APEX EXPO 2017 Agenda Planner

Sun, Feb 12, 2017 - 9:00 AM to 12:00 PM PD01: Residue Assessment, Impact and Control in Manufacturing High-Performance Products Presenter/Committee Chair: Douglas Pauls, Principle Materials Process Engineer, Rockwell Collins Seminar Type: Professional Development Track: Cleaning/Coating/Contamination Level: Intermediate Location: 1A PD01_APEXEXPO17_Doug Pauls ROSE_Alternative_Proposal_Draf t_7Feb17 ROSE Alternative Companion paper Draft 18 Nov 2016 Summary of Papers at Cleaning and Coating Conferences Rev A
Sun, Feb 12, 2017 - 9:00 AM to 12:00 PM PD02: Choosing Solders for the New Era - Part 1 Presenter/Committee Chair: Ning-Cheng Lee Ph.D., VP of Technology, Indium Corporation Seminar Type: Professional Development Track: Assembly Processes for Lead Free and Tin-Lead Level: Advanced Location: 1B PD02_APEXEXPO17_Ning-Chen Lee
Sun, Feb 12, 2017 - 9:00 AM to 12:00 PM PD03: Defect Analysis and Process Troubleshooting - Part 1 Presenter/Committee Chair: S. Manian Ramkumar Ph.D., Dean, College of Applied Science and Technology Seminar Type: Professional Development Track: Assembly Processes for Lead Free and Tin-Lead Level: Intermediate Location: 2 PD03_APEXEXPO17_S.Manian Ramkumar
Sun, Feb 12, 2017 - 9:00 AM to 12:00 PM PD04: Design and Assembly Process Principles for Flexible and Rigid Flex Circuits Presenter/Committee Chair: Vern Solberg, Sr Consultant, Solberg Technical Consulting Seminar Type: Professional Development Track: Design Level: Intermediate Location: 3 PD04_APEXEXPO17_Vern Solberg
Sun, Feb 12, 2017 - 9:00 AM to 12:00 PM PD05: Advanced PCB Troubleshooting - Part 1 Presenter/Committee Chair: Michael Carano, VP Technology & Business Development, RBP Chemical Technology, Inc. Seminar Type: Professional Development Track: PCB Fabrication and Materials Level: Advanced Location: 4 PD05_APEXEXPO17_Michael Carano
Sun, Feb 12, 2017 - 9:00 AM to 12:00 PM PD06: EMC and High Speed Signal: Fundamental Considerations Presenter/Committee Chair: Rainer Thueringer Ph.D., CID+, MIT, Chairman of the Board and Division Education & Training, FED-Fachverband Elektronik Design e.V. Seminar Type: Professional Development Track: Design Level: Intermediate Location: 5A PD06_APEXEXPO17_Rainer Thueringer
Sun, Feb 12, 2017 - 2:00 PM to 5:00 PM PD07: Conformal Coating Life Cycle: Designing for Coating, Selecting the Right Process and Solving the Problems Presenter/Committee Chair: Lee Hitchens, Technical Director, SCH Services Ltd. Seminar Type: Professional Development Track: Cleaning/Coating/Contamination Level: Advanced Location: 1A PD07_APEXEXPO17_Lee Hitchens
Sun, Feb 12, 2017 - 2:00 PM to 5:00 PM PD08: Choosing Solders for the New Era - Part 2 Presenter/Committee Chair: Ning-Cheng Lee Ph.D., VP of Technology, Indium Corporation Seminar Type: Professional Development Track: Assembly Processes for Lead Free and Tin-Lead Level: Advanced Location: 1B PD08_APEXEXPO17_Ning-Chen Lee
Sun, Feb 12, 2017 - 2:00 PM to 5:00 PM PD09: Defect Analysis and Process Troubleshooting - Part 2 Presenter/Committee Chair: S. Manian Ramkumar Ph.D., Dean, College of Applied Science and Technology Seminar Type: Professional Development Track: Assembly Processes for Lead Free and Tin-Lead Level: Intermediate Location: 2 PD09_APEXEXPO17_S.Manian Ramkumar
Sun, Feb 12, 2017 - 2:00 PM to 5:00 PM PD10: Test: Cost-Effective Strategies for Improved Time to Market with DFT (Design For Testability) and JTAG/Boundary Scan Presenter/Committee Chair: Louis Ungar, President, Advanced Test Engineering Solutions, Inc. Seminar Type: Professional Development Track: Quality, Reliability and Test Level: Basic Location: 3 PD10 _APEXEXPO17_Louis Ungar
Sun, Feb 12, 2017 - 2:00 PM to 5:00 PM PD11: Advanced PCB Troubleshooting - Part 2 Presenter/Committee Chair: Michael Carano, VP Technology & Business Development, RBP Chemical Technology, Inc. Seminar Type: Professional Development Track: PCB Fabrication and Materials Level: Advanced Location: 4 PD11_APEXEXPO17_Michael Carano
Sun, Feb 12, 2017 - 2:00 PM to 5:00 PM PD12: Building the Bridge Between Design and Manufacturing Presenter/Committee Chair: Susy Webb CID, PCB Designer, Design Science Seminar Type: Professional Development Track: Design Level: Intermediate Location: 5A PD12_APEXEXPO17_Susy Webb
Mon, Feb 13, 2017 - 9:00 AM to 12:00 PM PD13: DFX-Design For Excellence: DFM, DFA, DFT and more - Part 1 Presenter/Committee Chair: Dale Lee, Senior Staff DFX Strategy Engineer, Plexus Corp. Seminar Type: Professional Development Track: Design Level: Intermediate Location: 1A PD13_APEXEXPO17_DaleLee
Mon, Feb 13, 2017 - 9:00 AM to 12:00 PM PD14: Selective Soldering: Enhanced Reliability, Quality, and Flexibility with Closed-Loop Process Control Presenter/Committee Chair: Bob Klenke, Principal Consultant, ITM Consulting Inc. Seminar Type: Professional Development Track: Assembly Processes for Lead Free and Tin-Lead Level: Intermediate Location: 1B PD14_APEXEXPO17_Bob Klenke
Mon, Feb 13, 2017 - 9:00 AM to 12:00 PM PD15: Stencil Printing Process and Solder Paste Inspection: A Comprehensive Review - for Increased Efficiency Presenter/Committee Chair: S. Manian Ramkumar Ph.D., Dean, College of Applied Science and Technology Seminar Type: Professional Development Track: Assembly Processes for Lead Free and Tin-Lead Level: Intermediate Location: 2 PD15_APEXEXPO17_S.Manian Ramkumar
Mon, Feb 13, 2017 - 9:00 AM to 12:00 PM PD16: Cleaning and Contamination Control for Reliability Presenter/Committee Chair: Mike Bixenman DBA, CTO, Kyzen Corporation Seminar Type: Professional Development Track: Cleaning/Coating/Contamination Level: Intermediate Location: 3 PD16_APEXEXPO17_Mike Bixenman
Mon, Feb 13, 2017 - 9:00 AM to 12:00 PM PD17: Advanced Rework: Hands-on BGA Reballing and Leadless Devices Presenter/Committee Chair: Norman Mier Jr. MIT, Senior Technical Trainer, BEST Inc. Presenter/Committee Chair: James Barnhart MIT, Master Instructor/Course Developer, BEST Inc. Seminar Type: Professional Development Track: Assembly Processes for Lead Free and Tin-Lead Level: Intermediate Location: 4 PD17_APEXEXPO17_Norman Mier_Jim Barnhart
Mon, Feb 13, 2017 - 9:00 AM to 12:00 PM PD18: Preventing Defects and Product Failures Presenter/Committee Chair: Jennie Hwang Ph.D., Sc.D., CEO, H-Technologies Group Seminar Type: Professional Development Track: Assembly Processes for Lead Free and Tin-Lead Level: Intermediate Location: 5A PD18_APEXEXPO17_Jennie Hwang
Mon, Feb 13, 2017 - 2:00 PM to 5:00 PM PD19: DFX-Design For Excellence: DFM, DFA, DFT and more - Part 2 Presenter/Committee Chair: Dale Lee, Senior Staff DFX Strategy Engineer, Plexus Corp. Seminar Type: Professional Development Track: Design Level: Intermediate Location: 1A PD19_APEXEXPO17_DaleLee
Mon, Feb 13, 2017 - 2:00 PM to 5:00 PM PD20: PCB Fabrication Basics: Process and Specifications Presenter/Committee Chair: Jim Vanden Hogen, Sr. Designer, Plexus Corporation Seminar Type: Professional Development Track: PCB Fabrication and Materials Level: Basic Location: 1B PD20_APEXEXPO17_Jim Vanden Hogen
Mon, Feb 13, 2017 - 2:00 PM to 5:00 PM PD21: Power Distribution and Decoupling Presenter/Committee Chair: Richard Hartley CID, Sr. Principal Engineer, RHartley Enterprises Seminar Type: Professional Development Track: Design Level: Intermediate Location: 2 PD21_APEXEXPO17_Rick Hartley
Mon, Feb 13, 2017 - 2:00 PM to 5:00 PM PD22: 3D Packaging and Fan-Out Wafer-Level Packaging Presenter/Committee Chair: John Lau Ph.D., Sr. Technical Advisor, ASM Assembly Materials Ltd. Seminar Type: Professional Development Track: Emerging Technologies Level: Intermediate Location: 3 PD22_APEXEXPO17_John Lau
Mon, Feb 13, 2017 - 2:00 PM to 5:00 PM PD23: Reliability: Failure Analysis for Improvement Presenter/Committee Chair: Bhanu Sood, Commodity Risk Assessment Engineer (PCB), NASA Goddard Space Flight Center Seminar Type: Professional Development Track: Quality, Reliability and Test Level: Intermediate Location: 4 PD23_APEXEXPO17_Bhanu Sood
Mon, Feb 13, 2017 - 2:00 PM to 5:00 PM PD24: Flexible Circuits from Design through Test: Lessons Learned Presenter/Committee Chair: Mark Finstad CID, Senior Appication Engineer, Flexible Circuit Technologies, Inc. Presenter/Committee Chair: Nick Koop CID, Sr. Field Application Engineer, TTM Technologies Seminar Type: Professional Development Track: Design Level: Intermediate Location: 5A PD24_APEXEXPO17_Mark Finstad_Nick Koop
Thu, Feb 16, 2017 - 9:00 AM to 12:00 PM PD25: Best Practices for Improving Manufacturing Productivity - Part 1 Presenter/Committee Chair: W. James Hall, Principal Consultant, ITM Consulting Inc. Presenter/Committee Chair: Phil Zarrow, President and Principal Consultant, ITM Consulting Inc. Seminar Type: Professional Development Track: Assembly Processes for Lead Free and Tin-Lead Level: Intermediate Location: 7B PD25_APEXEXPO17_Phil Zarrow_Jim Hall
Thu, Feb 16, 2017 - 9:00 AM to 12:00 PM PD26: Process Challenges for Bottom Terminations Components (BTCs): QFN, DFN and MLF Presenter/Committee Chair: Ray Prasad, Consultant, Ray Prasad Consultancy Group Seminar Type: Professional Development Track: Assembly Processes for Lead Free and Tin-Lead Level: Intermediate Location: 8 PD26_APEXEXPO17_Ray Prasad PD26 Process Challenges for BTC-Quiz
Thu, Feb 16, 2017 - 9:00 AM to 12:00 PM PD27: Cleaning Electronic Assemblies: Process, Materials, Analytics Advanced Level Presenter/Committee Chair: Umut Tosun, Application Technology Mgr., ZESTRON Americas Seminar Type: Professional Development Track: Cleaning/Coating/Contamination Level: Advanced Location: 9 PD27_APEXEXPO17_Umut Tosun
Thu, Feb 16, 2017 - 9:00 AM to 12:00 PM PD28: Failure Analysis of Electronic Assemblies Presenter/Committee Chair: Martin Anselm Ph.D., Director, CEMA Lab, Rochester Institute of Technology Seminar Type: Professional Development Track: Assembly Processes for Lead Free and Tin-Lead Level: Intermediate Location: 10 PD28_APEXEXPO17_Martin Anselm
Thu, Feb 16, 2017 - 9:00 AM to 12:00 PM PD29: HDI: Next Generation High Density Structures and Materials Presenter/Committee Chair: Happy Holden, Director of Electronics-RETIRED Seminar Type: Professional Development Track: Emerging Technologies Level: Intermediate Location: 11A PD29_APEXEXPO17_Happy Holden
Thu, Feb 16, 2017 - 9:00 AM to 12:00 PM PD30: PCB Layout - Place and Route Presenter/Committee Chair: Michael Creeden CID+, CEO/CID+ Instructor, San Diego PCB, Inc. Seminar Type: Professional Development Track: Design Level: Intermediate Location: 11B PD30_APEXEXPO17_Michael Creeden
Thu, Feb 16, 2017 - 2:00 PM to 5:00 PM PD31: Best Practices for Improving Manufacturing Productivity - Part 2 Presenter/Committee Chair: Phil Zarrow, President and Principal Consultant, ITM Consulting Inc. Presenter/Committee Chair: W. James Hall, Principal Consultant, ITM Consulting Inc. Seminar Type: Professional Development Track: Assembly Processes for Lead Free and Tin-Lead Location: 7B PD31_APEXEXPO17_Phil Zarrow_Jim Hall
Thu, Feb 16, 2017 - 2:00 PM to 5:00 PM PD32: Basic Technical Overview: For Sales, Purchasing, Finance, and Legal Professionals Presenter/Committee Chair: Ray Prasad, Consultant, Ray Prasad Consultancy Group Seminar Type: Professional Development Track: Emerging Technologies Location: 8 PD32_APEXEXPO17_Ray Prasad PD32 SMT Overview Quiz
Thu, Feb 16, 2017 - 2:00 PM to 5:00 PM PD33: Wave Soldering: Understanding Parameters Affecting Solder Barrel Fill Presenter/Committee Chair: Ah Feau Ng, Principal Consultant, TechMent Consultancy Sdn. Bhd. Seminar Type: Professional Development Track: Assembly Processes for Lead Free and Tin-Lead Location: 9 PD33_APEXEXPO17_Ah Feau Ng
Thu, Feb 16, 2017 - 2:00 PM to 5:00 PM PD34: Non-Contact Additive Technologies in Electronics Production Presenter/Committee Chair: Gustaf Maertensson Ph.D., Researcher, Chalmers University of Technology Seminar Type: Professional Development Location: 10 PD34_APEXEXPO17_Gustaf Maartensson