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IPC APEX EXPO 2017

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	Tue, Feb 14, 2017 - 1:30 PM to 5:00 PM 4-30: Environment, Health & Safety Committee Presenter/Committee Chair: Bret Bruhn, Environmental Operations Manager, TTM Technologies Seminar Type: Standards Development Committee Meeting Track: Environmental Issues and Compliance General Committee: Environment, Health & Safety (EHS) Location: 14A
	Tue, Feb 14, 2017 - 1:30 PM to 3:00 PM 4-33: Halogen-Free Materials Subcommittee Presenter/Committee Chair: Doug Sober, Founder/President, Essex Technologies Group Inc. Seminar Type: Standards Development Committee Meeting Track: Environmental Issues and Compliance General Committee: Environment, Health & Safety (EHS) Location: 11A
	Tue, Feb 14, 2017 - 1:30 PM to 3:00 PM 5-24A: Flux Specifications Task Group-CANCELED Presenter/Committee Chair: Brook Sandy-Smith, Product Support Specialist, Indium Corporation Presenter/Committee Chair: Keith Sellers, Operations Manager, NTS - Baltimore Seminar Type: Standards Development Committee Meeting Track: Assembly Processes for Lead Free and Tin-Lead General Committee: Assembly and Joining Location: 10
	Tue, Feb 14, 2017 - 1:30 PM to 3:00 PM 5-32E: Conductive Anodic Filament (CAF) Task Group Presenter/Committee Chair: Karl Sauter, Principal Engineer, Oracle America, Inc. Presenter/Committee Chair: Graham Naisbitt Presenter/Committee Chair: Russell Shepherd MIT, Operations Manager, National Technical Systems Anaheim Seminar Type: Standards Development Committee Meeting Track: PCB Fabrication and Materials General Committee: Cleaning and Coating Location: 11B
	Tue, Feb 14, 2017 - 1:30 PM to 3:00 PM 7-24: Printed Board Process Effects Handbook Subcommittee Presenter/Committee Chair: Michael Carano, VP Technology & Business Development, RBP Chemical Technology, Inc. Seminar Type: Standards Development Committee Meeting Track: Quality, Reliability and Test General Committee: Process Control Location: 8
	Tue, Feb 14, 2017 - 1:30 PM to 3:00 PM D-24B: Bereskin Test Method Task Group Presenter/Committee Chair: David Wynants, Process Engineer, Taconic Advanced Dielectric Division Seminar Type: Standards Development Committee Meeting Track: Quality, Reliability and Test General Committee: High Speed/High Frequency Interconnections Location: 12
	Tue, Feb 14, 2017 - 1:30 PM to 5:00 PM D-31B: IPC-2226A Design Standard Presenter/Committee Chair: Gary Ferrari MIT, Director of Technical Support, FTG Circuits Presenter/Committee Chair: Clifford Maddox Seminar Type: Standards Development Committee Meeting Track: Design General Committee: Printed Board Design Technology Location: 17B
	Tue, Feb 14, 2017 - 1:30 PM to 3:00 PM D-33AT: IPC-6012 Technical Training Committe Presenter/Committee Chair: Steven Bowles, Supervisor, Receiving Inspection & Gage Calibratio, L-3 Fuzing and Ordnance Systems, Cincinnati Presenter/Committee Chair: Don Dupriest, LM Fellow, Lockheed Martin Missiles & Fire Control Seminar Type: Standards Development Committee Meeting Track: PCB Fabrication and Materials General Committee: Rigid Printed Boards Location: 18
	Tue, Feb 14, 2017 - 1:30 PM to 5:00 PM D-55: Embedded Devices Process Implementation Subcommittee Presenter/Committee Chair: Rajesh Kumar, VP of Technology Solutions, C&C, TTM Technologies Presenter/Committee Chair: Bruce Hughes Seminar Type: Standards Development Committee Meeting Track: Emerging Technologies General Committee: Embedded Devices Location: 9
	Tue, Feb 14, 2017 - 1:30 PM to 3:00 PM PCB Suppliers Council Steering Committee Meeting(By Invitation) Seminar Type: Standards Development Committee Meeting Location: 14B

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