APEX EXPO 2017 Agenda Planner

Tue, Feb 14, 2017 - 1:30 PM to 3:00 PM PCB Suppliers Council Steering Committee Meeting(By Invitation) Seminar Type: Standards Development Committee Meeting Location: 14B
Tue, Feb 14, 2017 - 1:30 PM to 3:00 PM S01: Printing I Presenter/Committee Chair: Jeff Schake, Senior Advanced Technology Specialist, ASM Assembly Systems Presenter/Committee Chair: Tom Watson, Master Black Belt, Kimball Electronics Presenter/Committee Chair: Jimmy Villalvazo, Innovation Director, InterLatin Inc. Presenter/Committee Chair: Gabriel Briceno Ph.D., Senior Process Engineer, Qual-Pro Corporation Seminar Type: Technical Conference Session Track: Assembly Processes for Lead-Free and Tin Lead Location: 1A Printing I
Tue, Feb 14, 2017 - 1:30 PM to 3:00 PM S02: Printed Electronics I Presenter/Committee Chair: Alan Burk, President, ALMAX Presenter/Committee Chair: Jesse Greenwood, Hazardous Print Consulting Inc. Presenter/Committee Chair: Art Dobie, Technical Sales Rep, Ikonics Corp. Seminar Type: Technical Conference Session Track: Printed Electronics Location: 4 S02: Printed Electronics I
Tue, Feb 14, 2017 - 1:30 PM to 3:00 PM S03: High Speed/ High Frequency I Presenter/Committee Chair: David Hoover, Field Application Engineer, TTM Technologies Presenter/Committee Chair: Fei Peng Ph.D., Senoir Research Chemist, MacDermid Enthone Electronics Solutions Presenter/Committee Chair: John Coonrod, Technical Marketing Manager, Rogers Corporation Seminar Type: Technical Conference Session Track: PCB Fabrication and Materials Location: 2 S03: High Speed/ High Frequency I
Tue, Feb 14, 2017 - 1:30 PM to 3:00 PM S04: Corrosion/ SIR Reliability I Presenter/Committee Chair: Julie Silk, Keysight Technologies Inc. Presenter/Committee Chair: Prabjit Singh, IBM Corporation Presenter/Committee Chair: Mike Bixenman DBA, CTO, Kyzen Corporation Seminar Type: Technical Conference Session Track: Cleaning/Coating/Contamination Location: 3 S04: Corrosion/ SIR Reliability I
Tue, Feb 14, 2017 - 1:30 PM to 3:00 PM S05: Solder Reliability I Presenter/Committee Chair: Jason Fullerton, Customer Technical Support Engineer, Alpha Presenter/Committee Chair: Udo Welzel, Development Engineer, Robert Bosch GmbH Presenter/Committee Chair: Ning-Cheng Lee Ph.D., VP of Technology, Indium Corporation Presenter/Committee Chair: Shantanu Joshi, Technical Sales Engineer, Koki Solder America Inc. Seminar Type: Technical Conference Session Track: Assembly Processes for Lead Free and Tin-Lead Location: 1B S05: Solder Reliability I
Tue, Feb 14, 2017 - 3:00 PM to 5:00 PM 1-14: DFX Standards Subcommittee Presenter/Committee Chair: Dock Brown, Sr. Member of Technical Staff, DfR Solutions Presenter/Committee Chair: Karen McConnell CID, Manager, EDA, Northrop Grumman Corporation Seminar Type: Standards Development Committee Meeting Track: Design General Committee: Printed Board Design Technology Location: 14B
Tue, Feb 14, 2017 - 3:15 PM to 5:00 PM 3-11F: UL/CSA Task Group Presenter/Committee Chair: Doug Sober, Founder/President, Essex Technologies Group Inc. Seminar Type: Standards Development Committee Meeting Track: PCB Fabrication and Materials General Committee: Base Materials Location: 11A
Tue, Feb 14, 2017 - 3:15 PM to 5:00 PM 5-21K: IPC-SM-817 SMT Adhesive Task Group Presenter/Committee Chair: Lance Brack, Sr. Engineer I w/ Honors, Raytheon Missile Systems Seminar Type: Standards Development Committee Meeting Track: Assembly Processes for Lead Free and Tin-Lead General Committee: Assembly and Joining Location: 7A
Tue, Feb 14, 2017 - 3:15 PM to 5:00 PM 5-22 ROSE WORKING GROUP Seminar Type: Standards Development Committee Meeting Location: 8