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Date
Wed, Feb 15th, 2017
Type
Poster
Track
Design
Supply Chain/Business Issues
Speaker
Ajith Krishnamurthy, Siemens PLM
Alex Lambert, University of North Texas Chemistry Department Interfacial
Anna Lifton
Brian Chislea, Dow Corning Corporation,
Bryan Fry, Ph.D., Quantum Silicones
Carlo Viola, Northrop Grumman Mission Systems
Christian Schauer, InnoLas Solutions GmbH
Christoph Wimmer, Microscan Systems Inc.
Cong Zhao, Auburn University
Desmond Wong, TransSiP, Inc.
Dock Brown, DfR Solutions
Gerjan Diepstraten CIT, Vitronics Soltec
Gerold Mueller-Ensslin, GME Engineering & Consulting GMBH
Hans Peter Tranitz Ph.D., Continental Automotive GmbH
Jeffrey Lee Sr. CIT, iST - Integrated Service Technology
Jennifer Nguyen, JNK Engineering and Consulting LLC
Jody Cowan, Siemens Product Lifecycle Management Software Inc.
John Coonrod, Rogers Corporation
Katherine Griggs, Northrop Grumman
Kevin Lewis, Ph.D., Quantum Silicones
Lynnette Colby, Kester
Maria Mosto, Siemens PLM Software, Inc,
Phillip McDermott, Quantum Silicones
Robert Peet, Seica Inc.
Tom Rogers, Polyonics
Tord Dennis, WSP | Parsons Brinckerhoff
Torsten Schmidt, Hella KGaA Hueck & Co Operations Processes Development Metals
Vern Solberg, Solberg Technical Consulting
YongJin Choi, Hewlett-Packard Enterprise
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Wed, Feb 15, 2017 - 10:00 AM to 10:30 AM
A Cost-effective Material Characterization for High-volume Production Monitoring
Presenter/Committee Chair: YongJin Choi, Hewlett-Packard Enterprise
Seminar Type: Poster
Yongjin Choi
Wed, Feb 15, 2017 - 10:00 AM to 10:30 AM
Maximizing SMT Line Uptime with High-Quality PCB Marks and Optimal Reader Configuration
Presenter/Committee Chair: Christoph Wimmer, Global Business Dev. Manager, Microscan Systems Inc.
Seminar Type: Poster
Christoph Wimmer
Wed, Feb 15, 2017 - 10:00 AM to 10:30 AM
Panelization for Rigid, Flexible and Rigid-Flex Circuits
Maximizing SMT Assembly Process Efficiency
Presenter/Committee Chair: Vern Solberg, Sr Consultant, Solberg Technical Consulting
Seminar Type: Poster
Vern Solberg
Wed, Feb 15, 2017 - 10:00 AM to 10:30 AM
Pilot 4D V8 HF, The First Prober Flying Up to 1.6ghz
Presenter/Committee Chair: Robert Peet, Seica Inc.
Seminar Type: Poster
Robert Peet
Wed, Feb 15, 2017 - 10:00 AM to 10:30 AM
Press-fit Technology in OSP Finishes – Verification of Manufacturability
Presenter/Committee Chair: Torsten Schmidt, Head of Operations Processes Development Metals, Hella KGaA Hueck & Co Operations Processes Development Metals
Seminar Type: Poster
Torsten Schmidt
Wed, Feb 15, 2017 - 10:00 AM to 10:30 AM
Product Performance Intelligence for Better Products and Customer Experience
Presenter/Committee Chair: Jody Cowan, Director of Marketing and Business Strategy, Siemens Product Lifecycle Management Software Inc.
Seminar Type: Poster
Jody Cowen
Wed, Feb 15, 2017 - 10:00 AM to 10:30 AM
Solving Customer Problems via UV-Vis-NIR Spectroscopy: A Series of Case Studies
Presenter/Committee Chair: Kevin Lewis, Ph.D., Quantum Silicones
Seminar Type: Poster
Dr. Kevin Lewis
Wed, Feb 15, 2017 - 10:00 AM to 10:30 AM
Testing Methodology for Determining Resistance to Environmental Factors in Water-Soluble Solder Paste Chemistries
Presenter/Committee Chair: Lynnette Colby, Global Product Manager, Kester
Seminar Type: Poster
Lynette Colby
Wed, Feb 15, 2017 - 10:00 AM to 10:30 AM
Understanding Circuit Material Performance Concerns for PCB’s at Millimeter-Wave Frequencies
Presenter/Committee Chair: John Coonrod, Technical Marketing Manager, Rogers Corporation
Seminar Type: Poster
John Coonrod
Wed, Feb 15, 2017 - 10:00 AM to 10:30 AM
Use of "Bead Probe" Technology to Increase Testability
Presenter/Committee Chair: Katherine Griggs, Northrop Grumman
Seminar Type: Poster
Katherine Griggs
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Caption: 21 - 30 of 30
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