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Date
Sun, Feb 12th, 2017
Mon, Feb 13th, 2017
Thu, Feb 16th, 2017
Type
Professional Development
Track
Assembly Processes for Lead Free and Tin-Lead
Cleaning/Coating/Contamination
Design
Emerging Technologies
PCB Fabrication and Materials
Quality, Reliability and Test
Speaker
Ah Feau Ng, TechMent Consultancy Sdn. Bhd.
Bhanu Sood, NASA Goddard Space Flight Center
Bob Klenke, ITM Consulting Inc.
Dale Lee, Plexus Corp.
Douglas Pauls, Rockwell Collins
Gustaf Maertensson Ph.D., Chalmers University of Technology
Happy Holden
James Barnhart MIT, BEST Inc.
Jennie Hwang Ph.D., Sc.D., H-Technologies Group
Jim Vanden Hogen, Plexus Corporation
John Lau Ph.D., ASM Assembly Materials Ltd.
Lee Hitchens, SCH Services Ltd.
Louis Ungar, Advanced Test Engineering Solutions, Inc.
Mark Finstad CID, Flexible Circuit Technologies, Inc.
Martin Anselm Ph.D., Rochester Institute of Technology
Michael Carano, RBP Chemical Technology, Inc.
Michael Creeden CID+, San Diego PCB, Inc.
Mike Bixenman DBA, Kyzen Corporation
Nick Koop CID, TTM Technologies
Ning-Cheng Lee Ph.D., Indium Corporation
Norman Mier Jr. MIT, BEST Inc.
Phil Zarrow, ITM Consulting Inc.
Rainer Thueringer Ph.D., CID+, MIT, FED-Fachverband Elektronik Design e.V.
Ray Prasad, Ray Prasad Consultancy Group
Richard Hartley CID, RHartley Enterprises
S. Manian Ramkumar Ph.D., College of Applied Science and Technology
Susy Webb CID, Design Science
Umut Tosun, ZESTRON Americas
Vern Solberg, Solberg Technical Consulting
W. James Hall, ITM Consulting Inc.
Location
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11A
11B
1A
1B
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3
4
5A
7B
8
9
Level
Advanced
Basic
Intermediate
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4
Caption: 21 - 30 of 34
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Mon, Feb 13, 2017 - 2:00 PM to 5:00 PM
PD21: Power Distribution and Decoupling
Presenter/Committee Chair: Richard Hartley CID, Sr. Principal Engineer, RHartley Enterprises
Seminar Type: Professional Development
Track: Design
Level: Intermediate
Location: 2
PD21_APEXEXPO17_Rick Hartley
Mon, Feb 13, 2017 - 2:00 PM to 5:00 PM
PD22: 3D Packaging and Fan-Out Wafer-Level Packaging
Presenter/Committee Chair: John Lau Ph.D., Sr. Technical Advisor, ASM Assembly Materials Ltd.
Seminar Type: Professional Development
Track: Emerging Technologies
Level: Intermediate
Location: 3
PD22_APEXEXPO17_John Lau
Mon, Feb 13, 2017 - 2:00 PM to 5:00 PM
PD23: Reliability: Failure Analysis for Improvement
Presenter/Committee Chair: Bhanu Sood, Commodity Risk Assessment Engineer (PCB), NASA Goddard Space Flight Center
Seminar Type: Professional Development
Track: Quality, Reliability and Test
Level: Intermediate
Location: 4
PD23_APEXEXPO17_Bhanu Sood
Mon, Feb 13, 2017 - 2:00 PM to 5:00 PM
PD24: Flexible Circuits from Design through Test: Lessons Learned
Presenter/Committee Chair: Mark Finstad CID, Senior Appication Engineer, Flexible Circuit Technologies, Inc.
Presenter/Committee Chair: Nick Koop CID, Sr. Field Application Engineer, TTM Technologies
Seminar Type: Professional Development
Track: Design
Level: Intermediate
Location: 5A
PD24_APEXEXPO17_Mark Finstad_Nick Koop
Thu, Feb 16, 2017 - 9:00 AM to 12:00 PM
PD25: Best Practices for Improving Manufacturing Productivity - Part 1
Presenter/Committee Chair: W. James Hall, Principal Consultant, ITM Consulting Inc.
Presenter/Committee Chair: Phil Zarrow, President and Principal Consultant, ITM Consulting Inc.
Seminar Type: Professional Development
Track: Assembly Processes for Lead Free and Tin-Lead
Level: Intermediate
Location: 7B
PD25_APEXEXPO17_Phil Zarrow_Jim Hall
Thu, Feb 16, 2017 - 9:00 AM to 12:00 PM
PD26: Process Challenges for Bottom Terminations Components (BTCs): QFN, DFN and MLF
Presenter/Committee Chair: Ray Prasad, Consultant, Ray Prasad Consultancy Group
Seminar Type: Professional Development
Track: Assembly Processes for Lead Free and Tin-Lead
Level: Intermediate
Location: 8
PD26_APEXEXPO17_Ray Prasad
PD26 Process Challenges for BTC-Quiz
Thu, Feb 16, 2017 - 9:00 AM to 12:00 PM
PD27: Cleaning Electronic Assemblies: Process, Materials, Analytics Advanced Level
Presenter/Committee Chair: Umut Tosun, Application Technology Mgr., ZESTRON Americas
Seminar Type: Professional Development
Track: Cleaning/Coating/Contamination
Level: Advanced
Location: 9
PD27_APEXEXPO17_Umut Tosun
Thu, Feb 16, 2017 - 9:00 AM to 12:00 PM
PD28: Failure Analysis of Electronic Assemblies
Presenter/Committee Chair: Martin Anselm Ph.D., Director, CEMA Lab, Rochester Institute of Technology
Seminar Type: Professional Development
Track: Assembly Processes for Lead Free and Tin-Lead
Level: Intermediate
Location: 10
PD28_APEXEXPO17_Martin Anselm
Thu, Feb 16, 2017 - 9:00 AM to 12:00 PM
PD29: HDI: Next Generation High Density Structures and Materials
Presenter/Committee Chair: Happy Holden, Director of Electronics-RETIRED
Seminar Type: Professional Development
Track: Emerging Technologies
Level: Intermediate
Location: 11A
PD29_APEXEXPO17_Happy Holden
Thu, Feb 16, 2017 - 9:00 AM to 12:00 PM
PD30: PCB Layout - Place and Route
Presenter/Committee Chair: Michael Creeden CID+, CEO/CID+ Instructor, San Diego PCB, Inc.
Seminar Type: Professional Development
Track: Design
Level: Intermediate
Location: 11B
PD30_APEXEXPO17_Michael Creeden
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Caption: 21 - 30 of 34
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