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IPC APEX EXPO 2016
Tintronics Industries
Tintronics Industries
Exhibitor
Booth: 1610
About the Company:
Offering Turn-Key Value add services to Industry Specifications. Robotic Hot Solder Dip, Tin mitigation, gold removal, solderability enhancement, Pb free conversions, BGA reball and alloy conversion, tape & reel, lead form & excise, solderability testing,dry-packaging and XRF analytical services.... (more)
Additional Info:
Company's Categories:
Main Contact: Tom Ott
Tom Ott
tom.ott@tintronics.com
Other Contacts:
Kevin Young
Kevin Young
Booth Staff
President
Tintronics Industries
Thomas Ott
Thomas Ott
Booth Staff
Sales Manager
Tintronics Industries
Tom Ott
Tom Ott
Attendee
Sales Manager
Tintronics Industries
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