Contact Us | About My Planner
IPC APEX EXPO 2016
HEPCO Inc.
HEPCO Inc.
Exhibitor
Booth: 1657
About the Company:
BGA Sphere Placement equipment and supplies; Lead Cutting and Forming equipment for axial components, transistors, capacitors, DIPs, SIPs, crystal oscillators and LEDs. Able to process parts from tape and reel, tube, card or bulk; PCB Depaneling machines for routed PCBs.
Main Contact:
Other Contacts:
Tim Hoffman
Booth Staff
President
HEPCO Inc.
Ken Thompson
Booth Staff
Technical Consultant
HEPCO Inc.
Olivier Weeger
Booth Staff
Sales
HEPCO Inc.
HEPCO Inc.'s Wall: (Public Messages)
Note: This company does not have any wall postings.
Note: You must be connected to this person to post on his/her wall.
GoExpo stable-v4.14.542, Copyright © 2006-2019 Core-apps LLC.
Privacy · Legal · Contact · About