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Date
Sat, Feb 11th, 2017
Sun, Feb 12th, 2017
Mon, Feb 13th, 2017
Tue, Feb 14th, 2017
Wed, Feb 15th, 2017
Thu, Feb 16th, 2017
Fri, Feb 17th, 2017
Type
Standards Development Committee Meeting
Track
Assembly Processes for Lead Free and Tin-Lead
Cleaning/Coating/Contamination
Design
Emerging Technologies
Environmental Issues and Compliance
PCB Fabrication and Materials
Printed Electronics
Quality, Reliability and Test
Supply Chain/Business Issues
Speaker
Aidan Turnbull Ph.D., BomCheck
Alan Burk, ALMAX
Albert Block Jr., National Instruments
Amy Hagnauer, Raytheon Company
Beverley Christian Ph.D., HDP User Group
Bret Bruhn, TTM Technologies
Brett Miller, USA Harness, Inc.
Brian Butler
Brook Sandy-Smith, Indium Corporation
Bruce Hughes
Bud Bowen
Cameron Shearon, AT&T Services, Inc
Clark Webster, ALL Flex LLC
Clifford Maddox
Constantino Gonzalez MIT, ACME Training & Consulting
Dan Welch
Dana Korf
Daniel Foster CIT, Missile Defense Agency
Daniel Gamota, Printovate Technologies, Inc.
Dave Harrell CIT
David Adams
David Carnevale, Dolby Laboratories
David Hillman, Rockwell Collins
David Lober, Kyzen Corporation
David Wolf, Conductor Analysis Technologies, Inc.
David Wynants, Taconic Advanced Dielectric Division
Debbie Wade MIT
Debora Obitz MIT, National Technical Systems Anaheim
Dennis Fritz
Dock Brown, DfR Solutions
Don Dupriest, Lockheed Martin Missiles & Fire Control
Doug Sober, Essex Technologies Group Inc.
Douglas Pauls, Rockwell Collins
Dudi Amir
Eddie Hofer, Rockwell Collins
Edward Sandor, Taconic Advanced Dielectric Division
Eric Camden, Foresite, Inc.
Eric Straw, Rockwell Collins
Fonda Wu
Forrest Christian, Innovation Machine Ltd.
Garry McGuire, NASA Marshall Space Flight Center
Gary Carter
Gary Ferrari MIT, FTG Circuits
Gary Latta, SAIC
George Milad, Uyemura International Corp.
George Millman Jr. MIT
Gerard O'Brien, Solderability Testing & Solutions, Inc.
Glenn Oliver, DuPont - RTP
Graham Naisbitt
Greg Wade, Indium Corporation
Hans Peter Tranitz Ph.D., Continental Automotive GmbH
Helen Holder
JB Hollister, Apple Inc.
James Monarchio, TTM Technologies, Inc.
Jan Pedersen CIT, Elmatica AS
Jason Gooden, Anthesis
Jason Keeping, Celestica
Jason Spera, Aegis Software
Jean-Pierre Theret, Dassault Systemes
Jeff Schake, ASM Assembly Systems
Jeff Shubrooks, Raytheon Company
Jennie Hwang Ph.D., Sc.D., H-Technologies Group
Jerry Magera
Jimmy Baccam CID+
John Ciba Jr.
John Coonrod, Rogers Corporation
John Fisher, Interconnect Technology Analysis, Inc.
John Radman, NTS - Denver
John Waryold, HumiSeal Division of Chase Corporation
Jose Rios
Joseph Kane, BAE Systems Platform Solutions
Joseph Russeau
Karen McConnell CID, Northrop Grumman Corporation
Karen Tellefsen Ph.D., Alpha
Karl Sauter, Oracle America, Inc.
Kathy Johnston MIT, Raytheon Missile Systems
Keith Sellers, NTS - Baltimore
Kevin Kusiak, Lockheed Martin Space Systems Company
Kristopher Moyer CID+, Aerojet Rocketdyne
Lance Auer, Raytheon Missile Systems
Lance Brack, Raytheon Missile Systems
Leo Lambert MIT, EPTAC Corporation
Linda Woody
Mahendra Gandhi
Mahi Duggirala, Flextronics International
Marc Peo, Heller Industries Inc.
Mark Buechner, BAE Systems
Mark Finstad CID, Flexible Circuit Technologies, Inc.
Mark Frimann, Texas Instruments Inc.
Mary Muller, Crane Aerospace & Electronics
Matt Kelly, IBM
Michael Carano, RBP Chemical Technology, Inc.
Michael Ford, Mentor Graphics Corporation
Michael Jawitz, Orbital ATK
Michael Jouppi, Thermal Management, LLC.
Michael Miller
Michah Pledger
Mike Bixenman DBA, Kyzen Corporation
Mike Bryant, BGF Industries Inc.
N. Nagaraj Ph.D., Papros, Inc.
Neil Bolding, MacDermid Enthone Electronics Solutions
Nicholas Meeker
Nick Koop CID, TTM Technologies
Pat Stroman CEPM, Sparton Corporation
Philip Henault, Raytheon Company
Rajesh Kumar, TTM Technologies
Randy Reed, R. Reed Consultancy LLC
Ray Prasad, Ray Prasad Consultancy Group
Reza Ghaffarian Ph.D., Jet Propulsion Laboratory
Richard Rumas, Honeywell Canada
Richard Snogren
Rick Shanks, Pratt & Whitney
Robert Cooke, NASA Johnson Space Center
Robert Fornefeld MIT, L-3 Communications
Robert Rowland
Rolland Savage, Savage Consulting
Russell Shepherd MIT, National Technical Systems Anaheim
Russell Steiner CID+, Allegion
Scott Bowles, L-3 Fuzing and Ordnance Systems, Cincinnati
Sean Keating CIT
Stephen Tisdale, Intel Corporation
Steven Bowles, L-3 Fuzing and Ordnance Systems, Cincinnati
Steven Martell, Sonoscan Inc.
Symon Franklin CIT, Custom Interconnect Ltd
Terry Fischer, Hitachi Chemical Co. America, Ltd.
Timothy Estes
Tony Senese, Panasonic Industrial Devices Sales Company of America (PIDSA)
Udo Welzel, Robert Bosch GmbH
Vasu Vasudevan
Vern Solberg, Solberg Technical Consulting
Vicka Hammill, Honeywell Inc. Air Transport Systems
Walter Jager, ECD Compliance
William Kunkle
William Ortloff Sr., Raytheon Company
Xiaoning Ye, Intel Corporation
Zenaida Valianu MIT
Location
10
11A
11B
12
13
14A
14B
15A
17B
18
6F
7A
8
9
West Terrace(located on the upper level)
General Committee
Assembly and Joining
Base Materials
Cleaning and Coating
Electronic Documentation Technology
Electronic Product Data Description
Embedded Devices
Environment, Health & Safety (EHS)
Fabrication Processes
Flexible and Rigid-Flex Printed Boards
High Speed/High Frequency Interconnections
Management
Managment
Packaged Electronic Components
Printed Board Design Technology
Printed Electronics
Process Control
Product Assurance
Product Reliability
Rigid Printed Boards
Terms and Definitions
Testing
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Wed, Feb 15, 2017 - 8:00 AM to 10:00 AM
5-21E: Solder Stencil Task Group
Presenter/Committee Chair: Jeff Schake, Senior Advanced Technology Specialist, ASM Assembly Systems
Presenter/Committee Chair: William Kunkle
Seminar Type: Standards Development Committee Meeting
Track: Assembly Processes for Lead Free and Tin-Lead
General Committee: Assembly and Joining
Location: 15A
Wed, Feb 15, 2017 - 8:00 AM to 10:00 AM
5-21G: Flip Chip Mounting Task Group
Presenter/Committee Chair: Vern Solberg, Sr Consultant, Solberg Technical Consulting
Seminar Type: Standards Development Committee Meeting
Track: Assembly Processes for Lead Free and Tin-Lead
General Committee: Assembly and Joining
Location: 18
Wed, Feb 15, 2017 - 8:00 AM to 10:00 PM
5-22F: J-STD-001 Handbook Task Group
Presenter/Committee Chair: Daniel Foster CIT, Quality Assurance Specialist, Missile Defense Agency
Presenter/Committee Chair: Kathy Johnston MIT, Q&MA Mgr., Raytheon Missile Systems
Seminar Type: Standards Development Committee Meeting
Track: Assembly Processes for Lead Free and Tin-Lead
General Committee: Assembly and Joining
Location: 7A
Wed, Feb 15, 2017 - 8:00 AM to 10:00 PM
5-24B: Solder Paste Task Group
Presenter/Committee Chair: Beverley Christian Ph.D., HDP User Group
Presenter/Committee Chair: Karen Tellefsen Ph.D., Senior Chemist, Alpha
Seminar Type: Standards Development Committee Meeting
Track: Assembly Processes for Lead Free and Tin-Lead
General Committee: Assembly and Joining
Location: 11B
Wed, Feb 15, 2017 - 8:00 AM to 10:00 AM
5-33AWG: Conformal Coating Requirements Working Group
Presenter/Committee Chair: Jason Keeping, Project Manager, Ruggedized Electronics, Celestica
Presenter/Committee Chair: Douglas Pauls, Principle Materials Process Engineer, Rockwell Collins
Seminar Type: Standards Development Committee Meeting
Track: Assembly Processes for Lead Free and Tin-Lead
General Committee: Cleaning and Coating
Location: 10
Wed, Feb 15, 2017 - 8:00 AM to 12:00 PM
7-31BT: IPC-A-610 Technical Training Committee
Presenter/Committee Chair: Robert Cooke, Aerospace Engineer, NASA Johnson Space Center
Presenter/Committee Chair: Debbie Wade MIT
Seminar Type: Standards Development Committee Meeting
Track: Assembly Processes for Lead Free and Tin-Lead
General Committee: Product Assurance
Location: 17B
Wed, Feb 15, 2017 - 8:00 AM to 12:00 PM
7-31F: IPC/WHMA-A-620 Task Group
Presenter/Committee Chair: Brett Miller, VP Engineering, USA Harness, Inc.
Presenter/Committee Chair: George Millman Jr. MIT
Presenter/Committee Chair: Bud Bowen
Presenter/Committee Chair: Richard Rumas, Materials & Process Eng, Honeywell Canada
Seminar Type: Standards Development Committee Meeting
Track: Quality, Reliability and Test
General Committee: Product Assurance
Location: 14A
Wed, Feb 15, 2017 - 8:00 AM to 5:00 PM
7-31H/7-31K: Joint Meeting - IPC-HDBK-620 Handbook and Wire Harness Design Task Groups
Presenter/Committee Chair: Robert Cooke, Aerospace Engineer, NASA Johnson Space Center
Presenter/Committee Chair: Brett Miller, VP Engineering, USA Harness, Inc.
Seminar Type: Standards Development Committee Meeting
Track: Quality, Reliability and Test
General Committee: Product Assurance
Location: 13
Wed, Feb 15, 2017 - 8:00 AM to 10:00 AM
D-15: Flexible Circuits Test Methods Subcommittee
Presenter/Committee Chair: Russell Shepherd MIT, Operations Manager, National Technical Systems Anaheim
Seminar Type: Standards Development Committee Meeting
Track: PCB Fabrication and Materials
General Committee: Flexible and Rigid-Flex Printed Boards
Location: 11A
Wed, Feb 15, 2017 - 8:00 AM to 10:00 AM
D-22: High Speed/High Frequency Board Performance Subcommittee
Presenter/Committee Chair: Lance Auer, PWB Technical Lead, Raytheon Missile Systems
Presenter/Committee Chair: Mahendra Gandhi
Seminar Type: Standards Development Committee Meeting
Track: PCB Fabrication and Materials
General Committee: High Speed/High Frequency Interconnections
Location: 14B
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