OEM Press Systems, Inc. offers vacuum enclosed hydraulic press systems which incorporate the latest lamination technology for high layer count PCBs, Flexible Circuits, Rigid Flex and CCL providing accurate & repeatable process control with even pressure application and superb temperature uniformity over the entire surface area of the platen resulting in uniform thickness across the entire product. High temp vacuum presses are offered for LCP, Teflon bonding and high-temp applications. (less)