APEX EXPO 2017 Agenda Planner

Wed, Feb 15, 2017 - 1:30 PM to 3:00 PM BZ6: SGA Case Studies and Validation Services Program Updates Presenter/Committee Chair: Randy Cherry, Director Validation Services, IPC Seminar Type: Buzz Session Location: 5A
Wed, Feb 15, 2017 - 1:30 PM to 3:00 PM D-11: Flexible Circuits Design Subcommittee Presenter/Committee Chair: Mark Finstad CID, Senior Appication Engineer, Flexible Circuit Technologies, Inc. Presenter/Committee Chair: William Ortloff Sr., Engineering Fellow, Raytheon Company Seminar Type: Standards Development Committee Meeting Track: Design General Committee: Flexible and Rigid-Flex Printed Boards Location: 11A
Wed, Feb 15, 2017 - 1:30 PM to 3:00 PM D-23: High Speed/High Frequency Base Materials Subcommittee Presenter/Committee Chair: Dan Welch Presenter/Committee Chair: Edward Sandor, Application Engineering Mgr, Taconic Advanced Dielectric Division Seminar Type: Standards Development Committee Meeting General Committee: Base Materials Location: 12
Wed, Feb 15, 2017 - 1:30 PM to 5:00 PM D-60: Printed Electronics Committee - Reporting Session Presenter/Committee Chair: Daniel Gamota, President, Printovate Technologies, Inc. Presenter/Committee Chair: Neil Bolding, Manager, Technical Services & Quality, MacDermid Enthone Electronics Solutions Seminar Type: Standards Development Committee Meeting Track: Printed Electronics General Committee: Printed Electronics Location: 14A
Wed, Feb 15, 2017 - 1:30 PM to 3:00 PM S17: Rework I Presenter/Committee Chair: Russell Nowland, Repair Strategy & Supplier Management, Nokia Presenter/Committee Chair: Paul Wood, Advanced Product Applications Manager, OK International Presenter/Committee Chair: Robert Roush, Product Manager, OK International Presenter/Committee Chair: Shantanu Joshi, Technical Sales Engineer, Koki Solder America Inc. Seminar Type: Technical Conference Session Track: Assembly Processes for Lead Free and Tin-Lead Location: 1A S17: Rework I
Wed, Feb 15, 2017 - 1:30 PM to 3:00 PM S19: High Speed/High Frequency II Presenter/Committee Chair: David Hoover, Field Application Engineer, TTM Technologies Presenter/Committee Chair: James Fuller, Vice President Engineering, Sanmina Corporation Presenter/Committee Chair: Karl Sauter, Principal Engineer, Oracle America, Inc. Presenter/Committee Chair: Seiya Kido, MEC Company, Ltd. Seminar Type: Technical Conference Session Track: PCB Fabrication and Materials Location: 2 S19: High Speed/High Frequency II
Wed, Feb 15, 2017 - 1:30 PM to 3:00 PM S20: Cleanliness/Reliability Presenter/Committee Chair: Jasbir Bath, Principal Engineer Presenter/Committee Chair: Ravi Parthasarathy, Senior Process Engineer, ZESTRON Americas Presenter/Committee Chair: Azita Yazdani, President & CEO, Exergy Technologies Corporation Presenter/Committee Chair: Gustavo Arredondo, Technical Manager, Para Tech Coating Inc. Seminar Type: Technical Conference Session Track: Cleaning/Coating/Contamination Location: 4 S20: Cleanliness/Reliability
Wed, Feb 15, 2017 - 1:30 PM to 3:00 PM S21: Reliability II Presenter/Committee Chair: Martin Goetz, Sr. Manager, Northrop Grumman Corporation Presenter/Committee Chair: Jagadeesh Radhakrishnan, Quality and Reliability Engineer, Intel Corporation Presenter/Committee Chair: Greg Smith, Technical Sales, FCT Assembly, Inc. Seminar Type: Technical Conference Session Track: Quality, Reliability and Test & Assembly Processes for Lead-Free and Tin Lead Location: 3 S21: Reliability II
Wed, Feb 15, 2017 - 1:30 PM to 5:00 PM SPVC: IPC Solder Products Value Council(By Invitation) Seminar Type: Standards Development Committee Meeting General Committee: Managment Location: 11B
Wed, Feb 15, 2017 - 3:00 PM to 4:30 PM BZ7: REACH: New Articles Regulatory Regime Presenter/Committee Chair: Fern Abrams, Director, Regulatory Affairs and Government Relations, IPC Government Relations Presenter/Committee Chair: Bill Leong, R&D Project Manager, Hewlett-Packard Company Presenter/Committee Chair: John Sharp, Corporate Product Compliance Manager, Qorvo Presenter/Committee Chair: Michael Kirschner, President, Design Chain Associates, LLC Seminar Type: Buzz Session Location: 5A