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Date
Tue, Feb 14th, 2017
Wed, Feb 15th, 2017
Thu, Feb 16th, 2017
Type
Technical Conference Session
Track
Assembly Processes for Lead Free and Tin-Lead
Assembly Processes for Lead-Free and Tin Lead
Cleaning/Coating/Contamination
Emerging Technologies
PCB Fabrication and Materials
PCB Fabrication and Materials & Emerging Technologies
Printed Electronics
Quality, Reliability and Test
Quality, Reliability and Test & Assembly Processes for Lead-Free and Tin Lead
Quality, Reliability and Test & PCB Fabrication and Materials
Supply Chain/Business Issues
Speaker
Alan Burk, ALMAX
Amir Nobari, 5N Plus Inc.
Andrew Piotrowski, ICL-IP America
Anthony Lentz, FCT Assembly, Inc.
Art Dobie, Ikonics Corp.
Aysegul Nebioglu Ph.D., Dymax Corporation
Azita Yazdani, Exergy Technologies Corporation
Bernard Candaele, Thales Communications & Security
Beverley Christian Ph.D., HDP User Group
Bhanu Sood, NASA Goddard Space Flight Center
Bob Wettermann MIT, BEST-Michigan
Brenda Martin, Zollner Electronics
Brian Toleno Ph.D., Microsoft Corporation
Brook Sandy-Smith, Indium Corporation
Catherine Shearer, Ormet Circuits, Inc.
Christopher Hunt Ph.D., Gen3 Systems
Clive Ashmore, ASM Assembly Systems
David Geiger, Flextronics International
David Hoover, TTM Technologies
Denis Jean, Kester
Dock Brown, DfR Solutions
Eric Bastow, Indium Corporation
Eric Camden, Foresite, Inc.
Fei Peng Ph.D., MacDermid Enthone Electronics Solutions
Gabriel Briceno Ph.D., Qual-Pro Corporation
Gary Ferrari MIT, FTG Circuits
Gerjan Diepstraten CIT, Vitronics Soltec
Greg Smith, FCT Assembly, Inc.
Gustaf Maertensson Ph.D., Chalmers University of Technology
Gustavo Arredondo, Para Tech Coating Inc.
Jagadeesh Radhakrishnan, Intel Corporation
James Fuller, Sanmina Corporation
Jasbir Bath
Jason Fullerton, Alpha
Jason Keeping, Celestica
Jeff Schake, ASM Assembly Systems
Jeffrey Lee Sr. CIT, iST - Integrated Service Technology
Jeffrey Rupert, ScanCAD International, Inc.
Jesse Greenwood, Hazardous Print Consulting Inc.
Jimmy Villalvazo, InterLatin Inc.
Joel Schrauben, Electro Scientific Industries, Inc.
Joerg Nolte, ERSA GmbH
John Coonrod, Rogers Corporation
John Lau Ph.D., ASM Assembly Materials Ltd.
Julie Silk, Keysight Technologies Inc.
Jun Balangue Jr., Keysight Technologies
Junaid Shafaat, Schneider Electric
Karl Sauter, Oracle America, Inc.
Kazuki Kammuri, Nippon Mining & Metals Co. Ltd
Keith Sweatman, Nihon Superior Co., Ltd.
Lars Bruno, Ericsson AB
Lee Hitchens, SCH Services Ltd.
Lenora Clark, MacDermid Enthone Electronics Solutions
Leonard Allison, Engineered Materials Systems, Inc.
Louis Ungar, Advanced Test Engineering Solutions, Inc.
Luis Lopez, Northrop Grumman Corporation
Mahesh Narayanaswamy, GE Healthcare
Maria Durham, Indium Corporation
Mark Routley, Gen3 Systems Limited
Martin Goetz, Northrop Grumman Corporation
Martin Wickham, NPL
MaryAlice Gill, Jabil Circuit, Inc.
Maxim Serebreni, DfR Solutions
Mike Bixenman DBA, Kyzen Corporation
Mitchell Holtzer, Alpha
Neil Hubble, Akrometrix LLC
Ning-Cheng Lee Ph.D., Indium Corporation
Paul Wood, OK International
Paul Zutter, U.S. Army Aviation & Missile Command
Pierre Eckold, Robert Bosch GmbH
Prabjit Singh, IBM Corporation
Ravi Parthasarathy, ZESTRON Americas
Reza Ghaffarian Ph.D., Jet Propulsion Laboratory
Rick Nichols, Atotech Deutschland GmbH
Robert Roush, OK International
Russell Nowland, Nokia
Ryo Murakami Ph.D., Fujitsu Laboratories
Saminda Dharmarathna Ph.D., MacDermid Enthone Electronics Solutions
Samuel LeBlanc, nScrypt Inc.
Scott Wischoffer, Fuji America Corporation
Seiya Kido, MEC Company, Ltd.
Shantanu Joshi, Koki Solder America Inc.
Sivakumar Vijayakumar, Keysight Technologies
Steve Butkovich, Test Innovation, LLC.
Steven Perng, Cisco Systems Inc.
Timothy O'Neill, AIM, Inc.
Tom Watson, Kimball Electronics
Tommy Fox, Optimal Electronics Corporation
Udo Welzel, Robert Bosch GmbH
Vern Solberg, Solberg Technical Consulting
William Loving, ScanCAD International, Inc.
Location
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1B
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Caption: 11 - 20 of 31
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Wed, Feb 15, 2017 - 10:30 AM to 12:00 PM
S14 Corrosion/Cleanliness/SIR Reliability
Presenter/Committee Chair: Beverley Christian Ph.D., HDP User Group
Presenter/Committee Chair: Martin Wickham, NPL
Presenter/Committee Chair: Eric Camden, Lead Investigator, Foresite, Inc.
Presenter/Committee Chair: Pierre Eckold, PhD Student, Robert Bosch GmbH
Presenter/Committee Chair: Mark Routley, Production Manager, Gen3 Systems Limited
Seminar Type: Technical Conference Session
Track: Cleaning/Coating/Contamination
Location: 3
S14_01 - Martin Wickham, NPL
S14_02 - Brook Sandy-Smith, Indium Corporation
S14_03 - Pierre Eckold, Robert Bosch & Mark Routley, Robert Bosch
Wed, Feb 15, 2017 - 10:30 AM to 12:00 PM
S11: Voiding & Solder Reflow
Presenter/Committee Chair: Jason Fullerton, Customer Technical Support Engineer, Alpha
Presenter/Committee Chair: Timothy O'Neill, Technical Marketing Manager, AIM, Inc.
Presenter/Committee Chair: Anthony Lentz, Field Application Engineer, FCT Assembly, Inc.
Seminar Type: Technical Conference Session
Track: Assembly Processes for Lead Free and Tin-Lead
Location: 1B
S11: Voiding & Solder Reflow
Wed, Feb 15, 2017 - 10:30 AM to 12:00 PM
S12: Printed Electronics II
Presenter/Committee Chair: Jeff Schake, Senior Advanced Technology Specialist, ASM Assembly Systems
Presenter/Committee Chair: Leonard Allison, Business Manager, Engineered Materials Systems, Inc.
Presenter/Committee Chair: Samuel LeBlanc, nScrypt Inc.
Presenter/Committee Chair: MaryAlice Gill, Process Engineer, Jabil Circuit, Inc.
Seminar Type: Technical Conference Session
Track: Printed Electronics
Location: 4
S12: Printed Electronics II
Wed, Feb 15, 2017 - 10:30 AM to 12:00 PM
S13: PCB Plating and Fabrication and Component Technologies
Presenter/Committee Chair: Saminda Dharmarathna Ph.D., Senior Research Scientist, MacDermid Enthone Electronics Solutions
Presenter/Committee Chair: Joel Schrauben, Electro Scientific Industries, Inc.
Presenter/Committee Chair: John Lau Ph.D., Sr. Technical Advisor, ASM Assembly Materials Ltd.
Presenter/Committee Chair: Gary Ferrari MIT, Director of Technical Support, FTG Circuits
Seminar Type: Technical Conference Session
Track: PCB Fabrication and Materials & Emerging Technologies
Location: 1A
S13: PCB Plating and Fabrication and Component Technologies
Wed, Feb 15, 2017 - 10:30 AM to 12:00 PM
S15: Reliability I
Presenter/Committee Chair: Bhanu Sood, Commodity Risk Assessment Engineer (PCB), NASA Goddard Space Flight Center
Presenter/Committee Chair: Neil Hubble, Application Engineer, Akrometrix LLC
Presenter/Committee Chair: Reza Ghaffarian Ph.D., Principal Eng., Jet Propulsion Laboratory
Presenter/Committee Chair: Dock Brown, Sr. Member of Technical Staff, DfR Solutions
Seminar Type: Technical Conference Session
Track: Quality, Reliability and Test
Location: 2
S15: Reliability I
Wed, Feb 15, 2017 - 1:30 PM to 3:00 PM
S17: Rework I
Presenter/Committee Chair: Russell Nowland, Repair Strategy & Supplier Management, Nokia
Presenter/Committee Chair: Paul Wood, Advanced Product Applications Manager, OK International
Presenter/Committee Chair: Robert Roush, Product Manager, OK International
Presenter/Committee Chair: Shantanu Joshi, Technical Sales Engineer, Koki Solder America Inc.
Seminar Type: Technical Conference Session
Track: Assembly Processes for Lead Free and Tin-Lead
Location: 1A
S17: Rework I
Wed, Feb 15, 2017 - 1:30 PM to 3:00 PM
S19: High Speed/High Frequency II
Presenter/Committee Chair: David Hoover, Field Application Engineer, TTM Technologies
Presenter/Committee Chair: James Fuller, Vice President Engineering, Sanmina Corporation
Presenter/Committee Chair: Karl Sauter, Principal Engineer, Oracle America, Inc.
Presenter/Committee Chair: Seiya Kido, MEC Company, Ltd.
Seminar Type: Technical Conference Session
Track: PCB Fabrication and Materials
Location: 2
S19: High Speed/High Frequency II
Wed, Feb 15, 2017 - 1:30 PM to 3:00 PM
S20: Cleanliness/Reliability
Presenter/Committee Chair: Jasbir Bath, Principal Engineer
Presenter/Committee Chair: Ravi Parthasarathy, Senior Process Engineer, ZESTRON Americas
Presenter/Committee Chair: Azita Yazdani, President & CEO, Exergy Technologies Corporation
Presenter/Committee Chair: Gustavo Arredondo, Technical Manager, Para Tech Coating Inc.
Seminar Type: Technical Conference Session
Track: Cleaning/Coating/Contamination
Location: 4
S20: Cleanliness/Reliability
Wed, Feb 15, 2017 - 1:30 PM to 3:00 PM
S21: Reliability II
Presenter/Committee Chair: Martin Goetz, Sr. Manager, Northrop Grumman Corporation
Presenter/Committee Chair: Jagadeesh Radhakrishnan, Quality and Reliability Engineer, Intel Corporation
Presenter/Committee Chair: Greg Smith, Technical Sales, FCT Assembly, Inc.
Seminar Type: Technical Conference Session
Track: Quality, Reliability and Test & Assembly Processes for Lead-Free and Tin Lead
Location: 3
S21: Reliability II
Wed, Feb 15, 2017 - 3:30 PM to 4:30 PM
S16: Dispensing
Presenter/Committee Chair: Brian Toleno Ph.D., Principal Material Scientist, Microsoft Corporation
Presenter/Committee Chair: Gustaf Maertensson Ph.D., Researcher, Chalmers University of Technology
Presenter/Committee Chair: Maria Durham, Product Speicalist, Indium Corporation
Seminar Type: Technical Conference Session
Track: Assembly Processes for Lead-Free and Tin Lead
Location: 3
S16: Dispensing
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Caption: 11 - 20 of 31
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