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Date
Tue, Feb 14th, 2017
Wed, Feb 15th, 2017
Thu, Feb 16th, 2017
Type
Technical Conference Session
Track
Assembly Processes for Lead Free and Tin-Lead
Assembly Processes for Lead-Free and Tin Lead
Cleaning/Coating/Contamination
Emerging Technologies
PCB Fabrication and Materials
PCB Fabrication and Materials & Emerging Technologies
Printed Electronics
Quality, Reliability and Test
Quality, Reliability and Test & Assembly Processes for Lead-Free and Tin Lead
Quality, Reliability and Test & PCB Fabrication and Materials
Supply Chain/Business Issues
Speaker
Alan Burk, ALMAX
Amir Nobari, 5N Plus Inc.
Andrew Piotrowski, ICL-IP America
Anthony Lentz, FCT Assembly, Inc.
Art Dobie, Ikonics Corp.
Aysegul Nebioglu Ph.D., Dymax Corporation
Azita Yazdani, Exergy Technologies Corporation
Bernard Candaele, Thales Communications & Security
Beverley Christian Ph.D., HDP User Group
Bhanu Sood, NASA Goddard Space Flight Center
Bob Wettermann MIT, BEST-Michigan
Brenda Martin, Zollner Electronics
Brian Toleno Ph.D., Microsoft Corporation
Brook Sandy-Smith, Indium Corporation
Catherine Shearer, Ormet Circuits, Inc.
Christopher Hunt Ph.D., Gen3 Systems
Clive Ashmore, ASM Assembly Systems
David Geiger, Flextronics International
David Hoover, TTM Technologies
Denis Jean, Kester
Dock Brown, DfR Solutions
Eric Bastow, Indium Corporation
Eric Camden, Foresite, Inc.
Fei Peng Ph.D., MacDermid Enthone Electronics Solutions
Gabriel Briceno Ph.D., Qual-Pro Corporation
Gary Ferrari MIT, FTG Circuits
Gerjan Diepstraten CIT, Vitronics Soltec
Greg Smith, FCT Assembly, Inc.
Gustaf Maertensson Ph.D., Chalmers University of Technology
Gustavo Arredondo, Para Tech Coating Inc.
Jagadeesh Radhakrishnan, Intel Corporation
James Fuller, Sanmina Corporation
Jasbir Bath
Jason Fullerton, Alpha
Jason Keeping, Celestica
Jeff Schake, ASM Assembly Systems
Jeffrey Lee Sr. CIT, iST - Integrated Service Technology
Jeffrey Rupert, ScanCAD International, Inc.
Jesse Greenwood, Hazardous Print Consulting Inc.
Jimmy Villalvazo, InterLatin Inc.
Joel Schrauben, Electro Scientific Industries, Inc.
Joerg Nolte, ERSA GmbH
John Coonrod, Rogers Corporation
John Lau Ph.D., ASM Assembly Materials Ltd.
Julie Silk, Keysight Technologies Inc.
Jun Balangue Jr., Keysight Technologies
Junaid Shafaat, Schneider Electric
Karl Sauter, Oracle America, Inc.
Kazuki Kammuri, Nippon Mining & Metals Co. Ltd
Keith Sweatman, Nihon Superior Co., Ltd.
Lars Bruno, Ericsson AB
Lee Hitchens, SCH Services Ltd.
Lenora Clark, MacDermid Enthone Electronics Solutions
Leonard Allison, Engineered Materials Systems, Inc.
Louis Ungar, Advanced Test Engineering Solutions, Inc.
Luis Lopez, Northrop Grumman Corporation
Mahesh Narayanaswamy, GE Healthcare
Maria Durham, Indium Corporation
Mark Routley, Gen3 Systems Limited
Martin Goetz, Northrop Grumman Corporation
Martin Wickham, NPL
MaryAlice Gill, Jabil Circuit, Inc.
Maxim Serebreni, DfR Solutions
Mike Bixenman DBA, Kyzen Corporation
Mitchell Holtzer, Alpha
Neil Hubble, Akrometrix LLC
Ning-Cheng Lee Ph.D., Indium Corporation
Paul Wood, OK International
Paul Zutter, U.S. Army Aviation & Missile Command
Pierre Eckold, Robert Bosch GmbH
Prabjit Singh, IBM Corporation
Ravi Parthasarathy, ZESTRON Americas
Reza Ghaffarian Ph.D., Jet Propulsion Laboratory
Rick Nichols, Atotech Deutschland GmbH
Robert Roush, OK International
Russell Nowland, Nokia
Ryo Murakami Ph.D., Fujitsu Laboratories
Saminda Dharmarathna Ph.D., MacDermid Enthone Electronics Solutions
Samuel LeBlanc, nScrypt Inc.
Scott Wischoffer, Fuji America Corporation
Seiya Kido, MEC Company, Ltd.
Shantanu Joshi, Koki Solder America Inc.
Sivakumar Vijayakumar, Keysight Technologies
Steve Butkovich, Test Innovation, LLC.
Steven Perng, Cisco Systems Inc.
Timothy O'Neill, AIM, Inc.
Tom Watson, Kimball Electronics
Tommy Fox, Optimal Electronics Corporation
Udo Welzel, Robert Bosch GmbH
Vern Solberg, Solberg Technical Consulting
William Loving, ScanCAD International, Inc.
Location
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1B
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Wed, Feb 15, 2017 - 3:30 PM to 4:30 PM
S18:Test II
Presenter/Committee Chair: Steve Butkovich, Consultant, Test Innovation, LLC.
Presenter/Committee Chair: Mahesh Narayanaswamy, Electrical Engineer, GE Healthcare
Presenter/Committee Chair: David Geiger, Director Advanced Engineering Group, Flextronics International
Seminar Type: Technical Conference Session
Track: Quality, Reliability and Test
Location: 1B
S18: Test II
Wed, Feb 15, 2017 - 3:30 PM to 4:30 PM
S28: Supply Chain II
Presenter/Committee Chair: Russell Nowland, Repair Strategy & Supplier Management, Nokia
Presenter/Committee Chair: Tommy Fox, COO, Optimal Electronics Corporation
Presenter/Committee Chair: Jeffrey Rupert, Director of Advanced Technology & Busine, ScanCAD International, Inc.
Seminar Type: Technical Conference Session
Track: Supply Chain/Business Issues
Location: 1A
S28: Supply Chain II
Thu, Feb 16, 2017 - 9:00 AM to 10:00 AM
S22: Underfill
Presenter/Committee Chair: Jason Keeping, Project Manager, Ruggedized Electronics, Celestica
Presenter/Committee Chair: Maxim Serebreni, Research Engineer, DfR Solutions
Presenter/Committee Chair: Luis Lopez, Northrop Grumman Corporation
Seminar Type: Technical Conference Session
Track: Quality, Reliability and Test & Assembly Processes for Lead-Free and Tin Lead
Location: 1A
S22: Underfill
Thu, Feb 16, 2017 - 9:00 AM to 10:00 AM
S31: PCB Surface Finishes
Presenter/Committee Chair: Lenora Clark, Director of End User Applications, MacDermid Enthone Electronics Solutions
Presenter/Committee Chair: Rick Nichols, Atotech Deutschland GmbH
Presenter/Committee Chair: Reza Ghaffarian Ph.D., Principal Eng., Jet Propulsion Laboratory
Seminar Type: Technical Conference Session
Track: Quality, Reliability and Test & PCB Fabrication and Materials
Location: 2
S31: PCB Surface Finishes
Thu, Feb 16, 2017 - 9:00 AM to 10:00 AM
S33: Supply Chain 3/ Automation
Presenter/Committee Chair: Martin Goetz, Sr. Manager, Northrop Grumman Corporation
Presenter/Committee Chair: Ryo Murakami Ph.D., Fujitsu Laboratories
Presenter/Committee Chair: Brenda Martin, President, Zollner Electronics
Presenter/Committee Chair: Eric Bastow, Field Application Engineer, Indium Corporation
Seminar Type: Technical Conference Session
Track: Supply Chain/Business Issues
Location: 3
S33: Supply Chain 3/ Automation
Thu, Feb 16, 2017 - 9:00 AM to 10:00 AM
S35: Emerging Technologies
Presenter/Committee Chair: Vern Solberg, Sr Consultant, Solberg Technical Consulting
Presenter/Committee Chair: Catherine Shearer, Sr. Scientist, Ormet Circuits, Inc.
Presenter/Committee Chair: Bernard Candaele, Director, Electronic Technologies Components, Thales Communications & Security
Seminar Type: Technical Conference Session
Track: Emerging Technologies
Location: 4
S35: Emerging Technologies
Thu, Feb 16, 2017 - 10:30 AM to 12:00 PM
S36: Conformal Coatings
Presenter/Committee Chair: Beverley Christian Ph.D., HDP User Group
Presenter/Committee Chair: Junaid Shafaat, Manufacturing Engineer, Schneider Electric
Presenter/Committee Chair: Aysegul Nebioglu Ph.D., Adhesive R&D Group Leader, Dymax Corporation
Presenter/Committee Chair: Jason Keeping, Project Manager, Ruggedized Electronics, Celestica
Presenter/Committee Chair: Lee Hitchens, Technical Director, SCH Services Ltd.
Seminar Type: Technical Conference Session
Track: Cleaning/Coating/Contamination
Location: 1B
S36: Conformal Coatings
Thu, Feb 16, 2017 - 10:30 AM to 12:00 PM
S32: PCB Fabrication/Assembly Reliability
Presenter/Committee Chair: David Hoover, Field Application Engineer, TTM Technologies
Presenter/Committee Chair: Bhanu Sood, Commodity Risk Assessment Engineer (PCB), NASA Goddard Space Flight Center
Presenter/Committee Chair: Steven Perng, Technical Leader, Cisco Systems Inc.
Presenter/Committee Chair: Jeffrey Lee Sr. CIT, Assistant Vice President, iST - Integrated Service Technology
Seminar Type: Technical Conference Session
Track: Quality, Reliability and Test & PCB Fabrication and Materials
Location: 2
S32: PCB Fabrication/Assembly Reliability
Thu, Feb 16, 2017 - 10:30 AM to 12:00 PM
S34: Rework II
Presenter/Committee Chair: Russell Nowland, Repair Strategy & Supplier Management, Nokia
Presenter/Committee Chair: Bob Wettermann MIT, President, BEST-Michigan
Presenter/Committee Chair: Joerg Nolte, ERSA GmbH
Presenter/Committee Chair: Lars Bruno, Product Engineer, Ericsson AB
Seminar Type: Technical Conference Session
Track: Assembly Processes for Lead Free and Tin-Lead
Location: 1A
S34: Rework II
Thu, Feb 16, 2017 - 10:30 AM to 12:00 PM
S37: Solder Reliability III
Presenter/Committee Chair: Denis Jean, Technology Manager, Kester
Presenter/Committee Chair: Keith Sweatman, Nihon Superior Co., Ltd.
Presenter/Committee Chair: Brook Sandy-Smith, Product Support Specialist, Indium Corporation
Presenter/Committee Chair: Amir Nobari, 5N Plus Inc.
Seminar Type: Technical Conference Session
Track: Quality, Reliability and Test & Assembly Processes for Lead-Free and Tin Lead
Location: 4
S37: Solder Reliability III
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Caption: 21 - 30 of 31
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