APEX EXPO 2017 Agenda Planner

Tue, Feb 14, 2017 - 3:15 PM to 5:00 PM 5-24C: Solder Alloy Task Group Presenter/Committee Chair: Jennie Hwang Ph.D., Sc.D., CEO, H-Technologies Group Presenter/Committee Chair: David Adams Seminar Type: Standards Development Committee Meeting Track: Assembly Processes for Lead Free and Tin-Lead General Committee: Assembly and Joining Location: 10
Tue, Feb 14, 2017 - 3:15 PM to 5:00 PM 6-10D: SMT Attachment Reliability Test Methods Task Group Presenter/Committee Chair: Reza Ghaffarian Ph.D., Principal Eng., Jet Propulsion Laboratory Presenter/Committee Chair: Vasu Vasudevan Seminar Type: Standards Development Committee Meeting General Committee: Product Reliability Location: 11B
Tue, Feb 14, 2017 - 3:15 PM to 5:00 PM 7-31AT: IPC-A-600 Technical Training Committee Presenter/Committee Chair: Leo Lambert MIT, Vice President, EPTAC Corporation Presenter/Committee Chair: Debora Obitz MIT, Manager of IPC Training Programs, National Technical Systems Anaheim Seminar Type: Standards Development Committee Meeting Track: PCB Fabrication and Materials General Committee: Product Assurance Location: 18
Tue, Feb 14, 2017 - 3:15 PM to 5:00 PM D-24C: High Frequency Test Methods Task Group: Frequency-Domain Methods Presenter/Committee Chair: John Coonrod, Technical Marketing Manager, Rogers Corporation Presenter/Committee Chair: Glenn Oliver, Senior Engineer, DuPont - RTP Seminar Type: Standards Development Committee Meeting Track: Quality, Reliability and Test General Committee: High Speed/High Frequency Interconnections Location: 12
Tue, Feb 14, 2017 - 3:30 PM to 5:00 PM BZ3: Printed Electronics -- Will Your Company Have the Flexibility to Adapt to These Technologies? Presenter/Committee Chair: Neil Bolding, Manager, Technical Services & Quality, MacDermid Enthone Electronics Solutions Presenter/Committee Chair: Udi Zamwel, Product Manager, Nano Dimension Presenter/Committee Chair: Mike O’Reilly, Director, Optomec Presenter/Committee Chair: Ben Leever, NextFlex Presenter/Committee Chair: Christian Whitchurch, Defense Threat Reduction Agency Presenter/Committee Chair: Daniel Gamota, Dir of Advanced Manufacturing Engrng, Jabil Circuit, Inc. (HQ) Seminar Type: Buzz Session Location: 5A Mike O’Reilly Udi Zamwel
Tue, Feb 14, 2017 - 3:30 PM to 5:00 PM BZ4: IPC Government Relations 101, Why Working with Policy Makers is Important? Seminar Type: Buzz Session Location: 5B
Tue, Feb 14, 2017 - 3:30 PM to 5:00 PM S06: Printing II/ Miniaturization Presenter/Committee Chair: Jeff Schake, Senior Advanced Technology Specialist, ASM Assembly Systems Presenter/Committee Chair: Greg Smith, Technical Sales, FCT Assembly, Inc. Presenter/Committee Chair: Scott Wischoffer, Marketing Manager, Fuji America Corporation Presenter/Committee Chair: Clive Ashmore, R&D Engineer, ASM Assembly Systems Seminar Type: Technical Conference Session Track: Assembly Processes for Lead Free and Tin-Lead Location: 1A S06: Printing II/ Miniaturization
Tue, Feb 14, 2017 - 3:30 PM to 5:00 PM S07: Test I Presenter/Committee Chair: Steve Butkovich, Consultant, Test Innovation, LLC. Presenter/Committee Chair: Sivakumar Vijayakumar, Keysight Technologies Presenter/Committee Chair: Louis Ungar, President, Advanced Test Engineering Solutions, Inc. Presenter/Committee Chair: Jun Balangue Jr., Keysight Technologies Seminar Type: Technical Conference Session Track: Quality, Reliability and Test Location: 1B S07: Test I
Tue, Feb 14, 2017 - 3:30 PM to 5:00 PM S08: PCB Laminate and Foils Presenter/Committee Chair: Karl Sauter, Principal Engineer, Oracle America, Inc. Presenter/Committee Chair: Andrew Piotrowski, ICL-IP America Presenter/Committee Chair: Kazuki Kammuri, Technology Development, Nippon Mining & Metals Co. Ltd Seminar Type: Technical Conference Session Track: PCB Fabrication and Materials Location: 3 S08: PCB Laminate and Foils
Tue, Feb 14, 2017 - 3:30 PM to 5:00 PM S09: SIR/Flux Reliability Presenter/Committee Chair: Jasbir Bath, Principal Engineer Presenter/Committee Chair: Christopher Hunt Ph.D., Technology Leader, Gen3 Systems Presenter/Committee Chair: Shantanu Joshi, Technical Sales Engineer, Koki Solder America Inc. Presenter/Committee Chair: Eric Bastow, Field Application Engineer, Indium Corporation Seminar Type: Technical Conference Session Track: Quality, Reliability and Test Location: 4 S09: SIR/Flux Reliability