Final finishes: NEW electroless nickel/immersion gold, RGA immersion silver, RMK immersion tin and DIG immersion gold (or new Talon e-pd) over copper. Uyemura's electroless gold and palladium(ENEPIG) products; high throw electrolytic nickel; acid coppers (including market leading via fill... (more)
Final finishes: NEW electroless nickel/immersion gold, RGA immersion silver, RMK immersion tin and DIG immersion gold (or new Talon e-pd) over copper. Uyemura's electroless gold and palladium(ENEPIG) products; high throw electrolytic nickel; acid coppers (including market leading via fill copper-EVF); Umicore Galvanotechnik's precious metal electrolytic plating processes and MEC's NEW EVEN HIGHER TECHNOLOGY/ MORE COST EFFICIENT LINE of specialty copper etching processes. Representing Europlasma in North America--conformal plasma coatings to waterproof electronics or other product lines. (less)