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Date
Tue, Mar 15th, 2016
Wed, Mar 16th, 2016
Thu, Mar 17th, 2016
Seminar Type
Technical Conference Session
Speaker
Anthony Lentz, FCT Assembly, Inc.
Brook Sandy-Smith, Indium Corporation
Emmanuelle Guene, Inventec Performance Chemicals
Eric Bastow, Indium Corporation
Jigel Patel, Zestron Americas
Karen Tellefsen Ph.D.
Karl Seelig, AIM, Inc.
Ning-Cheng Lee Ph.D., Indium Corporation
Rafael Padilla, Senju Comtek
Timothy O'Neill, AIM, Inc.
Ursula Marquez De Tino Ph.D., Plexius Corporation
Location
S225
S228
Topic/Track
Assembly Processes for Lead Free and Tin-Lead
PCB Fabrication and Materials
Quality, Reliability and Test
Programs: 3
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Tue, Mar 15, 2016 - 3:30 PM to 5:00 PM
S05: Solder Paste Development
Moderator: Eric Bastow, Indium Corporation
Speaker: Karl Seelig, Vice President Technology, AIM, Inc.
Speaker: Rafael Padilla, Senju Comtek
Speaker: Timothy O'Neill, Technical Marketing Manager, AIM, Inc.
Speaker: Anthony Lentz, Field Application Engineer, FCT Assembly, Inc.
Seminar Type: Technical Conference Session
Topic/Track: Assembly Processes for Lead Free and Tin-Lead
Location: S225
S05: Solder Paste Development - Updated
Wed, Mar 16, 2016 - 1:30 PM to 3:00 PM
S13: Flux Reliability I
Moderator: Eric Bastow, Indium Corporation
Speaker: Ursula Marquez De Tino Ph.D., Senior Staff Process Engineer, Plexius Corporation
Speaker: Karen Tellefsen Ph.D.
Speaker: Ning-Cheng Lee Ph.D., VP of Technology, Indium Corporation
Seminar Type: Technical Conference Session
Topic/Track: Quality, Reliability and Test
Location: S228
S13
S13: Flux Reliability I - UPDATED
Thu, Mar 17, 2016 - 10:30 AM to 12:00 PM
S25: Flux Reliability II
Moderator: Brook Sandy-Smith, Product Support Specialist, Indium Corporation
Speaker: Jigel Patel, Senior Process Engineer, Zestron Americas
Speaker: Emmanuelle Guene, Application Manager, Inventec Performance Chemicals
Speaker: Eric Bastow, Indium Corporation
Seminar Type: Technical Conference Session
Topic/Track: PCB Fabrication and Materials
Location: S228
S25: Flux Reliability II - Updated
Programs: 3
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