Finetech and Martin supply rework equipment for advanced applications: 008004s, LEDs, PoP, chip-on-flex, micro reballing, reworkable underfill, and motorized solder removal. The Core provides ...
Finetech and Martin supply rework equipment for advanced applications: 008004s, LEDs, PoP, chip-on-flex, micro reballing, reworkable underfill, and motorized solder removal. The Core provides ...
Finetech and Martin supply rework equipment for advanced applications: 008004s, LEDs, PoP, chip-on-flex, micro reballing, reworkable underfill, and motorized solder removal. The Core provides precise temperature and convection flow control, outstanding placement accuracy, and robust process... (more)
Finetech and Martin supply rework equipment for advanced applications: 008004s, LEDs, PoP, chip-on-flex, micro reballing, reworkable underfill, and motorized solder removal. The Core provides precise temperature and convection flow control, outstanding placement accuracy, and robust process development / extensive recipe libraries. The Expert 10.6 delivers automated component alignment, large board handling, and productivity features including non-contact residual solder removal and solder paste/flux dispensing. The stand-alone BGA-CSP reballing unit compliments these systems. (less)
