APEX EXPO 2017 Agenda Planner - Caption

Contact Us | About APEX EXPO 2017 Agenda Planner

Login to APEX EXPO 2017 Agenda Planner Now or Register for IPC APEX EXPO 2017 Now.

IPC APEX EXPO 2017

Print List of Caption

Search

1 2 3

Caption: 11 - 20 of 30

Caption per Page

	Wed, Feb 15, 2017 - 10:00 AM to 10:30 AM Engineered Solder Alloy for High Reliability Die Attach Application Presenter/Committee Chair: Anna Lifton Seminar Type: Poster Anna Lifton
	Wed, Feb 15, 2017 - 10:00 AM to 10:30 AM ESD Concerns with PCB Assembly: Bar Code Labeling and Masking Presenter/Committee Chair: Tom Rogers, Polyonics Seminar Type: Poster Tord Dennis
	Wed, Feb 15, 2017 - 10:00 AM to 10:30 AM Evaluation of the Anti-Corrosion Capacity for Various Electronics by Way of Air Quality Monitoring and Accelerated Corrosion Verification Platform. Presenter/Committee Chair: Jeffrey Lee Sr. CIT, Assistant Vice President, iST - Integrated Service Technology Seminar Type: Poster Jeffery Lee, Sr.
	Wed, Feb 15, 2017 - 10:00 AM to 10:30 AM Full Material Declaration (FMD) For REACH, Rohs and Conflict Minerals Compliance Presenter/Committee Chair: Tord Dennis, WSP \| Parsons Brinckerhoff Seminar Type: Poster Tord Dennis
	Wed, Feb 15, 2017 - 10:00 AM to 10:30 AM Mitigating Rising Ceramic Capacitor Failure Rates Presenter/Committee Chair: Dock Brown, Sr. Member of Technical Staff, DfR Solutions Seminar Type: Poster Dock Brown
	Wed, Feb 15, 2017 - 10:00 AM to 10:30 AM Press-fit technology in OSP finishes - A combination with potential? Presenter/Committee Chair: Hans Peter Tranitz Ph.D., Continental Automotive GmbH Seminar Type: Poster Hans-Peter Tranitz
	Wed, Feb 15, 2017 - 10:00 AM to 10:30 AM The "Organic Fab"- a Practical Approach to 3D Embedding Presenter/Committee Chair: Desmond Wong, TransSiP, Inc. Seminar Type: Poster Desmond Wong
	Wed, Feb 15, 2017 - 10:00 AM to 10:30 AM Thermally Conductive Silicones Presenter/Committee Chair: Phillip McDermott, Quantum Silicones Seminar Type: Poster Philip McDermott
	Wed, Feb 15, 2017 - 10:00 AM to 10:30 AM Ultra High Definition In- Line Wet Processing HDI Lines / Segments / Process oriented Upgrades Presenter/Committee Chair: Gerold Mueller-Ensslin, CEO R&D/Engineering, GME Engineering & Consulting GMBH Seminar Type: Poster Gerold Mueller-Ensslin
	Wed, Feb 15, 2017 - 10:00 AM to 10:30 AM Reliability of Doped Lead-Free Solder Joint under Isothermal Aging and Thermal Cycling Presenter/Committee Chair: Cong Zhao, Ph.D. Candidate, Auburn University Seminar Type: Poster Cong Zhao

1 2 3

Caption: 11 - 20 of 30

Go to Page

GoExpo stable-v4.15.265, Copyright © 2006-2024 Core-apps LLC.

Privacy · Legal · Contact · About