My Planner - Programs

Tue, Mar 15, 2016 - 1:30 PM to 3:00 PM S03: Environmental Compliance Moderator: Stephen Edward, Environmental Compliance Manager, TTM Technologies Speaker: James Cramer, Senior Technical Manager, Seagate Technology LLC Speaker: Chuck LePard, Sr. Consultant, Eng. & Mfg. Solutions, Hewlett-Packard Speaker: Randall Flinders, Sales Manager, North America, GreenSoft Technology Inc. Seminar Type: Technical Conference Session Topic/Track: Assembly Processes for Lead Free and Tin-Lead Location: S227 S03
Tue, Mar 15, 2016 - 1:30 PM to 3:00 PM S04: Rework Moderator: Russell Nowland, Repair Strategy & Supplier Management, Alcatel-Lucent Speaker: Al Cabral, Product Manager and Applications, Finetech Speaker: Dan Lilie, Global Rework Product Manager, Finetech GmbH Speaker: Charles Dennehy, Senior Production Engineer, Corfin Industries LLC Seminar Type: Technical Conference Session Topic/Track: Quality, Reliability and Test Location: S228 S04
Tue, Mar 15, 2016 - 3:00 PM to 4:00 PM 4-34B: Marking, Symbols and Labels for Identification of Assemblies, Components and Devices Task Group Lee Wilmot Stephen Tisdale Seminar Type: Standards Development Committee Meeting General Committee: Environment, Health & Safety (EHS) Topic/Track: PCB Fabrication and Materials Location: S108
Tue, Mar 15, 2016 - 3:15 PM to 5:00 PM 2-15F: Obsolete and Discontinued Product Task Group-CANCELLED Curtis Grosskopf Steven Ingardia Seminar Type: Standards Development Committee Meeting General Committee: Electronic Product Data Description Topic/Track: Supply Chain/Business Issues Location: S109
Tue, Mar 15, 2016 - 3:15 PM to 5:00 PM 3-11F: UL/CSA Task Group Doug Sober Seminar Type: Standards Development Committee Meeting General Committee: Base Materials Topic/Track: Quality, Reliability and Test Location: S107
Tue, Mar 15, 2016 - 3:15 PM to 5:00 PM 5-21F: Ball Grid Array Task Group-NOW ON TUESDAY FROM 3:15-5:00PM Ray Prasad Seminar Type: Standards Development Committee Meeting General Committee: Assembly and Joining Topic/Track: Assembly Processes for Lead Free and Tin-Lead Location: S109
Tue, Mar 15, 2016 - 3:15 PM to 5:00 PM 5-21K: IPC-SM-817 SMT Adhesive Task Group Nate Grinvalds, Material and Process Engr, Rockwell Collins Lance Brack Seminar Type: Standards Development Committee Meeting General Committee: Assembly and Joining Location: S104
Tue, Mar 15, 2016 - 3:15 PM to 5:00 PM 5-24C: Solder Alloy Task Group Jennie Hwang Ph.D Sc.D., CEO, H-Technologies Group David Adams Seminar Type: Standards Development Committee Meeting General Committee: Assembly and Joining Topic/Track: Assembly Processes for Lead Free and Tin-Lead Location: S106
Tue, Mar 15, 2016 - 3:15 PM to 5:00 PM 6-10D: SMT Attachment Reliability Test Methods Task Group Reza Ghaffarian Ph.D, Principal Eng., Jet Propulsion Laboratory Vasu Vasudevan Seminar Type: Standards Development Committee Meeting General Committee: Product Reliability Topic/Track: Quality, Reliability and Test Location: S113
Tue, Mar 15, 2016 - 3:15 PM to 5:00 PM D-24C: High Frequency Test Methods Task Group: Frequency-Domain Methods Speaker: John Coonrod, Technical Services Engineer, Rogers Corporation Speaker: Glenn Oliver, Design/Applications Engineer, DuPont - RTP Seminar Type: Standards Development Committee Meeting General Committee: High Speed/High Frequency Interconnections Topic/Track: Quality, Reliability and Test Location: S101