Nordson YESTECH, a division of the Nordson Corporation (NASDAQ: NDSN) will showcase its new FX-940 ULTRA 3D AOI which incorporates cutting-edge 3D technology for the inspection of solder defects, lead defects/lifted leads and co-planarity of chips, BGA’s and other height sensitive devices. The systems’ advanced 3D sensor provides industry leading metrology capabilities and shadow-free imaging at speeds of up to 8X faster than other systems. The FX-940 Ultra’s comprehensive inspection algorithms and “Ultra Reflection Suppression” ( URS ) technology offers industry leading 3D imaging. (less)