Our high performance metal powder atomizing process is designed to meet the demands for ultrafine metallic powders as the trend to miniaturization in the electronics industry accelerates. Our unique technology provides us with spherical powders specifically in the 2 to 25 micron range for the solder paste and bumping applications. We excel in the production of low melting point alloys starting as low as 61 ◦C. The flexibility of our process enables us help you meet your next generation products and turn challenges into opportunities. (less)