APEX EXPO 2017 Agenda Planner

Tue, Feb 14, 2017 - 1:30 PM to 3:00 PM S01: Printing I Presenter/Committee Chair: Jeff Schake, Senior Advanced Technology Specialist, ASM Assembly Systems Presenter/Committee Chair: Tom Watson, Master Black Belt, Kimball Electronics Presenter/Committee Chair: Jimmy Villalvazo, Innovation Director, InterLatin Inc. Presenter/Committee Chair: Gabriel Briceno Ph.D., Senior Process Engineer, Qual-Pro Corporation Seminar Type: Technical Conference Session Track: Assembly Processes for Lead-Free and Tin Lead Location: 1A Printing I
Tue, Feb 14, 2017 - 1:30 PM to 3:00 PM S02: Printed Electronics I Presenter/Committee Chair: Alan Burk, President, ALMAX Presenter/Committee Chair: Jesse Greenwood, Hazardous Print Consulting Inc. Presenter/Committee Chair: Art Dobie, Technical Sales Rep, Ikonics Corp. Seminar Type: Technical Conference Session Track: Printed Electronics Location: 4 S02: Printed Electronics I
Tue, Feb 14, 2017 - 1:30 PM to 3:00 PM S03: High Speed/ High Frequency I Presenter/Committee Chair: David Hoover, Field Application Engineer, TTM Technologies Presenter/Committee Chair: Fei Peng Ph.D., Senoir Research Chemist, MacDermid Enthone Electronics Solutions Presenter/Committee Chair: John Coonrod, Technical Marketing Manager, Rogers Corporation Seminar Type: Technical Conference Session Track: PCB Fabrication and Materials Location: 2 S03: High Speed/ High Frequency I
Tue, Feb 14, 2017 - 1:30 PM to 3:00 PM S04: Corrosion/ SIR Reliability I Presenter/Committee Chair: Julie Silk, Keysight Technologies Inc. Presenter/Committee Chair: Prabjit Singh, IBM Corporation Presenter/Committee Chair: Mike Bixenman DBA, CTO, Kyzen Corporation Seminar Type: Technical Conference Session Track: Cleaning/Coating/Contamination Location: 3 S04: Corrosion/ SIR Reliability I
Tue, Feb 14, 2017 - 1:30 PM to 3:00 PM S05: Solder Reliability I Presenter/Committee Chair: Jason Fullerton, Customer Technical Support Engineer, Alpha Presenter/Committee Chair: Udo Welzel, Development Engineer, Robert Bosch GmbH Presenter/Committee Chair: Ning-Cheng Lee Ph.D., VP of Technology, Indium Corporation Presenter/Committee Chair: Shantanu Joshi, Technical Sales Engineer, Koki Solder America Inc. Seminar Type: Technical Conference Session Track: Assembly Processes for Lead Free and Tin-Lead Location: 1B S05: Solder Reliability I
Tue, Feb 14, 2017 - 3:30 PM to 5:00 PM S06: Printing II/ Miniaturization Presenter/Committee Chair: Jeff Schake, Senior Advanced Technology Specialist, ASM Assembly Systems Presenter/Committee Chair: Greg Smith, Technical Sales, FCT Assembly, Inc. Presenter/Committee Chair: Scott Wischoffer, Marketing Manager, Fuji America Corporation Presenter/Committee Chair: Clive Ashmore, R&D Engineer, ASM Assembly Systems Seminar Type: Technical Conference Session Track: Assembly Processes for Lead Free and Tin-Lead Location: 1A S06: Printing II/ Miniaturization
Tue, Feb 14, 2017 - 3:30 PM to 5:00 PM S07: Test I Presenter/Committee Chair: Steve Butkovich, Consultant, Test Innovation, LLC. Presenter/Committee Chair: Sivakumar Vijayakumar, Keysight Technologies Presenter/Committee Chair: Louis Ungar, President, Advanced Test Engineering Solutions, Inc. Presenter/Committee Chair: Jun Balangue Jr., Keysight Technologies Seminar Type: Technical Conference Session Track: Quality, Reliability and Test Location: 1B S07: Test I
Tue, Feb 14, 2017 - 3:30 PM to 5:00 PM S08: PCB Laminate and Foils Presenter/Committee Chair: Karl Sauter, Principal Engineer, Oracle America, Inc. Presenter/Committee Chair: Andrew Piotrowski, ICL-IP America Presenter/Committee Chair: Kazuki Kammuri, Technology Development, Nippon Mining & Metals Co. Ltd Seminar Type: Technical Conference Session Track: PCB Fabrication and Materials Location: 3 S08: PCB Laminate and Foils
Tue, Feb 14, 2017 - 3:30 PM to 5:00 PM S09: SIR/Flux Reliability Presenter/Committee Chair: Jasbir Bath, Principal Engineer Presenter/Committee Chair: Christopher Hunt Ph.D., Technology Leader, Gen3 Systems Presenter/Committee Chair: Shantanu Joshi, Technical Sales Engineer, Koki Solder America Inc. Presenter/Committee Chair: Eric Bastow, Field Application Engineer, Indium Corporation Seminar Type: Technical Conference Session Track: Quality, Reliability and Test Location: 4 S09: SIR/Flux Reliability
Tue, Feb 14, 2017 - 3:30 PM to 5:00 PM S10: Supply Chain I Presenter/Committee Chair: Paul Zutter, Electronics Engineer, U.S. Army Aviation & Missile Command Presenter/Committee Chair: William Loving, President & CEO, ScanCAD International, Inc. Presenter/Committee Chair: Martin Goetz, Sr. Manager, Northrop Grumman Corporation Seminar Type: Technical Conference Session Track: Supply Chain/Business Issues Location: 2 S10: Supply Chain I
Wed, Feb 15, 2017 - 10:30 AM to 12:00 PM S14 Corrosion/Cleanliness/SIR Reliability Presenter/Committee Chair: Beverley Christian Ph.D., HDP User Group Presenter/Committee Chair: Martin Wickham, NPL Presenter/Committee Chair: Eric Camden, Lead Investigator, Foresite, Inc. Presenter/Committee Chair: Pierre Eckold, PhD Student, Robert Bosch GmbH Presenter/Committee Chair: Mark Routley, Production Manager, Gen3 Systems Limited Seminar Type: Technical Conference Session Track: Cleaning/Coating/Contamination Location: 3 S14_01 - Martin Wickham, NPL S14_02 - Brook Sandy-Smith, Indium Corporation S14_03 - Pierre Eckold, Robert Bosch & Mark Routley, Robert Bosch
Wed, Feb 15, 2017 - 10:30 AM to 12:00 PM S11: Voiding & Solder Reflow Presenter/Committee Chair: Jason Fullerton, Customer Technical Support Engineer, Alpha Presenter/Committee Chair: Timothy O'Neill, Technical Marketing Manager, AIM, Inc. Presenter/Committee Chair: Anthony Lentz, Field Application Engineer, FCT Assembly, Inc. Seminar Type: Technical Conference Session Track: Assembly Processes for Lead Free and Tin-Lead Location: 1B S11: Voiding & Solder Reflow
Wed, Feb 15, 2017 - 10:30 AM to 12:00 PM S12: Printed Electronics II Presenter/Committee Chair: Jeff Schake, Senior Advanced Technology Specialist, ASM Assembly Systems Presenter/Committee Chair: Leonard Allison, Business Manager, Engineered Materials Systems, Inc. Presenter/Committee Chair: Samuel LeBlanc, nScrypt Inc. Presenter/Committee Chair: MaryAlice Gill, Process Engineer, Jabil Circuit, Inc. Seminar Type: Technical Conference Session Track: Printed Electronics Location: 4 S12: Printed Electronics II
Wed, Feb 15, 2017 - 10:30 AM to 12:00 PM S13: PCB Plating and Fabrication and Component Technologies Presenter/Committee Chair: Saminda Dharmarathna Ph.D., Senior Research Scientist, MacDermid Enthone Electronics Solutions Presenter/Committee Chair: Joel Schrauben, Electro Scientific Industries, Inc. Presenter/Committee Chair: John Lau Ph.D., Sr. Technical Advisor, ASM Assembly Materials Ltd. Presenter/Committee Chair: Gary Ferrari MIT, Director of Technical Support, FTG Circuits Seminar Type: Technical Conference Session Track: PCB Fabrication and Materials & Emerging Technologies Location: 1A S13: PCB Plating and Fabrication and Component Technologies
Wed, Feb 15, 2017 - 10:30 AM to 12:00 PM S15: Reliability I Presenter/Committee Chair: Bhanu Sood, Commodity Risk Assessment Engineer (PCB), NASA Goddard Space Flight Center Presenter/Committee Chair: Neil Hubble, Application Engineer, Akrometrix LLC Presenter/Committee Chair: Reza Ghaffarian Ph.D., Principal Eng., Jet Propulsion Laboratory Presenter/Committee Chair: Dock Brown, Sr. Member of Technical Staff, DfR Solutions Seminar Type: Technical Conference Session Track: Quality, Reliability and Test Location: 2 S15: Reliability I
Wed, Feb 15, 2017 - 1:30 PM to 3:00 PM S17: Rework I Presenter/Committee Chair: Russell Nowland, Repair Strategy & Supplier Management, Nokia Presenter/Committee Chair: Paul Wood, Advanced Product Applications Manager, OK International Presenter/Committee Chair: Robert Roush, Product Manager, OK International Presenter/Committee Chair: Shantanu Joshi, Technical Sales Engineer, Koki Solder America Inc. Seminar Type: Technical Conference Session Track: Assembly Processes for Lead Free and Tin-Lead Location: 1A S17: Rework I
Wed, Feb 15, 2017 - 1:30 PM to 3:00 PM S19: High Speed/High Frequency II Presenter/Committee Chair: David Hoover, Field Application Engineer, TTM Technologies Presenter/Committee Chair: James Fuller, Vice President Engineering, Sanmina Corporation Presenter/Committee Chair: Karl Sauter, Principal Engineer, Oracle America, Inc. Presenter/Committee Chair: Seiya Kido, MEC Company, Ltd. Seminar Type: Technical Conference Session Track: PCB Fabrication and Materials Location: 2 S19: High Speed/High Frequency II
Wed, Feb 15, 2017 - 1:30 PM to 3:00 PM S20: Cleanliness/Reliability Presenter/Committee Chair: Jasbir Bath, Principal Engineer Presenter/Committee Chair: Ravi Parthasarathy, Senior Process Engineer, ZESTRON Americas Presenter/Committee Chair: Azita Yazdani, President & CEO, Exergy Technologies Corporation Presenter/Committee Chair: Gustavo Arredondo, Technical Manager, Para Tech Coating Inc. Seminar Type: Technical Conference Session Track: Cleaning/Coating/Contamination Location: 4 S20: Cleanliness/Reliability
Wed, Feb 15, 2017 - 1:30 PM to 3:00 PM S21: Reliability II Presenter/Committee Chair: Martin Goetz, Sr. Manager, Northrop Grumman Corporation Presenter/Committee Chair: Jagadeesh Radhakrishnan, Quality and Reliability Engineer, Intel Corporation Presenter/Committee Chair: Greg Smith, Technical Sales, FCT Assembly, Inc. Seminar Type: Technical Conference Session Track: Quality, Reliability and Test & Assembly Processes for Lead-Free and Tin Lead Location: 3 S21: Reliability II
Wed, Feb 15, 2017 - 3:30 PM to 4:30 PM S16: Dispensing Presenter/Committee Chair: Brian Toleno Ph.D., Principal Material Scientist, Microsoft Corporation Presenter/Committee Chair: Gustaf Maertensson Ph.D., Researcher, Chalmers University of Technology Presenter/Committee Chair: Maria Durham, Product Speicalist, Indium Corporation Seminar Type: Technical Conference Session Track: Assembly Processes for Lead-Free and Tin Lead Location: 3 S16: Dispensing
Wed, Feb 15, 2017 - 3:30 PM to 4:30 PM S18:Test II Presenter/Committee Chair: Steve Butkovich, Consultant, Test Innovation, LLC. Presenter/Committee Chair: Mahesh Narayanaswamy, Electrical Engineer, GE Healthcare Presenter/Committee Chair: David Geiger, Director Advanced Engineering Group, Flextronics International Seminar Type: Technical Conference Session Track: Quality, Reliability and Test Location: 1B S18: Test II
Wed, Feb 15, 2017 - 3:30 PM to 4:30 PM S28: Supply Chain II Presenter/Committee Chair: Russell Nowland, Repair Strategy & Supplier Management, Nokia Presenter/Committee Chair: Tommy Fox, COO, Optimal Electronics Corporation Presenter/Committee Chair: Jeffrey Rupert, Director of Advanced Technology & Busine, ScanCAD International, Inc. Seminar Type: Technical Conference Session Track: Supply Chain/Business Issues Location: 1A S28: Supply Chain II
Thu, Feb 16, 2017 - 9:00 AM to 10:00 AM S22: Underfill Presenter/Committee Chair: Jason Keeping, Project Manager, Ruggedized Electronics, Celestica Presenter/Committee Chair: Maxim Serebreni, Research Engineer, DfR Solutions Presenter/Committee Chair: Luis Lopez, Northrop Grumman Corporation Seminar Type: Technical Conference Session Track: Quality, Reliability and Test & Assembly Processes for Lead-Free and Tin Lead Location: 1A S22: Underfill
Thu, Feb 16, 2017 - 9:00 AM to 10:00 AM S31: PCB Surface Finishes Presenter/Committee Chair: Lenora Clark, Director of End User Applications, MacDermid Enthone Electronics Solutions Presenter/Committee Chair: Rick Nichols, Atotech Deutschland GmbH Presenter/Committee Chair: Reza Ghaffarian Ph.D., Principal Eng., Jet Propulsion Laboratory Seminar Type: Technical Conference Session Track: Quality, Reliability and Test & PCB Fabrication and Materials Location: 2 S31: PCB Surface Finishes
Thu, Feb 16, 2017 - 9:00 AM to 10:00 AM S33: Supply Chain 3/ Automation Presenter/Committee Chair: Martin Goetz, Sr. Manager, Northrop Grumman Corporation Presenter/Committee Chair: Ryo Murakami Ph.D., Fujitsu Laboratories Presenter/Committee Chair: Brenda Martin, President, Zollner Electronics Presenter/Committee Chair: Eric Bastow, Field Application Engineer, Indium Corporation Seminar Type: Technical Conference Session Track: Supply Chain/Business Issues Location: 3 S33: Supply Chain 3/ Automation
Thu, Feb 16, 2017 - 9:00 AM to 10:00 AM S35: Emerging Technologies Presenter/Committee Chair: Vern Solberg, Sr Consultant, Solberg Technical Consulting Presenter/Committee Chair: Catherine Shearer, Sr. Scientist, Ormet Circuits, Inc. Presenter/Committee Chair: Bernard Candaele, Director, Electronic Technologies Components, Thales Communications & Security Seminar Type: Technical Conference Session Track: Emerging Technologies Location: 4 S35: Emerging Technologies
Thu, Feb 16, 2017 - 10:30 AM to 12:00 PM S36: Conformal Coatings Presenter/Committee Chair: Beverley Christian Ph.D., HDP User Group Presenter/Committee Chair: Junaid Shafaat, Manufacturing Engineer, Schneider Electric Presenter/Committee Chair: Aysegul Nebioglu Ph.D., Adhesive R&D Group Leader, Dymax Corporation Presenter/Committee Chair: Jason Keeping, Project Manager, Ruggedized Electronics, Celestica Presenter/Committee Chair: Lee Hitchens, Technical Director, SCH Services Ltd. Seminar Type: Technical Conference Session Track: Cleaning/Coating/Contamination Location: 1B S36: Conformal Coatings
Thu, Feb 16, 2017 - 10:30 AM to 12:00 PM S32: PCB Fabrication/Assembly Reliability Presenter/Committee Chair: David Hoover, Field Application Engineer, TTM Technologies Presenter/Committee Chair: Bhanu Sood, Commodity Risk Assessment Engineer (PCB), NASA Goddard Space Flight Center Presenter/Committee Chair: Steven Perng, Technical Leader, Cisco Systems Inc. Presenter/Committee Chair: Jeffrey Lee Sr. CIT, Assistant Vice President, iST - Integrated Service Technology Seminar Type: Technical Conference Session Track: Quality, Reliability and Test & PCB Fabrication and Materials Location: 2 S32: PCB Fabrication/Assembly Reliability
Thu, Feb 16, 2017 - 10:30 AM to 12:00 PM S34: Rework II Presenter/Committee Chair: Russell Nowland, Repair Strategy & Supplier Management, Nokia Presenter/Committee Chair: Bob Wettermann MIT, President, BEST-Michigan Presenter/Committee Chair: Joerg Nolte, ERSA GmbH Presenter/Committee Chair: Lars Bruno, Product Engineer, Ericsson AB Seminar Type: Technical Conference Session Track: Assembly Processes for Lead Free and Tin-Lead Location: 1A S34: Rework II
Thu, Feb 16, 2017 - 10:30 AM to 12:00 PM S37: Solder Reliability III Presenter/Committee Chair: Denis Jean, Technology Manager, Kester Presenter/Committee Chair: Keith Sweatman, Nihon Superior Co., Ltd. Presenter/Committee Chair: Brook Sandy-Smith, Product Support Specialist, Indium Corporation Presenter/Committee Chair: Amir Nobari, 5N Plus Inc. Seminar Type: Technical Conference Session Track: Quality, Reliability and Test & Assembly Processes for Lead-Free and Tin Lead Location: 4 S37: Solder Reliability III
Thu, Feb 16, 2017 - 10:30 AM to 12:00 PM S38: Reflow and Reflow Oven Presenter/Committee Chair: Jason Fullerton, Customer Technical Support Engineer, Alpha Presenter/Committee Chair: Mitchell Holtzer, Global CTS Director, Alpha Presenter/Committee Chair: Gerjan Diepstraten CIT, Advanced Technology Manager, Vitronics Soltec Seminar Type: Technical Conference Session Track: Assembly Processes for Lead-Free and Tin Lead Location: 3 S38: Reflow and Reflow Oven