My Planner - TOPLINE Corporation

TOPLINE Corporation

Exhibitor

Booth: 969

You must log in to view additional information about this exhibitor.


	About the Company:

CGA - Column Grid Arrays are more reliable than BGA for absorbing large CTE mismatch between ceramic substrates PC boards. Variety of column types including copper wrapped, plain columns and NASA type Micro-Coil Springs. See our new copper plated solder columns for high heat dissipation. Daisy... (more)

Additional Info:

Company's Categories:

Assembly Equipment - Chip Placement
Assembly Equipment - Component Insertion
Assembly Equipment - Feeding Systems-Bulk
Assembly Equipment - Fine-Pitch Placement
Assembly Equipment - Flip-Chip Technology
Assembly Equipment - Multifunctional Placement
Assembly Equipment - Odd Form
Ball Placement Systems & Equipment
Components
Die Bonding Equipment
Embedded Technologies
Hand Tools
Materials - Chip Packaging
Materials - Other
Microvias/Embedded Components
Packing & Storage
Prototyping
Repair & Rework
Tooling Equipment & Supplies

Main Contact:

Other Contacts:

JARED WILSON

Booth Staff

SALES MANAGER

TOPLINE Corporation

Martin Hart

Booth Staff

President

TOPLINE Corporation

TOPLINE Corporation's Wall: (Public Messages)

Note: You must login to make a posting.

Note: This company does not have any wall postings.

Note: You must be connected to this person to post on his/her wall.