QUARTZ TUBE PROCESS FURNACE: 150°C to 1100°C, LTCC, annealing, LPCVD: epi, CNT, Graphene, poly Si, Si3N4, IR VACUUM REFLOW SOLDER/BRAZING OVENS/RTA: Semi-automatic/full automatic, void free w/o or with flux, die attachment MEMS/PACKAGE LID SEALING, electrical/thermal Getter activation THERMAL COMPRESSION BONDER, 3D CSP ALD/CVD, IR based LTCC SINTERING PRESS HOT PLATE/CHUCK DIAMOND SCRIBER Manual DIE BONDER/DISPENSER for HYBRIDS GAS PLASMA SYSTEMS: etching/cleaning/ashing/ stripping/surface treatment/Reactive Ion Etching, functional de-capsulation/de-layering/ failure analyze (less)