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Date
Tue, Feb 14th, 2017
Wed, Feb 15th, 2017
Thu, Feb 16th, 2017
Type
Technical Conference Session
Track
Assembly Processes for Lead Free and Tin-Lead
Assembly Processes for Lead-Free and Tin Lead
Cleaning/Coating/Contamination
Emerging Technologies
PCB Fabrication and Materials
PCB Fabrication and Materials & Emerging Technologies
Printed Electronics
Quality, Reliability and Test
Quality, Reliability and Test & Assembly Processes for Lead-Free and Tin Lead
Quality, Reliability and Test & PCB Fabrication and Materials
Supply Chain/Business Issues
Speaker
Alan Burk, ALMAX
Amir Nobari, 5N Plus Inc.
Andrew Piotrowski, ICL-IP America
Anthony Lentz, FCT Assembly, Inc.
Art Dobie, Ikonics Corp.
Aysegul Nebioglu Ph.D., Dymax Corporation
Azita Yazdani, Exergy Technologies Corporation
Bernard Candaele, Thales Communications & Security
Beverley Christian Ph.D., HDP User Group
Bhanu Sood, NASA Goddard Space Flight Center
Bob Wettermann MIT, BEST-Michigan
Brenda Martin, Zollner Electronics
Brian Toleno Ph.D., Microsoft Corporation
Brook Sandy-Smith, Indium Corporation
Catherine Shearer, Ormet Circuits, Inc.
Christopher Hunt Ph.D., Gen3 Systems
Clive Ashmore, ASM Assembly Systems
David Geiger, Flextronics International
David Hoover, TTM Technologies
Denis Jean, Kester
Dock Brown, DfR Solutions
Eric Bastow, Indium Corporation
Eric Camden, Foresite, Inc.
Fei Peng Ph.D., MacDermid Enthone Electronics Solutions
Gabriel Briceno Ph.D., Qual-Pro Corporation
Gary Ferrari MIT, FTG Circuits
Gerjan Diepstraten CIT, Vitronics Soltec
Greg Smith, FCT Assembly, Inc.
Gustaf Maertensson Ph.D., Chalmers University of Technology
Gustavo Arredondo, Para Tech Coating Inc.
Jagadeesh Radhakrishnan, Intel Corporation
James Fuller, Sanmina Corporation
Jasbir Bath
Jason Fullerton, Alpha
Jason Keeping, Celestica
Jeff Schake, ASM Assembly Systems
Jeffrey Lee Sr. CIT, iST - Integrated Service Technology
Jeffrey Rupert, ScanCAD International, Inc.
Jesse Greenwood, Hazardous Print Consulting Inc.
Jimmy Villalvazo, InterLatin Inc.
Joel Schrauben, Electro Scientific Industries, Inc.
Joerg Nolte, ERSA GmbH
John Coonrod, Rogers Corporation
John Lau Ph.D., ASM Assembly Materials Ltd.
Julie Silk, Keysight Technologies Inc.
Jun Balangue Jr., Keysight Technologies
Junaid Shafaat, Schneider Electric
Karl Sauter, Oracle America, Inc.
Kazuki Kammuri, Nippon Mining & Metals Co. Ltd
Keith Sweatman, Nihon Superior Co., Ltd.
Lars Bruno, Ericsson AB
Lee Hitchens, SCH Services Ltd.
Lenora Clark, MacDermid Enthone Electronics Solutions
Leonard Allison, Engineered Materials Systems, Inc.
Louis Ungar, Advanced Test Engineering Solutions, Inc.
Luis Lopez, Northrop Grumman Corporation
Mahesh Narayanaswamy, GE Healthcare
Maria Durham, Indium Corporation
Mark Routley, Gen3 Systems Limited
Martin Goetz, Northrop Grumman Corporation
Martin Wickham, NPL
MaryAlice Gill, Jabil Circuit, Inc.
Maxim Serebreni, DfR Solutions
Mike Bixenman DBA, Kyzen Corporation
Mitchell Holtzer, Alpha
Neil Hubble, Akrometrix LLC
Ning-Cheng Lee Ph.D., Indium Corporation
Paul Wood, OK International
Paul Zutter, U.S. Army Aviation & Missile Command
Pierre Eckold, Robert Bosch GmbH
Prabjit Singh, IBM Corporation
Ravi Parthasarathy, ZESTRON Americas
Reza Ghaffarian Ph.D., Jet Propulsion Laboratory
Rick Nichols, Atotech Deutschland GmbH
Robert Roush, OK International
Russell Nowland, Nokia
Ryo Murakami Ph.D., Fujitsu Laboratories
Saminda Dharmarathna Ph.D., MacDermid Enthone Electronics Solutions
Samuel LeBlanc, nScrypt Inc.
Scott Wischoffer, Fuji America Corporation
Seiya Kido, MEC Company, Ltd.
Shantanu Joshi, Koki Solder America Inc.
Sivakumar Vijayakumar, Keysight Technologies
Steve Butkovich, Test Innovation, LLC.
Steven Perng, Cisco Systems Inc.
Timothy O'Neill, AIM, Inc.
Tom Watson, Kimball Electronics
Tommy Fox, Optimal Electronics Corporation
Udo Welzel, Robert Bosch GmbH
Vern Solberg, Solberg Technical Consulting
William Loving, ScanCAD International, Inc.
Location
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1B
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Tue, Feb 14, 2017 - 1:30 PM to 3:00 PM
S01: Printing I
Presenter/Committee Chair: Jeff Schake, Senior Advanced Technology Specialist, ASM Assembly Systems
Presenter/Committee Chair: Tom Watson, Master Black Belt, Kimball Electronics
Presenter/Committee Chair: Jimmy Villalvazo, Innovation Director, InterLatin Inc.
Presenter/Committee Chair: Gabriel Briceno Ph.D., Senior Process Engineer, Qual-Pro Corporation
Seminar Type: Technical Conference Session
Track: Assembly Processes for Lead-Free and Tin Lead
Location: 1A
Printing I
Tue, Feb 14, 2017 - 1:30 PM to 3:00 PM
S02: Printed Electronics I
Presenter/Committee Chair: Alan Burk, President, ALMAX
Presenter/Committee Chair: Jesse Greenwood, Hazardous Print Consulting Inc.
Presenter/Committee Chair: Art Dobie, Technical Sales Rep, Ikonics Corp.
Seminar Type: Technical Conference Session
Track: Printed Electronics
Location: 4
S02: Printed Electronics I
Tue, Feb 14, 2017 - 1:30 PM to 3:00 PM
S03: High Speed/ High Frequency I
Presenter/Committee Chair: David Hoover, Field Application Engineer, TTM Technologies
Presenter/Committee Chair: Fei Peng Ph.D., Senoir Research Chemist, MacDermid Enthone Electronics Solutions
Presenter/Committee Chair: John Coonrod, Technical Marketing Manager, Rogers Corporation
Seminar Type: Technical Conference Session
Track: PCB Fabrication and Materials
Location: 2
S03: High Speed/ High Frequency I
Tue, Feb 14, 2017 - 1:30 PM to 3:00 PM
S04: Corrosion/ SIR Reliability I
Presenter/Committee Chair: Julie Silk, Keysight Technologies Inc.
Presenter/Committee Chair: Prabjit Singh, IBM Corporation
Presenter/Committee Chair: Mike Bixenman DBA, CTO, Kyzen Corporation
Seminar Type: Technical Conference Session
Track: Cleaning/Coating/Contamination
Location: 3
S04: Corrosion/ SIR Reliability I
Tue, Feb 14, 2017 - 1:30 PM to 3:00 PM
S05: Solder Reliability I
Presenter/Committee Chair: Jason Fullerton, Customer Technical Support Engineer, Alpha
Presenter/Committee Chair: Udo Welzel, Development Engineer, Robert Bosch GmbH
Presenter/Committee Chair: Ning-Cheng Lee Ph.D., VP of Technology, Indium Corporation
Presenter/Committee Chair: Shantanu Joshi, Technical Sales Engineer, Koki Solder America Inc.
Seminar Type: Technical Conference Session
Track: Assembly Processes for Lead Free and Tin-Lead
Location: 1B
S05: Solder Reliability I
Tue, Feb 14, 2017 - 3:30 PM to 5:00 PM
S06: Printing II/ Miniaturization
Presenter/Committee Chair: Jeff Schake, Senior Advanced Technology Specialist, ASM Assembly Systems
Presenter/Committee Chair: Greg Smith, Technical Sales, FCT Assembly, Inc.
Presenter/Committee Chair: Scott Wischoffer, Marketing Manager, Fuji America Corporation
Presenter/Committee Chair: Clive Ashmore, R&D Engineer, ASM Assembly Systems
Seminar Type: Technical Conference Session
Track: Assembly Processes for Lead Free and Tin-Lead
Location: 1A
S06: Printing II/ Miniaturization
Tue, Feb 14, 2017 - 3:30 PM to 5:00 PM
S07: Test I
Presenter/Committee Chair: Steve Butkovich, Consultant, Test Innovation, LLC.
Presenter/Committee Chair: Sivakumar Vijayakumar, Keysight Technologies
Presenter/Committee Chair: Louis Ungar, President, Advanced Test Engineering Solutions, Inc.
Presenter/Committee Chair: Jun Balangue Jr., Keysight Technologies
Seminar Type: Technical Conference Session
Track: Quality, Reliability and Test
Location: 1B
S07: Test I
Tue, Feb 14, 2017 - 3:30 PM to 5:00 PM
S08: PCB Laminate and Foils
Presenter/Committee Chair: Karl Sauter, Principal Engineer, Oracle America, Inc.
Presenter/Committee Chair: Andrew Piotrowski, ICL-IP America
Presenter/Committee Chair: Kazuki Kammuri, Technology Development, Nippon Mining & Metals Co. Ltd
Seminar Type: Technical Conference Session
Track: PCB Fabrication and Materials
Location: 3
S08: PCB Laminate and Foils
Tue, Feb 14, 2017 - 3:30 PM to 5:00 PM
S09: SIR/Flux Reliability
Presenter/Committee Chair: Jasbir Bath, Principal Engineer
Presenter/Committee Chair: Christopher Hunt Ph.D., Technology Leader, Gen3 Systems
Presenter/Committee Chair: Shantanu Joshi, Technical Sales Engineer, Koki Solder America Inc.
Presenter/Committee Chair: Eric Bastow, Field Application Engineer, Indium Corporation
Seminar Type: Technical Conference Session
Track: Quality, Reliability and Test
Location: 4
S09: SIR/Flux Reliability
Tue, Feb 14, 2017 - 3:30 PM to 5:00 PM
S10: Supply Chain I
Presenter/Committee Chair: Paul Zutter, Electronics Engineer, U.S. Army Aviation & Missile Command
Presenter/Committee Chair: William Loving, President & CEO, ScanCAD International, Inc.
Presenter/Committee Chair: Martin Goetz, Sr. Manager, Northrop Grumman Corporation
Seminar Type: Technical Conference Session
Track: Supply Chain/Business Issues
Location: 2
S10: Supply Chain I
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