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IPC APEX EXPO 2016
TOPLINE Corporation
Exhibitor
Booth: 969
About the Company:
CGA - Column Grid Arrays are more reliable than BGA for absorbing large CTE mismatch between ceramic substrates PC boards. Variety of column types including copper wrapped, plain columns and NASA type Micro-Coil Springs. See our new copper plated solder columns for high heat dissipation. Daisy... (more)
Main Contact:
Other Contacts:
JARED WILSON
Booth Staff
SALES MANAGER
TOPLINE Corporation
Martin Hart
Booth Staff
President
TOPLINE Corporation
TOPLINE Corporation's Wall: (Public Messages)
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