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IPC APEX EXPO 2017
Sat, Feb 11, 2017 - 8:00 AM to 5:00 PM
IPC-A-610 Task Group
Seminar Type: Standards Development Committee Meeting
Track: Quality, Reliability and Test
General Committee: Product Assurance
Location: 15A
Sun, Feb 12, 2017 - 8:00 AM to 2:00 PM
2-18: Supplier Declaration Subcommittee
Presenter/Committee Chair: Forrest Christian, President & CEO, Innovation Machine Ltd.
Seminar Type: Standards Development Committee Meeting
Track: Environmental Issues and Compliance
General Committee: Electronic Product Data Description
Location: 11B
Sun, Feb 12, 2017 - 8:00 AM to 9:00 AM
2-30: Terms and Definitions Committee
Presenter/Committee Chair: Steven Bowles, Supervisor, Receiving Inspection & Gage Calibratio, L-3 Fuzing and Ordnance Systems, Cincinnati
Presenter/Committee Chair: Vicka Hammill, Staff Engineer, Honeywell Inc. Air Transport Systems
Seminar Type: Standards Development Committee Meeting
Track: PCB Fabrication and Materials
General Committee: Terms and Definitions
Location: 7A
Sun, Feb 12, 2017 - 8:00 AM to 12:00 PM
5-21A: IPC-7070 Task Group
Presenter/Committee Chair: Kristopher Moyer CID+, Electrical Engineer, Aerojet Rocketdyne
Seminar Type: Standards Development Committee Meeting
Track: Assembly Processes for Lead Free and Tin-Lead
General Committee: Assembly and Joining
Location: 11A
Sun, Feb 12, 2017 - 8:00 AM to 3:00 PM
5-22A: J-STD-001 Task Group
Seminar Type: Standards Development Committee Meeting
Track: Assembly Processes for Lead Free and Tin-Lead
General Committee: Assembly and Joining
Location: 15A
Sun, Feb 12, 2017 - 9:00 AM to 4:00 PM
2-19A: Critical Components Traceability Task Group
Presenter/Committee Chair: Cameron Shearon, Lead Quality Engineer SCM, AT&T Services, Inc
Presenter/Committee Chair: Michael Ford, Senior Market Development Manager, Mentor Graphics Corporation
Seminar Type: Standards Development Committee Meeting
Track: Supply Chain/Business Issues
General Committee: Electronic Product Data Description
Location: 13
Sun, Feb 12, 2017 - 9:00 AM to 4:15 PM
7-31A/D-33A: Joint Meeting - IPC-A-600 and IPC-6012 Task Groups
Presenter/Committee Chair: Mark Buechner, Principal Quality Assurance En, BAE Systems
Presenter/Committee Chair: Randy Reed, Sr. Engr Rel Lab, R. Reed Consultancy LLC
Seminar Type: Standards Development Committee Meeting
Track: PCB Fabrication and Materials
General Committee: Rigid Printed Boards
Location: 7A
Sun, Feb 12, 2017 - 1:00 PM to 3:00 PM
2-40: Electronic Documentation Technology Committee
Presenter/Committee Chair: Gary Carter, Independent Consultant
Presenter/Committee Chair: Jimmy Baccam CID+
Seminar Type: Standards Development Committee Meeting
Track: Design
General Committee: Electronic Documentation Technology
Location: 11A
Sun, Feb 12, 2017 - 3:00 PM to 4:30 PM
5-20: Assembly & Joining Committee - By Invitation Only
Presenter/Committee Chair: Daniel Foster CIT, Quality Assurance Specialist, Missile Defense Agency
Presenter/Committee Chair: Karen Tellefsen Ph.D., Senior Chemist, Alpha
Presenter/Committee Chair: Leo Lambert MIT, Vice President, EPTAC Corporation
Seminar Type: Standards Development Committee Meeting
Track: Assembly Processes for Lead Free and Tin-Lead
General Committee: Assembly and Joining
Location: 11A
Sun, Feb 12, 2017 - 6:00 PM to 7:00 PM
IPC Committee Chairmen's Reception(By Invitation )
Seminar Type: Standards Development Committee Meeting
Location: West Terrace(located on the upper level)
Mon, Feb 13, 2017 - 8:00 AM to 5:00 PM
2-18B: Materials Declaration Task Group
Presenter/Committee Chair: Mark Frimann, SC Product Stewardship Mng, Texas Instruments Inc.
Presenter/Committee Chair: Aidan Turnbull Ph.D., Managing Director, BomCheck
Seminar Type: Standards Development Committee Meeting
Track: Environmental Issues and Compliance
General Committee: Electronic Product Data Description
Location: 14A
Mon, Feb 13, 2017 - 8:00 AM to 12:00 PM
3-11: Laminate/Prepreg Materials Subcommittee
Presenter/Committee Chair: Doug Sober, Founder/President, Essex Technologies Group Inc.
Presenter/Committee Chair: Tony Senese, Manager, Business Development, Panasonic Industrial Devices Sales Company of America (PIDSA)
Seminar Type: Standards Development Committee Meeting
Track: PCB Fabrication and Materials
General Committee: Base Materials
Location: 11A
Mon, Feb 13, 2017 - 8:00 AM to 10:00 AM
5-21H: Bottom Termination Components (BTC) Task Group
Presenter/Committee Chair: Ray Prasad, Consultant, Ray Prasad Consultancy Group
Presenter/Committee Chair: Matt Kelly, IBM
Seminar Type: Standards Development Committee Meeting
Track: Assembly Processes for Lead Free and Tin-Lead
General Committee: Assembly and Joining
Location: 12
Mon, Feb 13, 2017 - 8:00 AM to 10:00 AM
5-23B: Component and Wire Solderability Specification Task Group
Presenter/Committee Chair: David Hillman, Principal Material & Process Engineer, Rockwell Collins
Presenter/Committee Chair: Dennis Fritz
Seminar Type: Standards Development Committee Meeting
Track: Assembly Processes for Lead Free and Tin-Lead
General Committee: Assembly and Joining
Location: 11B
Mon, Feb 13, 2017 - 8:00 AM to 10:00 AM
5-32C: Bare Board Cleanliness Assessment Task Group-CANCELLED
Presenter/Committee Chair: David Lober, Process Chemist, Kyzen Corporation
Presenter/Committee Chair: Joseph Russeau
Seminar Type: Standards Development Committee Meeting
Track: Cleaning/Coating/Contamination
General Committee: Cleaning and Coating
Location: 8
Mon, Feb 13, 2017 - 8:00 AM to 9:00 AM
7-30: Product Assurance Committee - By Invitation Only
Presenter/Committee Chair: Debbie Wade MIT
Presenter/Committee Chair: Robert Cooke, Aerospace Engineer, NASA Johnson Space Center
Seminar Type: Standards Development Committee Meeting
Track: Quality, Reliability and Test
General Committee: Product Assurance
Location: 7A
Mon, Feb 13, 2017 - 8:00 AM to 10:00 AM
D-35: Printed Board Storage and Handling Subcommittee
Presenter/Committee Chair: Don Dupriest, LM Fellow, Lockheed Martin Missiles & Fire Control
Presenter/Committee Chair: Joseph Kane, Sr. Principal Engineer, BAE Systems Platform Solutions
Seminar Type: Standards Development Committee Meeting
Track: PCB Fabrication and Materials
General Committee: Rigid Printed Boards
Location: 9
Mon, Feb 13, 2017 - 8:00 AM to 10:00 AM
D-36A: IPC-PCQR2 DAUG -(By Invitation)
Presenter/Committee Chair: David Wolf, VP - Technical Marketing, Conductor Analysis Technologies, Inc.
Presenter/Committee Chair: Timothy Estes
Seminar Type: Standards Development Committee Meeting
Track: Quality, Reliability and Test
General Committee: Rigid Printed Boards
Location: 10
Mon, Feb 13, 2017 - 8:00 AM to 12:00 PM
E-21/E-22: Joint Meeting - EMS Intellectual Property and PC Fab Intellectual Property Subcommittee
Presenter/Committee Chair: Dennis Fritz
Presenter/Committee Chair: Pat Stroman CEPM, Supplier Quality Engineer, Sparton Corporation
Presenter/Committee Chair: Rajesh Kumar, VP of Technology Solutions, C&C, TTM Technologies
Seminar Type: Standards Development Committee Meeting
Track: Supply Chain/Business Issues
General Committee: Management
Location: 17B
Mon, Feb 13, 2017 - 8:00 AM to 12:00 PM
IPC/WHMA-A-620 Space Electronic Assemblies Addendum Task Group
Seminar Type: Standards Development Committee Meeting
Location: 15A
Mon, Feb 13, 2017 - 9:00 AM to 5:00 PM
5-22A/7-31B: Synergy Meeting - J-STD-001 & IPC-A-610 Task Groups
Presenter/Committee Chair: Constantino Gonzalez MIT, President/EMS-OEM Consultant, ACME Training & Consulting
Presenter/Committee Chair: Mary Muller, Sr. Supplier Quality Engineer, Crane Aerospace & Electronics
Presenter/Committee Chair: Kathy Johnston MIT, Q&MA Mgr., Raytheon Missile Systems
Presenter/Committee Chair: Daniel Foster CIT, Quality Assurance Specialist, Missile Defense Agency
Presenter/Committee Chair: Robert Fornefeld MIT, Supervisor Master IPC Trainer, L-3 Communications
Seminar Type: Standards Development Committee Meeting
Track: Assembly Processes for Lead Free and Tin-Lead
General Committee: Assembly and Joining
Location: 7A
Mon, Feb 13, 2017 - 10:15 AM to 12:00 PM
2-19A: Critical Components Traceability Task Group
Presenter/Committee Chair: Cameron Shearon, Lead Quality Engineer SCM, AT&T Services, Inc
Presenter/Committee Chair: Michael Ford, Senior Market Development Manager, Mentor Graphics Corporation
Seminar Type: Standards Development Committee Meeting
Track: Supply Chain/Business Issues
General Committee: Electronic Product Data Description
Location: 18
Mon, Feb 13, 2017 - 10:15 AM to 12:00 PM
5-23A: Printed Circuit Board Solderability Specifications Task Group
Presenter/Committee Chair: Gerard O'Brien, President, Solderability Testing & Solutions, Inc.
Presenter/Committee Chair: Michah Pledger
Seminar Type: Standards Development Committee Meeting
Track: Assembly Processes for Lead Free and Tin-Lead
General Committee: Assembly and Joining
Location: 11B
Mon, Feb 13, 2017 - 10:15 AM to 12:00 PM
5-31J: Cleaning Compatibility Task Group
Presenter/Committee Chair: Mike Bixenman DBA, CTO, Kyzen Corporation
Presenter/Committee Chair: Eddie Hofer, M&P Engineer, Rockwell Collins
Seminar Type: Standards Development Committee Meeting
Track: Cleaning/Coating/Contamination
General Committee: Cleaning and Coating
Location: 8
Mon, Feb 13, 2017 - 10:15 AM to 12:00 PM
7-11: Test Methods Subcommittee
Seminar Type: Standards Development Committee Meeting
General Committee: Testing
Location: 9
Mon, Feb 13, 2017 - 10:15 AM to 12:00 PM
D-36: Printed Board Process Capability, Quality and Relative Reliability Benchmark Test Subcommittee
Presenter/Committee Chair: Albert Block Jr., Principal Manufacturing Strategist, National Instruments
Presenter/Committee Chair: Michael Miller
Seminar Type: Standards Development Committee Meeting
Track: Quality, Reliability and Test
General Committee: Rigid Printed Boards
Location: 10
Mon, Feb 13, 2017 - 1:30 PM to 5:00 PM
1-10C: Test Coupon and Artwork Generation Task Group
Presenter/Committee Chair: Philip Henault, Development Engineer, Raytheon Company
Presenter/Committee Chair: Nicholas Meeker
Seminar Type: Standards Development Committee Meeting
Track: Design
General Committee: Printed Board Design Technology
Location: 10
Mon, Feb 13, 2017 - 1:30 PM to 5:00 PM
2-17: Connected Factory Initative
Presenter/Committee Chair: Jason Spera, CEO, Aegis Software
Presenter/Committee Chair: Marc Peo, President, Heller Industries Inc.
Presenter/Committee Chair: Mahi Duggirala, Director, Enterprise Solutions, Flextronics International
Seminar Type: Standards Development Committee Meeting
General Committee: Electronic Product Data Description
Location: 14B
Mon, Feb 13, 2017 - 1:30 PM to 3:00 PM
3-12D: Woven Glass Reinforcement Task Group
Presenter/Committee Chair: Mike Bryant, Vice President R&D, BGF Industries Inc.
Seminar Type: Standards Development Committee Meeting
Track: PCB Fabrication and Materials
General Committee: Base Materials
Location: 11A
Mon, Feb 13, 2017 - 1:30 PM to 3:00 PM
5-32A: Ion Chromatography/Ionic Conductivity Task Group-Canceled
This meeting has been canceled
Presenter/Committee Chair: John Radman, Senior Applications Engineer, NTS - Denver
Presenter/Committee Chair: Joseph Russeau
Seminar Type: Standards Development Committee Meeting
General Committee: Cleaning and Coating
Mon, Feb 13, 2017 - 1:30 PM to 3:00 PM
7-31M: Fiber Optic Cable Acceptability Task Group
Presenter/Committee Chair: Robert Cooke, Aerospace Engineer, NASA Johnson Space Center
Presenter/Committee Chair: Sean Keating CIT
Seminar Type: Standards Development Committee Meeting
Track: Quality, Reliability and Test
General Committee: Product Assurance
Location: 17B
Mon, Feb 13, 2017 - 1:30 PM to 5:00 PM
B-10A: Joint Meeting: Plastic Chip Carrier Cracking Task Group and JEDEC JC-14.1
Presenter/Committee Chair: Steven Martell, Advanced Applications Support Manager, Sonoscan Inc.
Seminar Type: Standards Development Committee Meeting
General Committee: Packaged Electronic Components
Location: 12
Mon, Feb 13, 2017 - 1:30 PM to 3:00 PM
D-21: High Speed/High Frequency Design Subcommittee
Presenter/Committee Chair: Scott Bowles, Staff Engineer - Printed Board SME, L-3 Fuzing and Ordnance Systems, Cincinnati
Presenter/Committee Chair: Dana Korf
Seminar Type: Standards Development Committee Meeting
Track: Design
General Committee: High Speed/High Frequency Interconnections
Location: 9
Mon, Feb 13, 2017 - 3:15 PM to 5:00 PM

D-67 – 3D Printed Electronics Terms, Definitions and Standards

Seminar Type: Standards Development Committee Meeting
Location: 18
Mon, Feb 13, 2017 - 3:15 PM to 5:00 PM
1-10B: Current Carrying Capacity Task Group
Presenter/Committee Chair: Michael Jouppi, President, Thermal Management, LLC.
Seminar Type: Standards Development Committee Meeting
Track: Design
General Committee: Printed Board Design Technology
Location: 9
Mon, Feb 13, 2017 - 3:15 PM to 5:00 PM
3-12E: Base Materials Roundtable Task Group
Presenter/Committee Chair: Doug Sober, Founder/President, Essex Technologies Group Inc.
Presenter/Committee Chair: Terry Fischer, VP Sales and Marketing, Hitachi Chemical Co. America, Ltd.
Seminar Type: Standards Development Committee Meeting
Track: PCB Fabrication and Materials
General Committee: Base Materials
Location: 11A
Mon, Feb 13, 2017 - 3:15 PM to 5:00 PM
5-32B: SIR and Electrochemical Migration Task Group
Presenter/Committee Chair: Keith Sellers, Operations Manager, NTS - Baltimore
Presenter/Committee Chair: Graham Naisbitt
Presenter/Committee Chair: Russell Shepherd MIT, Operations Manager, National Technical Systems Anaheim
Seminar Type: Standards Development Committee Meeting
Track: Cleaning/Coating/Contamination
General Committee: Cleaning and Coating
Location: 8
Mon, Feb 13, 2017 - 3:15 PM to 5:00 PM
5-33g: Low Pressure Molding Task Group
Presenter/Committee Chair: Russell Steiner CID+, Sr. PCB Lead Designer Engineer, Allegion
Presenter/Committee Chair: Eric Camden, Lead Investigator, Foresite, Inc.
Seminar Type: Standards Development Committee Meeting
Track: PCB Fabrication and Materials
General Committee: Cleaning and Coating
Location: 11B
Mon, Feb 13, 2017 - 3:15 PM to 5:00 PM
D-33AM: IPC-6012 Medical Device Addendum Task Group
Presenter/Committee Chair: Jan Pedersen CIT, Senior Technical Advisor, Elmatica AS
Seminar Type: Standards Development Committee Meeting
General Committee: Rigid Printed Boards
Location: 15A
Tue, Feb 14, 2017 - 10:00 AM to 12:00 PM
2-18F: Declaration of Shipping, Pack and Packing Materials Task Group
Presenter/Committee Chair: John Ciba Jr., Managing Director
Seminar Type: Standards Development Committee Meeting
Track: Environmental Issues and Compliance
General Committee: Electronic Product Data Description
Location: 13
Tue, Feb 14, 2017 - 10:00 AM to 12:00 PM
3-12A: Metallic Foil Task Group
Presenter/Committee Chair: Rolland Savage, Savage Consulting
Seminar Type: Standards Development Committee Meeting
Track: PCB Fabrication and Materials
General Committee: Base Materials
Location: 11A
Tue, Feb 14, 2017 - 10:00 AM to 12:00 PM
5-20T: General IPC Training Committees Meeting - All Training
Presenter/Committee Chair: Symon Franklin CIT, Production Engineer, Custom Interconnect Ltd
Seminar Type: Standards Development Committee Meeting
Track: Assembly Processes for Lead Free and Tin-Lead
General Committee: Assembly and Joining
Location: 18
Tue, Feb 14, 2017 - 10:00 AM to 12:00 PM
5-22ARR: J-STD-001/Conformal Coating Material & Application Industry Assessment
Presenter/Committee Chair: David Hillman, Principal Material & Process Engineer, Rockwell Collins
Presenter/Committee Chair: Linda Woody
Presenter/Committee Chair: Jason Keeping, Project Manager, Ruggedized Electronics, Celestica
Seminar Type: Standards Development Committee Meeting
Track: Assembly Processes for Lead Free and Tin-Lead
General Committee: Assembly and Joining
Location: 15A
Tue, Feb 14, 2017 - 10:00 AM to 12:00 PM
5-22H: Thermal Profiling Guide Task Group
Presenter/Committee Chair: Ray Prasad, Consultant, Ray Prasad Consultancy Group
Presenter/Committee Chair: Robert Rowland
Seminar Type: Standards Development Committee Meeting
Track: Assembly Processes for Lead Free and Tin-Lead
General Committee: Assembly and Joining
Location: 12
Tue, Feb 14, 2017 - 10:00 AM to 12:00 PM
5-33B: Solder Mask Performance Task Group
Seminar Type: Standards Development Committee Meeting
Track: Cleaning/Coating/Contamination
General Committee: Cleaning and Coating
Location: 17B
Tue, Feb 14, 2017 - 10:00 AM to 12:00 PM
7-31BV: Automotive Addendum Task Group
Seminar Type: Standards Development Committee Meeting
Track: Quality, Reliability and Test
General Committee: Product Assurance
Location: 9
Tue, Feb 14, 2017 - 10:00 AM to 12:00 PM
7-35: Assembly and Joining Handbook Subcommittee
Seminar Type: Standards Development Committee Meeting
Track: Assembly Processes for Lead Free and Tin-Lead
General Committee: Product Assurance
Location: 8
Tue, Feb 14, 2017 - 10:00 AM to 12:00 PM
D-32: Thermal Stress Test Methodology Subcommittee
Presenter/Committee Chair: James Monarchio, Director of Quality - Aerospace/Defense, TTM Technologies, Inc.
Presenter/Committee Chair: Jose Rios
Presenter/Committee Chair: Jerry Magera
Seminar Type: Standards Development Committee Meeting
Track: Quality, Reliability and Test
General Committee: Rigid Printed Boards
Location: 14B
Tue, Feb 14, 2017 - 1:30 PM to 5:00 PM
2-18J: Laboratory Report Declaration Task Group
Presenter/Committee Chair: Jason Gooden, Partner, Anthesis
Presenter/Committee Chair: JB Hollister, Environmental Engineer, Apple Inc.
Seminar Type: Standards Development Committee Meeting
Track: Environmental Issues and Compliance
General Committee: Electronic Product Data Description
Location: 13
Tue, Feb 14, 2017 - 1:30 PM to 5:00 PM
4-30: Environment, Health & Safety Committee
Presenter/Committee Chair: Bret Bruhn, Environmental Operations Manager, TTM Technologies
Seminar Type: Standards Development Committee Meeting
Track: Environmental Issues and Compliance
General Committee: Environment, Health & Safety (EHS)
Location: 14A
Tue, Feb 14, 2017 - 1:30 PM to 3:00 PM
4-33: Halogen-Free Materials Subcommittee
Presenter/Committee Chair: Doug Sober, Founder/President, Essex Technologies Group Inc.
Seminar Type: Standards Development Committee Meeting
Track: Environmental Issues and Compliance
General Committee: Environment, Health & Safety (EHS)
Location: 11A
Tue, Feb 14, 2017 - 1:30 PM to 3:00 PM
5-24A: Flux Specifications Task Group-CANCELED
Presenter/Committee Chair: Brook Sandy-Smith, Product Support Specialist, Indium Corporation
Presenter/Committee Chair: Keith Sellers, Operations Manager, NTS - Baltimore
Seminar Type: Standards Development Committee Meeting
Track: Assembly Processes for Lead Free and Tin-Lead
General Committee: Assembly and Joining
Location: 10
Tue, Feb 14, 2017 - 1:30 PM to 3:00 PM
5-32E: Conductive Anodic Filament (CAF) Task Group
Presenter/Committee Chair: Karl Sauter, Principal Engineer, Oracle America, Inc.
Presenter/Committee Chair: Graham Naisbitt
Presenter/Committee Chair: Russell Shepherd MIT, Operations Manager, National Technical Systems Anaheim
Seminar Type: Standards Development Committee Meeting
Track: PCB Fabrication and Materials
General Committee: Cleaning and Coating
Location: 11B
Tue, Feb 14, 2017 - 1:30 PM to 3:00 PM
7-24: Printed Board Process Effects Handbook Subcommittee
Presenter/Committee Chair: Michael Carano, VP Technology & Business Development, RBP Chemical Technology, Inc.
Seminar Type: Standards Development Committee Meeting
Track: Quality, Reliability and Test
General Committee: Process Control
Location: 8
Tue, Feb 14, 2017 - 1:30 PM to 3:00 PM
D-24B: Bereskin Test Method Task Group
Presenter/Committee Chair: David Wynants, Process Engineer, Taconic Advanced Dielectric Division
Seminar Type: Standards Development Committee Meeting
Track: Quality, Reliability and Test
General Committee: High Speed/High Frequency Interconnections
Location: 12
Tue, Feb 14, 2017 - 1:30 PM to 5:00 PM
D-31B: IPC-2226A Design Standard
Presenter/Committee Chair: Gary Ferrari MIT, Director of Technical Support, FTG Circuits
Presenter/Committee Chair: Clifford Maddox
Seminar Type: Standards Development Committee Meeting
Track: Design
General Committee: Printed Board Design Technology
Location: 17B
Tue, Feb 14, 2017 - 1:30 PM to 3:00 PM
D-33AT: IPC-6012 Technical Training Committe
Presenter/Committee Chair: Steven Bowles, Supervisor, Receiving Inspection & Gage Calibratio, L-3 Fuzing and Ordnance Systems, Cincinnati
Presenter/Committee Chair: Don Dupriest, LM Fellow, Lockheed Martin Missiles & Fire Control
Seminar Type: Standards Development Committee Meeting
Track: PCB Fabrication and Materials
General Committee: Rigid Printed Boards
Location: 18
Tue, Feb 14, 2017 - 1:30 PM to 5:00 PM
D-55: Embedded Devices Process Implementation Subcommittee
Presenter/Committee Chair: Rajesh Kumar, VP of Technology Solutions, C&C, TTM Technologies
Presenter/Committee Chair: Bruce Hughes
Seminar Type: Standards Development Committee Meeting
Track: Emerging Technologies
General Committee: Embedded Devices
Location: 9
Tue, Feb 14, 2017 - 1:30 PM to 3:00 PM
PCB Suppliers Council Steering Committee Meeting(By Invitation)
Seminar Type: Standards Development Committee Meeting
Location: 14B
Tue, Feb 14, 2017 - 3:00 PM to 5:00 PM
1-14: DFX Standards Subcommittee
Presenter/Committee Chair: Dock Brown, Sr. Member of Technical Staff, DfR Solutions
Presenter/Committee Chair: Karen McConnell CID, Manager, EDA, Northrop Grumman Corporation
Seminar Type: Standards Development Committee Meeting
Track: Design
General Committee: Printed Board Design Technology
Location: 14B
Tue, Feb 14, 2017 - 3:15 PM to 5:00 PM
3-11F: UL/CSA Task Group
Presenter/Committee Chair: Doug Sober, Founder/President, Essex Technologies Group Inc.
Seminar Type: Standards Development Committee Meeting
Track: PCB Fabrication and Materials
General Committee: Base Materials
Location: 11A
Tue, Feb 14, 2017 - 3:15 PM to 5:00 PM
5-21K: IPC-SM-817 SMT Adhesive Task Group
Presenter/Committee Chair: Lance Brack, Sr. Engineer I w/ Honors, Raytheon Missile Systems
Seminar Type: Standards Development Committee Meeting
Track: Assembly Processes for Lead Free and Tin-Lead
General Committee: Assembly and Joining
Location: 7A
Tue, Feb 14, 2017 - 3:15 PM to 5:00 PM
5-22 ROSE WORKING GROUP
Seminar Type: Standards Development Committee Meeting
Location: 8
Tue, Feb 14, 2017 - 3:15 PM to 5:00 PM
5-24C: Solder Alloy Task Group
Presenter/Committee Chair: Jennie Hwang Ph.D., Sc.D., CEO, H-Technologies Group
Presenter/Committee Chair: David Adams
Seminar Type: Standards Development Committee Meeting
Track: Assembly Processes for Lead Free and Tin-Lead
General Committee: Assembly and Joining
Location: 10
Tue, Feb 14, 2017 - 3:15 PM to 5:00 PM
6-10D: SMT Attachment Reliability Test Methods Task Group
Presenter/Committee Chair: Reza Ghaffarian Ph.D., Principal Eng., Jet Propulsion Laboratory
Presenter/Committee Chair: Vasu Vasudevan
Seminar Type: Standards Development Committee Meeting
General Committee: Product Reliability
Location: 11B
Tue, Feb 14, 2017 - 3:15 PM to 5:00 PM
7-31AT: IPC-A-600 Technical Training Committee
Presenter/Committee Chair: Leo Lambert MIT, Vice President, EPTAC Corporation
Presenter/Committee Chair: Debora Obitz MIT, Manager of IPC Training Programs, National Technical Systems Anaheim
Seminar Type: Standards Development Committee Meeting
Track: PCB Fabrication and Materials
General Committee: Product Assurance
Location: 18
Tue, Feb 14, 2017 - 3:15 PM to 5:00 PM
D-24C: High Frequency Test Methods Task Group: Frequency-Domain Methods
Presenter/Committee Chair: John Coonrod, Technical Marketing Manager, Rogers Corporation
Presenter/Committee Chair: Glenn Oliver, Senior Engineer, DuPont - RTP
Seminar Type: Standards Development Committee Meeting
Track: Quality, Reliability and Test
General Committee: High Speed/High Frequency Interconnections
Location: 12
Wed, Feb 15, 2017 - 7:30 AM to 9:00 AM
2-16D: IPC-2581 User's Group
Presenter/Committee Chair: Kevin Kusiak, Electronics Engrg Asc Mgr, SSC, Lockheed Martin Space Systems Company
Seminar Type: Standards Development Committee Meeting
Track: Design
General Committee: Electronic Product Data Description
Location: 12
Wed, Feb 15, 2017 - 8:00 AM to 5:00 PM
2-18K: Material Declaration Data Exchange for Aerospace and Defense Task Group
Presenter/Committee Chair: Walter Jager, Principal Consultant, ECD Compliance
Presenter/Committee Chair: Jean-Pierre Theret, EcoDesign Leader, Dassault Systemes
Presenter/Committee Chair: Rick Shanks, Manager Design for Sustainability, Pratt & Whitney
Seminar Type: Standards Development Committee Meeting
Track: Environmental Issues and Compliance
General Committee: Electronic Product Data Description
Location: 9
Wed, Feb 15, 2017 - 8:00 AM to 10:00 AM
5-21E: Solder Stencil Task Group
Presenter/Committee Chair: Jeff Schake, Senior Advanced Technology Specialist, ASM Assembly Systems
Presenter/Committee Chair: William Kunkle
Seminar Type: Standards Development Committee Meeting
Track: Assembly Processes for Lead Free and Tin-Lead
General Committee: Assembly and Joining
Location: 15A
Wed, Feb 15, 2017 - 8:00 AM to 10:00 AM
5-21G: Flip Chip Mounting Task Group
Presenter/Committee Chair: Vern Solberg, Sr Consultant, Solberg Technical Consulting
Seminar Type: Standards Development Committee Meeting
Track: Assembly Processes for Lead Free and Tin-Lead
General Committee: Assembly and Joining
Location: 18
Wed, Feb 15, 2017 - 8:00 AM to 10:00 PM
5-22F: J-STD-001 Handbook Task Group
Presenter/Committee Chair: Daniel Foster CIT, Quality Assurance Specialist, Missile Defense Agency
Presenter/Committee Chair: Kathy Johnston MIT, Q&MA Mgr., Raytheon Missile Systems
Seminar Type: Standards Development Committee Meeting
Track: Assembly Processes for Lead Free and Tin-Lead
General Committee: Assembly and Joining
Location: 7A
Wed, Feb 15, 2017 - 8:00 AM to 10:00 PM
5-24B: Solder Paste Task Group
Presenter/Committee Chair: Beverley Christian Ph.D., HDP User Group
Presenter/Committee Chair: Karen Tellefsen Ph.D., Senior Chemist, Alpha
Seminar Type: Standards Development Committee Meeting
Track: Assembly Processes for Lead Free and Tin-Lead
General Committee: Assembly and Joining
Location: 11B
Wed, Feb 15, 2017 - 8:00 AM to 10:00 AM
5-33AWG: Conformal Coating Requirements Working Group
Presenter/Committee Chair: Jason Keeping, Project Manager, Ruggedized Electronics, Celestica
Presenter/Committee Chair: Douglas Pauls, Principle Materials Process Engineer, Rockwell Collins
Seminar Type: Standards Development Committee Meeting
Track: Assembly Processes for Lead Free and Tin-Lead
General Committee: Cleaning and Coating
Location: 10
Wed, Feb 15, 2017 - 8:00 AM to 12:00 PM
7-31BT: IPC-A-610 Technical Training Committee
Presenter/Committee Chair: Robert Cooke, Aerospace Engineer, NASA Johnson Space Center
Presenter/Committee Chair: Debbie Wade MIT
Seminar Type: Standards Development Committee Meeting
Track: Assembly Processes for Lead Free and Tin-Lead
General Committee: Product Assurance
Location: 17B
Wed, Feb 15, 2017 - 8:00 AM to 12:00 PM
7-31F: IPC/WHMA-A-620 Task Group
Presenter/Committee Chair: Brett Miller, VP Engineering, USA Harness, Inc.
Presenter/Committee Chair: George Millman Jr. MIT
Presenter/Committee Chair: Bud Bowen
Presenter/Committee Chair: Richard Rumas, Materials & Process Eng, Honeywell Canada
Seminar Type: Standards Development Committee Meeting
Track: Quality, Reliability and Test
General Committee: Product Assurance
Location: 14A
Wed, Feb 15, 2017 - 8:00 AM to 5:00 PM
7-31H/7-31K: Joint Meeting - IPC-HDBK-620 Handbook and Wire Harness Design Task Groups
Presenter/Committee Chair: Robert Cooke, Aerospace Engineer, NASA Johnson Space Center
Presenter/Committee Chair: Brett Miller, VP Engineering, USA Harness, Inc.
Seminar Type: Standards Development Committee Meeting
Track: Quality, Reliability and Test
General Committee: Product Assurance
Location: 13
Wed, Feb 15, 2017 - 8:00 AM to 10:00 AM
D-15: Flexible Circuits Test Methods Subcommittee
Presenter/Committee Chair: Russell Shepherd MIT, Operations Manager, National Technical Systems Anaheim
Seminar Type: Standards Development Committee Meeting
Track: PCB Fabrication and Materials
General Committee: Flexible and Rigid-Flex Printed Boards
Location: 11A
Wed, Feb 15, 2017 - 8:00 AM to 10:00 AM
D-22: High Speed/High Frequency Board Performance Subcommittee
Presenter/Committee Chair: Lance Auer, PWB Technical Lead, Raytheon Missile Systems
Presenter/Committee Chair: Mahendra Gandhi
Seminar Type: Standards Development Committee Meeting
Track: PCB Fabrication and Materials
General Committee: High Speed/High Frequency Interconnections
Location: 14B
Wed, Feb 15, 2017 - 8:00 AM to 12:00 PM
E-30: Conflict Minerals Due Diligence Committee
Presenter/Committee Chair: David Carnevale, Compliance Engineer, Dolby Laboratories
Presenter/Committee Chair: John Ciba Jr., Managing Director
Seminar Type: Standards Development Committee Meeting
Track: Supply Chain/Business Issues
General Committee: Management
Location: 8
Wed, Feb 15, 2017 - 9:00 AM to 12:00 PM
2-16: Product Data Description (2581)
Presenter/Committee Chair: Gary Carter, Independent Consultant
Seminar Type: Standards Development Committee Meeting
Track: Design
General Committee: Electronic Product Data Description
Location: 12
Wed, Feb 15, 2017 - 10:00 AM to 12:00 PM
4-34B: Marking, Symbols and Labels for Identification of Assemblies, Components and Devices Task Group
Presenter/Committee Chair: Stephen Tisdale, Product Ecology Engineering Manager, Intel Corporation
Seminar Type: Standards Development Committee Meeting
Track: Environmental Issues and Compliance
General Committee: Environment, Health & Safety (EHS)
Location: 11B
Wed, Feb 15, 2017 - 10:00 AM to 3:00 PM
5-33A: Conformal Coating Task Group
Presenter/Committee Chair: Debora Obitz MIT, Manager of IPC Training Programs, National Technical Systems Anaheim
Presenter/Committee Chair: John Waryold, Consultant, HumiSeal Division of Chase Corporation
Seminar Type: Standards Development Committee Meeting
Track: Assembly Processes for Lead Free and Tin-Lead
General Committee: Cleaning and Coating
Location: 10
Wed, Feb 15, 2017 - 10:15 AM to 12:00 PM
4-14: Plating Processes Subcommittee
Presenter/Committee Chair: George Milad, National Accounts Mgr for Technology, Uyemura International Corp.
Seminar Type: Standards Development Committee Meeting
Track: PCB Fabrication and Materials
General Committee: Fabrication Processes
Location: 7A
Wed, Feb 15, 2017 - 10:15 AM to 12:00 PM
5-21F: Ball Grid Array Task Group
Presenter/Committee Chair: Ray Prasad, Consultant, Ray Prasad Consultancy Group
Seminar Type: Standards Development Committee Meeting
Track: Assembly Processes for Lead Free and Tin-Lead
General Committee: Assembly and Joining
Location: 18
Wed, Feb 15, 2017 - 10:15 AM to 12:00 PM
D-12: Flexible Circuits Specifications Subcommittee
Presenter/Committee Chair: Nick Koop CID, Sr. Field Application Engineer, TTM Technologies
Presenter/Committee Chair: Mahendra Gandhi
Seminar Type: Standards Development Committee Meeting
Track: PCB Fabrication and Materials
General Committee: Flexible and Rigid-Flex Printed Boards
Location: 11A
Wed, Feb 15, 2017 - 10:15 AM to 12:00 PM
D-24D: High Frequency Loss Test Methods Task Group
Presenter/Committee Chair: Xiaoning Ye, Principal Engineer, Intel Corporation
Presenter/Committee Chair: Brian Butler
Seminar Type: Standards Development Committee Meeting
Track: Quality, Reliability and Test
General Committee: High Speed/High Frequency Interconnections
Location: 14B
Wed, Feb 15, 2017 - 1:30 PM to 5:00 PM
1-13: Land Pattern Subcommittee
Presenter/Committee Chair: Gary Ferrari MIT, Director of Technical Support, FTG Circuits
Presenter/Committee Chair: Karen McConnell CID, Manager, EDA, Northrop Grumman Corporation
Seminar Type: Standards Development Committee Meeting
Track: Design
General Committee: Printed Board Design Technology
Location: 18
Wed, Feb 15, 2017 - 1:30 PM to 5:00 PM
2-18H: Conflict Minerals Data Exchange Task Group
Presenter/Committee Chair: Eric Straw, Pr. Project Manager, Rockwell Collins
Presenter/Committee Chair: Aidan Turnbull Ph.D., Managing Director, BomCheck
Seminar Type: Standards Development Committee Meeting
Track: Supply Chain/Business Issues
General Committee: Electronic Product Data Description
Location: 8
Wed, Feb 15, 2017 - 1:30 PM to 5:00 PM
5-22BT: J-STD-001 Technical Training Committee
Presenter/Committee Chair: Daniel Foster CIT, Quality Assurance Specialist, Missile Defense Agency
Presenter/Committee Chair: Zenaida Valianu MIT
Seminar Type: Standards Development Committee Meeting
Track: Assembly Processes for Lead Free and Tin-Lead
General Committee: Assembly and Joining
Location: 17B
Wed, Feb 15, 2017 - 1:30 PM to 3:00 PM
7-12: Microsection Subcommittee
Presenter/Committee Chair: Russell Shepherd MIT, Operations Manager, National Technical Systems Anaheim
Presenter/Committee Chair: Vicka Hammill, Staff Engineer, Honeywell Inc. Air Transport Systems
Seminar Type: Standards Development Committee Meeting
Track: Cleaning/Coating/Contamination
General Committee: Testing
Location: 14B
Wed, Feb 15, 2017 - 1:30 PM to 5:00 PM
7-31J: Electronic Box Assemblies Task Group
Presenter/Committee Chair: Eddie Hofer, M&P Engineer, Rockwell Collins
Presenter/Committee Chair: Dave Harrell CIT
Presenter/Committee Chair: Richard Rumas, Materials & Process Eng, Honeywell Canada
Seminar Type: Standards Development Committee Meeting
Track: Assembly Processes for Lead Free and Tin-Lead
General Committee: Product Assurance
Location: 15A
Wed, Feb 15, 2017 - 1:30 PM to 3:00 PM
D-11: Flexible Circuits Design Subcommittee
Presenter/Committee Chair: Mark Finstad CID, Senior Appication Engineer, Flexible Circuit Technologies, Inc.
Presenter/Committee Chair: William Ortloff Sr., Engineering Fellow, Raytheon Company
Seminar Type: Standards Development Committee Meeting
Track: Design
General Committee: Flexible and Rigid-Flex Printed Boards
Location: 11A
Wed, Feb 15, 2017 - 1:30 PM to 3:00 PM
D-23: High Speed/High Frequency Base Materials Subcommittee
Presenter/Committee Chair: Dan Welch
Presenter/Committee Chair: Edward Sandor, Application Engineering Mgr, Taconic Advanced Dielectric Division
Seminar Type: Standards Development Committee Meeting
General Committee: Base Materials
Location: 12
Wed, Feb 15, 2017 - 1:30 PM to 5:00 PM
D-60: Printed Electronics Committee - Reporting Session
Presenter/Committee Chair: Daniel Gamota, President, Printovate Technologies, Inc.
Presenter/Committee Chair: Neil Bolding, Manager, Technical Services & Quality, MacDermid Enthone Electronics Solutions
Seminar Type: Standards Development Committee Meeting
Track: Printed Electronics
General Committee: Printed Electronics
Location: 14A
Wed, Feb 15, 2017 - 1:30 PM to 5:00 PM
SPVC: IPC Solder Products Value Council(By Invitation)
Seminar Type: Standards Development Committee Meeting
General Committee: Managment
Location: 11B
Wed, Feb 15, 2017 - 3:15 PM to 5:00 PM
5-33C: Conformal Coat Handbook
Presenter/Committee Chair: Amy Hagnauer, Manufacturing Engineer, Raytheon Company
Presenter/Committee Chair: Fonda Wu
Presenter/Committee Chair: Jason Keeping, Project Manager, Ruggedized Electronics, Celestica
Seminar Type: Standards Development Committee Meeting
General Committee: Cleaning and Coating
Location: 10
Wed, Feb 15, 2017 - 3:15 PM to 5:00 PM
8-41: Technology Roadmap Subcommittee
Presenter/Committee Chair: John Fisher, Owner, Interconnect Technology Analysis, Inc.
Presenter/Committee Chair: Michael Carano, VP Technology & Business Development, RBP Chemical Technology, Inc.
Seminar Type: Standards Development Committee Meeting
Track: Supply Chain/Business Issues
General Committee: Management
Location: 12
Wed, Feb 15, 2017 - 3:15 PM to 5:00 PM
B-11: 3-D Electronic Packages Subcommittee
Presenter/Committee Chair: Vern Solberg, Sr Consultant, Solberg Technical Consulting
Presenter/Committee Chair: Dudi Amir
Seminar Type: Standards Development Committee Meeting
General Committee: Packaged Electronic Components
Location: 14B
Wed, Feb 15, 2017 - 3:15 PM to 5:00 PM
D-13: Flexible Circuits Base Materials Subcommittee
Presenter/Committee Chair: Clark Webster, Applications Engineer, ALL Flex LLC
Seminar Type: Standards Development Committee Meeting
Track: PCB Fabrication and Materials
General Committee: Flexible and Rigid-Flex Printed Boards
Location: 11A
Wed, Feb 15, 2017 - 3:30 PM to 5:00 PM
5-31G: Stencil Cleaning Task Group
Presenter/Committee Chair: Mike Bixenman DBA, CTO, Kyzen Corporation
Presenter/Committee Chair: Greg Wade, Global Technical Support Engineer, Indium Corporation
Seminar Type: Standards Development Committee Meeting
Track: Cleaning/Coating/Contamination
General Committee: Cleaning and Coating
Location: 7A
Thu, Feb 16, 2017 - 7:30 AM to 9:00 AM
3-11G: Corrosion of Metal Finishes Task Group
Presenter/Committee Chair: Beverley Christian Ph.D., HDP User Group
Presenter/Committee Chair: Helen Holder
Seminar Type: Standards Development Committee Meeting
Track: Quality, Reliability and Test
General Committee: Base Materials
Location: 17B
Thu, Feb 16, 2017 - 8:00 AM to 5:00 PM
2-18K: Material Declaration Data Exchange for Aerospace and Defense Task Group
Presenter/Committee Chair: Jean-Pierre Theret, EcoDesign Leader, Dassault Systemes
Presenter/Committee Chair: Rick Shanks, Manager Design for Sustainability, Pratt & Whitney
Presenter/Committee Chair: N. Nagaraj Ph.D., Chief, Papros, Inc.
Presenter/Committee Chair: Walter Jager, Principal Consultant, ECD Compliance
Seminar Type: Standards Development Committee Meeting
Track: Environmental Issues and Compliance
General Committee: Electronic Product Data Description
Location: 14B
Thu, Feb 16, 2017 - 8:00 AM to 12:00 PM
5-21M: Cold Joining/Press-fit Task Group
Presenter/Committee Chair: Hans Peter Tranitz Ph.D., Continental Automotive GmbH
Presenter/Committee Chair: Udo Welzel, Development Engineer, Robert Bosch GmbH
Seminar Type: Standards Development Committee Meeting
Track: Assembly Processes for Lead Free and Tin-Lead
General Committee: Assembly and Joining
Location: 18
Thu, Feb 16, 2017 - 8:00 AM to 5:00 PM
5-22BT: Process Engineering Program Technical Training Committee
Presenter/Committee Chair: Daniel Foster CIT, Quality Assurance Specialist, Missile Defense Agency
Presenter/Committee Chair: Zenaida Valianu MIT
Seminar Type: Standards Development Committee Meeting
Track: Assembly Processes for Lead Free and Tin-Lead
General Committee: Assembly and Joining
Location: 12
Thu, Feb 16, 2017 - 8:00 AM to 12:00 PM
7-31J: Electronic Box Assemblies Task Group
Presenter/Committee Chair: Dave Harrell CIT
Presenter/Committee Chair: Richard Rumas, Materials & Process Eng, Honeywell Canada
Presenter/Committee Chair: Eddie Hofer, M&P Engineer, Rockwell Collins
Seminar Type: Standards Development Committee Meeting
Track: Assembly Processes for Lead Free and Tin-Lead
General Committee: Product Assurance
Location: 15A
Thu, Feb 16, 2017 - 8:00 AM to 5:00 PM
D-61/D-64: Joint Meeting: Printed Electronics Design and Printed Electronics Final Assembly Subcommittees Working Meeting
Presenter/Committee Chair: Alan Burk, President, ALMAX
Presenter/Committee Chair: Richard Snogren
Presenter/Committee Chair: Jeff Shubrooks, Engineer, Raytheon Company
Presenter/Committee Chair: Michael Jawitz, Principle Engineer, Orbital ATK
Seminar Type: Standards Development Committee Meeting
Track: Printed Electronics
General Committee: Printed Electronics
Location: 13
Thu, Feb 16, 2017 - 8:30 AM to 5:00 PM
D-66: Printed Electronics Processes Subcommittee
Seminar Type: Standards Development Committee Meeting
Track: Printed Electronics
General Committee: Printed Electronics
Location: 14A
Thu, Feb 16, 2017 - 9:00 AM to 1:00 PM
UL STP Committee (By invitation only)
Seminar Type: Standards Development Committee Meeting
General Committee: Testing
Location: 7A
Thu, Feb 16, 2017 - 1:00 PM to 5:00 PM
D-70: Conductive Fabrics, E-Textiles and Stretchable Electronics Committee
Seminar Type: Standards Development Committee Meeting
Location: 18
Thu, Feb 16, 2017 - 1:00 PM to 2:00 PM
Organizational Meeting for Pulse-of-the-Industry Statistical Program
Seminar Type: Standards Development Committee Meeting
Location: 6F
Fri, Feb 17, 2017 - 8:00 AM to 5:00 PM
2-18K: Material Declaration Data Exchange for Aerospace and Defense Task Group
Presenter/Committee Chair: Jean-Pierre Theret, EcoDesign Leader, Dassault Systemes
Presenter/Committee Chair: Rick Shanks, Manager Design for Sustainability, Pratt & Whitney
Presenter/Committee Chair: N. Nagaraj Ph.D., Chief, Papros, Inc.
Presenter/Committee Chair: Walter Jager, Principal Consultant, ECD Compliance
Seminar Type: Standards Development Committee Meeting
Track: Environmental Issues and Compliance
General Committee: Electronic Product Data Description
Location: 14B
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