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Date
Sun, Feb 12th, 2017
Mon, Feb 13th, 2017
Thu, Feb 16th, 2017
Type
Professional Development
Track
Assembly Processes for Lead Free and Tin-Lead
Cleaning/Coating/Contamination
Design
Emerging Technologies
PCB Fabrication and Materials
Quality, Reliability and Test
Speaker
Ah Feau Ng, TechMent Consultancy Sdn. Bhd.
Bhanu Sood, NASA Goddard Space Flight Center
Bob Klenke, ITM Consulting Inc.
Dale Lee, Plexus Corp.
Douglas Pauls, Rockwell Collins
Gustaf Maertensson Ph.D., Chalmers University of Technology
Happy Holden
James Barnhart MIT, BEST Inc.
Jennie Hwang Ph.D., Sc.D., H-Technologies Group
Jim Vanden Hogen, Plexus Corporation
John Lau Ph.D., ASM Assembly Materials Ltd.
Lee Hitchens, SCH Services Ltd.
Louis Ungar, Advanced Test Engineering Solutions, Inc.
Mark Finstad CID, Flexible Circuit Technologies, Inc.
Martin Anselm Ph.D., Rochester Institute of Technology
Michael Carano, RBP Chemical Technology, Inc.
Michael Creeden CID+, San Diego PCB, Inc.
Mike Bixenman DBA, Kyzen Corporation
Nick Koop CID, TTM Technologies
Ning-Cheng Lee Ph.D., Indium Corporation
Norman Mier Jr. MIT, BEST Inc.
Phil Zarrow, ITM Consulting Inc.
Rainer Thueringer Ph.D., CID+, MIT, FED-Fachverband Elektronik Design e.V.
Ray Prasad, Ray Prasad Consultancy Group
Richard Hartley CID, RHartley Enterprises
S. Manian Ramkumar Ph.D., College of Applied Science and Technology
Susy Webb CID, Design Science
Umut Tosun, ZESTRON Americas
Vern Solberg, Solberg Technical Consulting
W. James Hall, ITM Consulting Inc.
Location
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11A
11B
1A
1B
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5A
7B
8
9
Level
Advanced
Basic
Intermediate
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Caption: 11 - 20 of 34
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Sun, Feb 12, 2017 - 2:00 PM to 5:00 PM
PD11: Advanced PCB Troubleshooting - Part 2
Presenter/Committee Chair: Michael Carano, VP Technology & Business Development, RBP Chemical Technology, Inc.
Seminar Type: Professional Development
Track: PCB Fabrication and Materials
Level: Advanced
Location: 4
PD11_APEXEXPO17_Michael Carano
Sun, Feb 12, 2017 - 2:00 PM to 5:00 PM
PD12: Building the Bridge Between Design and Manufacturing
Presenter/Committee Chair: Susy Webb CID, PCB Designer, Design Science
Seminar Type: Professional Development
Track: Design
Level: Intermediate
Location: 5A
PD12_APEXEXPO17_Susy Webb
Mon, Feb 13, 2017 - 9:00 AM to 12:00 PM
PD13: DFX-Design For Excellence: DFM, DFA, DFT and more - Part 1
Presenter/Committee Chair: Dale Lee, Senior Staff DFX Strategy Engineer, Plexus Corp.
Seminar Type: Professional Development
Track: Design
Level: Intermediate
Location: 1A
PD13_APEXEXPO17_DaleLee
Mon, Feb 13, 2017 - 9:00 AM to 12:00 PM
PD14: Selective Soldering: Enhanced Reliability, Quality, and Flexibility with Closed-Loop Process Control
Presenter/Committee Chair: Bob Klenke, Principal Consultant, ITM Consulting Inc.
Seminar Type: Professional Development
Track: Assembly Processes for Lead Free and Tin-Lead
Level: Intermediate
Location: 1B
PD14_APEXEXPO17_Bob Klenke
Mon, Feb 13, 2017 - 9:00 AM to 12:00 PM
PD15: Stencil Printing Process and Solder Paste Inspection: A Comprehensive Review - for Increased Efficiency
Presenter/Committee Chair: S. Manian Ramkumar Ph.D., Dean, College of Applied Science and Technology
Seminar Type: Professional Development
Track: Assembly Processes for Lead Free and Tin-Lead
Level: Intermediate
Location: 2
PD15_APEXEXPO17_S.Manian Ramkumar
Mon, Feb 13, 2017 - 9:00 AM to 12:00 PM
PD16: Cleaning and Contamination Control for Reliability
Presenter/Committee Chair: Mike Bixenman DBA, CTO, Kyzen Corporation
Seminar Type: Professional Development
Track: Cleaning/Coating/Contamination
Level: Intermediate
Location: 3
PD16_APEXEXPO17_Mike Bixenman
Mon, Feb 13, 2017 - 9:00 AM to 12:00 PM
PD17: Advanced Rework: Hands-on BGA Reballing and Leadless Devices
Presenter/Committee Chair: Norman Mier Jr. MIT, Senior Technical Trainer, BEST Inc.
Presenter/Committee Chair: James Barnhart MIT, Master Instructor/Course Developer, BEST Inc.
Seminar Type: Professional Development
Track: Assembly Processes for Lead Free and Tin-Lead
Level: Intermediate
Location: 4
PD17_APEXEXPO17_Norman Mier_Jim Barnhart
Mon, Feb 13, 2017 - 9:00 AM to 12:00 PM
PD18: Preventing Defects and Product Failures
Presenter/Committee Chair: Jennie Hwang Ph.D., Sc.D., CEO, H-Technologies Group
Seminar Type: Professional Development
Track: Assembly Processes for Lead Free and Tin-Lead
Level: Intermediate
Location: 5A
PD18_APEXEXPO17_Jennie Hwang
Mon, Feb 13, 2017 - 2:00 PM to 5:00 PM
PD19: DFX-Design For Excellence: DFM, DFA, DFT and more - Part 2
Presenter/Committee Chair: Dale Lee, Senior Staff DFX Strategy Engineer, Plexus Corp.
Seminar Type: Professional Development
Track: Design
Level: Intermediate
Location: 1A
PD19_APEXEXPO17_DaleLee
Mon, Feb 13, 2017 - 2:00 PM to 5:00 PM
PD20: PCB Fabrication Basics: Process and Specifications
Presenter/Committee Chair: Jim Vanden Hogen, Sr. Designer, Plexus Corporation
Seminar Type: Professional Development
Track: PCB Fabrication and Materials
Level: Basic
Location: 1B
PD20_APEXEXPO17_Jim Vanden Hogen
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Caption: 11 - 20 of 34
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