328 Martin Avenue Santa Clara, CA 95050 United States
About the Company:
PacTech, (group member
of NAGASE & CO., Ltd.) is headquartered in Nauen, Germany,
with wholly-owned subsidiaries: PacTech USA - Packaging
Technologies Inc. in Silicon Valley, USA and PacTech ASIA
Sdn. Bhd. in Penang, Malaysia. PacTech is comprised of two
unique advanced packaging units:
1-... (more)
PacTech, (group member
of NAGASE & CO., Ltd.) is headquartered in Nauen, Germany,
with wholly-owned subsidiaries: PacTech USA - Packaging
Technologies Inc. in Silicon Valley, USA and PacTech ASIA
Sdn. Bhd. in Penang, Malaysia. PacTech is comprised of two
unique advanced packaging units:
1- EQUIPMENT MANUFACTURING:
PacLine 300 A50: Automatic ENIG & ENEPIG plating tools.
SB²-Jet: Laser solder jetting tool
Ultra-SB²: Wafer level solder ball transfer system
LAPLACE: Laser-assisted flip-chip bonders
2- SUBCONTRACT SERVICES:
Flip Chip and Wafer Level Package Bumpi (less)
