sun, Feb 12, 2017 - 9:00 AM to 12:00 PM
PD04: Design and Assembly Process Principles for Flexible and Rigid Flex Circuits
Presenter/Committee Chair: Vern Solberg, Sr Consultant, Solberg Technical Consulting
Seminar Type: Professional Development
Track: Design
Level: Intermediate
Location: 3
PD04_APEXEXPO17_Vern Solberg
Sun, Feb 12, 2017 - 9:00 AM to 12:00 PM
PD05: Advanced PCB Troubleshooting - Part 1
Presenter/Committee Chair: Michael Carano, VP Technology & Business Development, RBP Chemical Technology, Inc.
Seminar Type: Professional Development
Track: PCB Fabrication and Materials
Level: Advanced
Location: 4
PD05_APEXEXPO17_Michael Carano
Sun, Feb 12, 2017 - 9:00 AM to 12:00 PM
PD06: EMC and High Speed Signal: Fundamental Considerations
Presenter/Committee Chair: Rainer Thueringer Ph.D., CID+, MIT, Chairman of the Board and Division Education & Training, FED-Fachverband Elektronik Design e.V.
Seminar Type: Professional Development
Track: Design
Level: Intermediate
Location: 5A
PD06_APEXEXPO17_Rainer Thueringer
Sun, Feb 12, 2017 - 2:00 PM to 5:00 PM
PD07: Conformal Coating Life Cycle: Designing for Coating, Selecting the Right Process and Solving the Problems
Presenter/Committee Chair: Lee Hitchens, Technical Director, SCH Services Ltd.
Seminar Type: Professional Development
Track: Cleaning/Coating/Contamination
Level: Advanced
Location: 1A
PD07_APEXEXPO17_Lee Hitchens
Sun, Feb 12, 2017 - 2:00 PM to 5:00 PM
PD08: Choosing Solders for the New Era - Part 2
Presenter/Committee Chair: Ning-Cheng Lee Ph.D., VP of Technology, Indium Corporation
Seminar Type: Professional Development
Track: Assembly Processes for Lead Free and Tin-Lead
Level: Advanced
Location: 1B
PD08_APEXEXPO17_Ning-Chen Lee
Sun, Feb 12, 2017 - 2:00 PM to 5:00 PM
PD09: Defect Analysis and Process Troubleshooting - Part 2
Presenter/Committee Chair: S. Manian Ramkumar Ph.D., Dean, College of Applied Science and Technology
Seminar Type: Professional Development
Track: Assembly Processes for Lead Free and Tin-Lead
Level: Intermediate
Location: 2
PD09_APEXEXPO17_S.Manian Ramkumar
Sun, Feb 12, 2017 - 2:00 PM to 5:00 PM
PD10: Test: Cost-Effective Strategies for Improved Time to Market with DFT (Design For Testability) and JTAG/Boundary Scan
Presenter/Committee Chair: Louis Ungar, President, Advanced Test Engineering Solutions, Inc.
Seminar Type: Professional Development
Track: Quality, Reliability and Test
Level: Basic
Location: 3
PD10 _APEXEXPO17_Louis Ungar
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