Fri, Feb 24, 2012 - 8:30 AM to 5:00 PM
Advanced Designer Certification Workshop(CID+)
Location: San Diego Convention Center
Event Type: Designer
Room: 13
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Fri, Feb 24, 2012 - 8:30 AM to 5:00 PM
Designer Certification Workshop (CID)
Location: San Diego Convention Center
Event Type: Designer
Room: 12
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Sat, Feb 25, 2012 - 8:00 AM to 12:00 PM
7-31B: IPC-A-610 Task Group
Location: San Diego Convention Center
Topic/Track: Assembly Processes for Lead Free and Tin Lead
Event Type: Standard Development Committee Meeting
General Committee: Product Assurance
Room: 14B
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Sat, Feb 25, 2012 - 8:00 AM to 5:00 PM
8-41: Technology Roadmap Subcommittee
Location: San Diego Convention Center
Topic/Track: Supply Chain/Business Issues
Event Type: Standard Development Committee Meeting
General Committee: Management
Room: 15B
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Sat, Feb 25, 2012 - 8:30 AM to 5:00 PM
Advanced Designer Certification Workshop(CID+)
Location: San Diego Convention Center
Event Type: Designer
Room: 13
|
Sat, Feb 25, 2012 - 8:30 AM to 5:00 PM
Designer Certification Workshop (CID)
Location: San Diego Convention Center
Event Type: Designer
Room: 12
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Sat, Feb 25, 2012 - 1:00 PM to 5:00 PM
5-22A: J-STD-001 Task Group
Location: San Diego Convention Center
Topic/Track: Assembly Processes for Lead Free and Tin Lead
Event Type: Standard Development Committee Meeting
General Committee: Assembly and Joining
Room: 14B
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Sun, Feb 26, 2012 - 8:00 AM to 3:00 PM
8-51: Jisso North America Council (JNAC)
Location: San Diego Convention Center
Topic/Track: Supply Chain/Business Issues
Event Type: Standard Development Committee Meeting
General Committee: Xtras
Room: 11B
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Sun, Feb 26, 2012 - 8:00 AM to 3:00 PM
5-22A/7-31B: Synergy Meeting - J-STD-001 & IPC-A-610 Task Groups
Location: San Diego Convention Center
Topic/Track: Assembly Processes for Lead Free and Tin Lead
Event Type: Standard Development Committee Meeting
General Committee: Assembly and Joining
Room: 14B
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Sun, Feb 26, 2012 - 8:00 AM to 9:00 AM
2-30: Terms and Definitions Committee
Location: San Diego Convention Center
Topic/Track: PCB Fabrication and Materials
Event Type: Standard Development Committee Meeting
General Committee: Terms and Definitions
Room: 15A
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Sun, Feb 26, 2012 - 8:30 AM to 3:00 PM
Location: San Diego Convention Center
Event Type: Designer
Room: 12
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Sun, Feb 26, 2012 - 8:30 AM to 3:00 PM
Location: San Diego Convention Center
Event Type: Designer
Room: 13
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Sun, Feb 26, 2012 - 9:00 AM to 4:30 PM
7-31A/D-33A: Joint Meeting - IPC-A-600 and Rigid Printed Board Performance Specifications Task Groups
Location: San Diego Convention Center
Topic/Track: PCB Fabrication and Materials
Event Type: Standard Development Committee Meeting
General Committee: Rigid Printed Boards
Room: 15A
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Sun, Feb 26, 2012 - 9:00 AM to 12:00 PM
PD01: Building Long-Term Reliability in PCBs: Materials, Plating Processes and Innerlayer Treatments for Lead-Free Assembly Requirements
Location: San Diego Convention Center
Topic/Track: Quality, Reliability and Test
Event Type: Professional Development
Level: Intermediate
Room: 1A
|
Sun, Feb 26, 2012 - 9:00 AM to 12:00 PM
PD03: Chip Packaging - Materials, Quality and Reliability
Location: San Diego Convention Center
Topic/Track: Emerging Technologies
Event Type: Professional Development
Level: Intermediate
Room: 10
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Sun, Feb 26, 2012 - 9:00 AM to 12:00 PM
PD04: Guidelines for Cleaning Printed Boards and Assemblies: IPC-CH-65B
Location: San Diego Convention Center
Topic/Track: Cleaning/Coating/Contamination
Event Type: Professional Development
Level: Intermediate
Room: 3
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Sun, Feb 26, 2012 - 9:00 AM to 12:00 PM
PD07: PCB Fabrication Basics: Process and Specification (Part 1)
Location: San Diego Convention Center
Topic/Track: PCB Fabrication and Materials
Event Type: Professional Development
Level: Basic
Room: 4
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Sun, Feb 26, 2012 - 9:00 AM to 12:00 PM
PD08: Design for Manufacturing
Location: San Diego Convention Center
Topic/Track: Design
Event Type: Professional Development
Level: Intermediate
Room: 7B
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Sun, Feb 26, 2012 - 9:00 AM to 12:00 PM
PD09: Counterfeit Components - Causes, Cures and Solutions
Presenter/Committee Chair(s): Bob Willis, ASKbobwillis.com
Location: San Diego Convention Center
Topic/Track: Supply Chain/Business Issues
Event Type: Professional Development
Level: Advanced
Room: 7A
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Sun, Feb 26, 2012 - 9:00 AM to 12:00 PM
PD13: Best Practices in Electronics Assembly Processes (Part 1)
Location: San Diego Convention Center
Topic/Track: Assembly Processes for Lead Free and Tin Lead
Event Type: Professional Development
Level: Basic
Room: 2
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Sun, Feb 26, 2012 - 9:00 AM to 12:00 PM
PD14: Signal Integrity Problem Prevention: High-Speed Routing & Termination
Location: San Diego Convention Center
Topic/Track: Design
Event Type: Professional Development
Level: Intermediate
Room: 11A
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Sun, Feb 26, 2012 - 9:00 AM to 12:00 PM
PD21: Basics of PCB Design
Location: San Diego Convention Center
Topic/Track: Design
Event Type: Professional Development
Level: Basic
Room: 5B
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Sun, Feb 26, 2012 - 9:00 AM to 12:00 PM
PD25: Conformal Coatings: Types, Uses and Specifications
Location: San Diego Convention Center
Topic/Track: Cleaning/Coating/Contamination
Event Type: Professional Development
Level: Basic
Room: 8
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Sun, Feb 26, 2012 - 9:00 AM to 12:00 PM
PD31: SMT Process Fundamentals for Tin-Lead and Lead-Free Assembly
Location: San Diego Convention Center
Topic/Track: Assembly Processes for Lead Free and Tin Lead
Event Type: Professional Development
Level: Basic
Room: 5A
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Sun, Feb 26, 2012 - 9:00 AM to 12:00 PM
PD50: Flexible and Rigid-Flex Circuit Design Principles and Fabrication
Location: San Diego Convention Center
Topic/Track: PCB Fabrication and Materials
Event Type: Professional Development
Level: Basic
Room: 1B
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Sun, Feb 26, 2012 - 10:00 AM to 6:00 PM
4-33A: Low-Halogen Guideline Task Group
Location: San Diego Convention Center
Topic/Track: Environmental Issues and Compliance
Event Type: Standard Development Committee Meeting
General Committee: Environment, Health & Safety (EHS)
Room: 15B
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Sun, Feb 26, 2012 - 10:00 AM to 9:00 PM
IPC APEX EXPO Golf Tournament & Reception
Event Type: Special Event
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Sun, Feb 26, 2012 - 2:00 PM to 5:00 PM
PD02: PCB Fabrication Basics: Process and Specification (Part 2)
Location: San Diego Convention Center
Topic/Track: PCB Fabrication and Materials
Event Type: Professional Development
Level: Basic
Room: 4
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Sun, Feb 26, 2012 - 2:00 PM to 5:00 PM
PD10: Final Finishes - Compatibility with Lead-Free Assembly
Location: San Diego Convention Center
Topic/Track: PCB Fabrication and Materials
Event Type: Professional Development
Level: Intermediate
Room: 1A
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Sun, Feb 26, 2012 - 2:00 PM to 5:00 PM
PD16: Mastering Lead-Free and Tin-Lead Selective Soldering
Location: San Diego Convention Center
Topic/Track: Assembly Processes for Lead Free and Tin Lead
Event Type: Professional Development
Level: Intermediate
Room: 7B
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Sun, Feb 26, 2012 - 2:00 PM to 5:00 PM
PD17: Best Practices in Electronics Assembly Processes (Part 2)
Location: San Diego Convention Center
Topic/Track: Assembly Processes for Lead Free and Tin Lead
Event Type: Professional Development
Level: Basic
Room: 2
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Sun, Feb 26, 2012 - 2:00 PM to 5:00 PM
PD18: Design of Experiment for SMT Processes
Location: San Diego Convention Center
Topic/Track: Assembly Processes for Lead Free and Tin Lead
Event Type: Professional Development
Level: Basic
Room: 8
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Sun, Feb 26, 2012 - 2:00 PM to 5:00 PM
PD19: Controlling Moisture Content in Boards: Best Practices
Location: San Diego Convention Center
Topic/Track: Quality, Reliability and Test
Event Type: Professional Development
Level: Intermediate
Room: 10
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Sun, Feb 26, 2012 - 2:00 PM to 5:00 PM
PD20: Troubleshooting Your Cleaning Process for High Reliability
Presenter/Committee Chair(s): Umut Tosun, ZESTRON America
Location: San Diego Convention Center
Topic/Track: Cleaning/Coating/Contamination
Event Type: Professional Development
Level: Intermediate
Room: 9
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Sun, Feb 26, 2012 - 2:00 PM to 5:00 PM
Location: San Diego Convention Center
Topic/Track: Assembly Processes for Lead Free and Tin Lead
Event Type: Professional Development
Level: Advanced
Room: 11A
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Sun, Feb 26, 2012 - 2:00 PM to 5:00 PM
PD35: Design for Flexible and Rigid-flex Circuits-Part II
Location: San Diego Convention Center
Topic/Track: PCB Fabrication and Materials
Event Type: Professional Development
Level: Intermediate
Room: 1B
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Sun, Feb 26, 2012 - 2:00 PM to 5:00 PM
PD40: Advanced Component Packages and Processes
Location: San Diego Convention Center
Topic/Track: Emerging Technologies
Event Type: Professional Development
Level: Intermediate
Room: 5A
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Sun, Feb 26, 2012 - 2:00 PM to 5:00 PM
PD42: Tin Whiskers: Origin, Propensity, Mitigation
Location: San Diego Convention Center
Topic/Track: Quality, Reliability and Test
Event Type: Professional Development
Level: Intermediate
Room: 3
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Sun, Feb 26, 2012 - 2:00 PM to 5:00 PM
PD43: Designing Complex Boards
Location: San Diego Convention Center
Topic/Track: Design
Event Type: Professional Development
Level: Intermediate
Room: 5B
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Sun, Feb 26, 2012 - 2:00 PM to 5:00 PM
PD52: LGA, QFN, BMC Assembly & Rework
Presenter/Committee Chair(s): Bob Willis, ASKbobwillis.com
Location: San Diego Convention Center
Topic/Track: Assembly Processes for Lead Free and Tin Lead
Event Type: Professional Development
Level: Intermediate
Room: 7A
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Sun, Feb 26, 2012 - 3:00 PM to 4:30 PM
5-20: Assembly & Joining Committee
Location: San Diego Convention Center
Topic/Track: Assembly Processes for Lead Free and Tin Lead
Event Type: Standard Development Committee Meeting
General Committee: Assembly and Joining
Room: 14B
|
Sun, Feb 26, 2012 - 4:30 PM to 6:00 PM
CCC: Committee Chairman Council (By Invitation)
Location: San Diego Convention Center
Event Type: Standard Development Committee Meeting
General Committee: Management
Room: 14B
|
Mon, Feb 27, 2012 - 7:30 AM to 1:30 PM
Presenter/Committee Chair(s): Dieter Bergman, Director, Technology Transfer, IPCVern Solberg, Senior Consultant, Solberg Technical ConsultingRichard Hartley CID, Sr. Principal Engineer, L-3 Avionics Systems Inc.Karen McConnell CID, Manager EDA, Northrop Grumman CorporationThomas Hausherr CID+, President, PCB Libraries
Location: San Diego Convention Center
Topic/Track: Design
Event Type: Designer
Room: 6D
|
Mon, Feb 27, 2012 - 7:30 AM to 5:00 PM
EMS Management Council Meeting
Presenter/Committee Chair(s): Fern Abrams, Director, Government Relations/Environmental Policy, IPCAndrew Hamelynck, Vice President of Mission Assurance, L-3 Communications Telemetry-WestTony Zhou, Vice President of Operations, RayVal (Suzhou) Technologies Co. Ltd.Roger Engle, President, AESCO ElectronicsLorena Martinez, CIO, EPIC TechnologiesDave Doherty, Vice President Global Supplier and Product Operations, Digi-Key Corporation
Location: San Diego Convention Center
Topic/Track: Supply Chain/Business Issues
Event Type: Management
Room: 6C
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Mon, Feb 27, 2012 - 7:30 AM to 5:00 PM
PCB Executive Management Meeting
Presenter/Committee Chair(s): Fern Abrams, Director, Government Relations/Environmental Policy, IPCAndrew Hamelynck, Vice President of Mission Assurance, L-3 Communications Telemetry-WestShawn DuBravac, Chief Economist, Consumer Electronics AssociationJoel Yocom, Reshore AmericaJeremy Wu, CEO, Huizhou King Brother Circuit TechnologyWalter Moser, CSO Industrial & Automotive Solutions, AT&S Austria Technologie & Systemtechnik AGJay Desai, Directors of Marketing, M-Flex (Multi-Fineline Electronix Inc.)
Location: San Diego Convention Center
Topic/Track: Supply Chain/Business Issues
Event Type: Management
Room: 6E
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Mon, Feb 27, 2012 - 8:00 AM to 12:00 PM
5-23B: Component and Wire Solderability Specification Task Group
Location: San Diego Convention Center
Topic/Track: Cleaning/Coating/Contamination
Event Type: Standard Development Committee Meeting
General Committee: Assembly and Joining
Room: 11B
|
Mon, Feb 27, 2012 - 8:00 AM to 5:00 PM
Introduction to EMS Training and Program Management
Location: San Diego Convention Center
Topic/Track: Supply Chain/Business Issues
Event Type: Management
Room: 13
|
Mon, Feb 27, 2012 - 8:00 AM to 10:00 AM
5-22F: J-STD-001 Handbook Task Group
Location: San Diego Convention Center
Topic/Track: Assembly Processes for Lead Free and Tin Lead
Event Type: Standard Development Committee Meeting
General Committee: Assembly and Joining
Room: 8
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Mon, Feb 27, 2012 - 8:00 AM to 12:00 PM
3-11: Laminate/Prepreg Materials Subcommittee
Location: San Diego Convention Center
Topic/Track: PCB Fabrication and Materials
Event Type: Standard Development Committee Meeting
General Committee: Base Materials
Room: 12
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Mon, Feb 27, 2012 - 8:00 AM to 5:00 PM
5-33F: Potting and Encapsulation Task Group
Location: San Diego Convention Center
Topic/Track: Cleaning/Coating/Contamination
Event Type: Standard Development Committee Meeting
General Committee: Cleaning and Coating
Room: 14A
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Mon, Feb 27, 2012 - 8:00 AM to 10:00 AM
D-35: Printed Board Storage and Handling Subcommittee
Location: San Diego Convention Center
Topic/Track: Quality, Reliability and Test
Event Type: Standard Development Committee Meeting
General Committee: Rigid Printed Boards
Room: 7A
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Mon, Feb 27, 2012 - 8:00 AM to 9:00 AM
7-30: Product Assurance Committee
Location: San Diego Convention Center
Topic/Track: Quality, Reliability and Test
Event Type: Standard Development Committee Meeting
General Committee: Product Assurance
Room: 14B
|
Mon, Feb 27, 2012 - 8:00 AM to 12:00 PM
2-18: Supplier Declaration Subcommittee
Location: San Diego Convention Center
Topic/Track: Supply Chain/Business Issues
Event Type: Standard Development Committee Meeting
General Committee: Electronic Product Data Description
Room: 15A
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Mon, Feb 27, 2012 - 9:00 AM to 5:00 PM
7-31F: Wire Harness Acceptability Task Group
Location: San Diego Convention Center
Topic/Track: Assembly Processes for Lead Free and Tin Lead
Event Type: Standard Development Committee Meeting
General Committee: Product Assurance
Room: 14B
|
Mon, Feb 27, 2012 - 9:00 AM to 12:00 PM
PD05: Troubleshooting SMT: Part I - Defining the Problem, Determining the Cause
Location: San Diego Convention Center
Topic/Track: Assembly Processes for Lead Free and Tin Lead
Event Type: Professional Development
Level: Basic
Room: 5A
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Mon, Feb 27, 2012 - 9:00 AM to 12:00 PM
PD23: Failure Analysis: Lessons Learned
Location: San Diego Convention Center
Topic/Track: Quality, Reliability and Test
Event Type: Professional Development
Level: Intermediate
Room: 1A
|
Mon, Feb 27, 2012 - 9:00 AM to 12:00 PM
PD26: PoP and BTC Assembly - Material, Process and Reliability
Location: San Diego Convention Center
Topic/Track: Assembly Processes for Lead Free and Tin Lead
Event Type: Professional Development
Level: Intermediate
Room: 1B
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Mon, Feb 27, 2012 - 9:00 AM to 12:00 PM
PD27: Optimizing X-Ray Inspection: Equipment, Processes and Procedures
Location: San Diego Convention Center
Topic/Track: Quality, Reliability and Test
Event Type: Professional Development
Level: Intermediate
Room: 10
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Mon, Feb 27, 2012 - 9:00 AM to 12:00 PM
PD29: DFM for Manufacturing: When a Six Sigma Process Is Not Sufficient to Achieve a High-Yield Man
Location: San Diego Convention Center
Topic/Track: Design
Event Type: Professional Development
Level: Intermediate
Room: 5B
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Mon, Feb 27, 2012 - 9:00 AM to 12:00 PM
PD30: Ball Grid Array (BGA): Principles and Practice
Location: San Diego Convention Center
Topic/Track: Assembly Processes for Lead Free and Tin Lead
Event Type: Professional Development
Level: Advanced
Room: 3
|
Mon, Feb 27, 2012 - 9:00 AM to 12:00 PM
PD33: Conformal Coating Applications, Inspection, Rework & Quality Control
Presenter/Committee Chair(s): Bob Willis, ASKbobwillis.com
Location: San Diego Convention Center
Topic/Track: Cleaning/Coating/Contamination
Event Type: Professional Development
Level: Basic
Room: 9
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Mon, Feb 27, 2012 - 9:00 AM to 12:00 PM
PD46: Lead-Free for the Exemptee: Surviving in a Lead-Free World
Location: San Diego Convention Center
Topic/Track: Assembly Processes for Lead Free and Tin Lead
Event Type: Professional Development
Level: Advanced
Room: 2
|
Mon, Feb 27, 2012 - 9:00 AM to 12:00 PM
PD49: Testability Strategies: Optimizing the Mix
Location: San Diego Convention Center
Topic/Track: Quality, Reliability and Test
Event Type: Professional Development
Level: Intermediate
Room: 11A
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Mon, Feb 27, 2012 - 10:00 AM to 12:00 PM
4-34B: Marking, Symbols and Labels for Identification of Assemblies, Components and Devices Task Group
Location: San Diego Convention Center
Topic/Track: Environmental Issues and Compliance
Event Type: Standard Development Committee Meeting
General Committee: Environment, Health & Safety (EHS)
Room: 15B
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Mon, Feb 27, 2012 - 10:00 AM to 12:00 PM
5-21E: Solder Stencil Task Group
Location: San Diego Convention Center
Topic/Track: Design
Event Type: Standard Development Committee Meeting
General Committee: Assembly and Joining
Room: 8
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Mon, Feb 27, 2012 - 10:15 AM to 12:00 PM
D-36: Printed Board Process Capability, Quality and Relative Reliability Benchmark Test Subcommittee
Location: San Diego Convention Center
Topic/Track: Quality, Reliability and Test
Event Type: Standard Development Committee Meeting
General Committee: Rigid Printed Boards
Room: 7B
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Mon, Feb 27, 2012 - 12:00 PM to 1:30 PM
Committee Awards Luncheon
Location: San Diego Convention Center
Event Type: Special Event
Room: 6A
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Mon, Feb 27, 2012 - 1:30 PM to 3:15 PM
2-40: Electronic Documentation Technology Committee
Location: San Diego Convention Center
Topic/Track: Supply Chain/Business Issues
Event Type: Standard Development Committee Meeting
General Committee: Electronic Documentation Technology
Room: 15A
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Mon, Feb 27, 2012 - 1:30 PM to 5:00 PM
2-18B: Materials Declaration Task Group
Location: San Diego Convention Center
Topic/Track: Supply Chain/Business Issues
Event Type: Standard Development Committee Meeting
General Committee: Electronic Product Data Description
Room: 15B
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Mon, Feb 27, 2012 - 1:30 PM to 5:00 PM
5-23A: Printed Circuit Board Solderability Specifications Task Group
Location: San Diego Convention Center
Topic/Track: Cleaning/Coating/Contamination
Event Type: Standard Development Committee Meeting
General Committee: Assembly and Joining
Room: 11B
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Mon, Feb 27, 2012 - 1:30 PM to 5:00 PM
5-32B: SIR and Electrochemical Migration Task Group
Location: San Diego Convention Center
Topic/Track: Cleaning/Coating/Contamination
Event Type: Standard Development Committee Meeting
General Committee: Cleaning and Coating
Room: 7A
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Mon, Feb 27, 2012 - 1:30 PM to 3:00 PM
5-41: SMT Component Placement Equipment Subcommittee
Location: San Diego Convention Center
Topic/Track: Assembly Processes for Lead Free and Tin Lead
Event Type: Standard Development Committee Meeting
General Committee: Assembly Equipment
Room: 8
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Mon, Feb 27, 2012 - 1:30 PM to 3:00 PM
3-12D: Woven Glass Reinforcement Task Group
Location: San Diego Convention Center
Topic/Track: PCB Fabrication and Materials
Event Type: Standard Development Committee Meeting
General Committee: Base Materials
Room: 12
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Mon, Feb 27, 2012 - 1:30 PM to 3:00 PM
1-10C: Test Coupon and Artwork Generation Task Group
Location: San Diego Convention Center
Topic/Track: Quality, Reliability and Test
Event Type: Standard Development Committee Meeting
General Committee: Printed Board Design Technology
Room: 7B
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Mon, Feb 27, 2012 - 1:30 PM to 5:00 PM
V9-70: IPC Printed Electronics Management Council Steering Committee(By Invitation)
Location: San Diego Convention Center
Topic/Track: Printed Electronics
Event Type: Committee
General Committee: Management
Room: 18
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Mon, Feb 27, 2012 - 2:00 PM to 5:00 PM
PD06: Troubleshooting SMT: Part II - Finding the Fix and Preventive Action
Location: San Diego Convention Center
Topic/Track: Assembly Processes for Lead Free and Tin Lead
Event Type: Professional Development
Level: Basic
Room: 5A
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Mon, Feb 27, 2012 - 2:00 PM to 5:00 PM
PD11: Designing with Flex in Mind: Next Generation
Location: San Diego Convention Center
Topic/Track: Design
Event Type: Professional Development
Level: Intermediate
Room: 1A
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Mon, Feb 27, 2012 - 2:00 PM to 5:00 PM
PD15: Preventing Production Defects and Failures
Location: San Diego Convention Center
Topic/Track: Assembly Processes for Lead Free and Tin Lead
Event Type: Professional Development
Level: Intermediate
Room: 1B
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Mon, Feb 27, 2012 - 2:00 PM to 5:00 PM
PD34: HDI: Introduction to Processes and Products
Location: San Diego Convention Center
Topic/Track: PCB Fabrication and Materials
Event Type: Professional Development
Level: Basic
Room: 11A
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Mon, Feb 27, 2012 - 2:00 PM to 5:00 PM
PD36: Control of EMI Coupling Mechanisms
Location: San Diego Convention Center
Topic/Track: Design
Event Type: Professional Development
Level: Intermediate
Room: 2
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Mon, Feb 27, 2012 - 2:00 PM to 5:00 PM
PD37: Lead-Free Assembly for High Yields and Reliability
Location: San Diego Convention Center
Topic/Track: Assembly Processes for Lead Free and Tin Lead
Event Type: Professional Development
Level: Intermediate
Room: 4
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Mon, Feb 27, 2012 - 2:00 PM to 5:00 PM
PD38: DFX: Project Setup to Measurement Definition and Advanced Analysis
Location: San Diego Convention Center
Topic/Track: Design
Event Type: Professional Development
Level: Intermediate
Room: 5B
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Mon, Feb 27, 2012 - 2:00 PM to 5:00 PM
PD39: Design and Assembly Challenges of Ball Grid Arrays (BGAs) and Bottom Termination Components
Location: San Diego Convention Center
Topic/Track: Assembly Processes for Lead Free and Tin Lead
Event Type: Professional Development
Level: Intermediate
Room: 3
|
Mon, Feb 27, 2012 - 2:00 PM to 5:00 PM
PD41: Designing PCB Stackups to Balance Signal Integrity Against Manufacturability
Location: San Diego Convention Center
Topic/Track: Design
Event Type: Professional Development
Level: Intermediate
Room: 10
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Mon, Feb 27, 2012 - 2:00 PM to 5:00 PM
PD44: Package on Package (PoP), Design Assembly, Rework and Inspection
Presenter/Committee Chair(s): Bob Willis, ASKbobwillis.com
Location: San Diego Convention Center
Topic/Track: Emerging Technologies
Event Type: Professional Development
Level: Advanced
Room: 9
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Mon, Feb 27, 2012 - 3:15 PM to 5:00 PM
3-12E: Base Materials Roundtable Task Group
Location: San Diego Convention Center
Topic/Track: PCB Fabrication and Materials
Event Type: Standard Development Committee Meeting
General Committee: Base Materials
Room: 12
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Mon, Feb 27, 2012 - 3:15 PM to 5:00 PM
2-16: Product Data Description (Laminar View) Subcommittee
Location: San Diego Convention Center
Topic/Track: Supply Chain/Business Issues
Event Type: Standard Development Committee Meeting
General Committee: Electronic Product Data Description
Room: 15A
|
Mon, Feb 27, 2012 - 5:00 PM to 6:30 PM
Technical Activities Executive Committee (By Invitation)
Location: San Diego Convention Center
Event Type: Standard Development Committee Meeting
General Committee: Management
Room: 14B
|
Mon, Feb 27, 2012 - 5:30 PM to 6:30 PM
FREE! International Reception
Location: San Diego Convention Center
Event Type: Special Event
Room: West Terrace
|
Mon, Feb 27, 2012 - 6:00 PM to 9:00 PM
IPC PCB & EMS VIP Reception and Dinner
Event Type: Management
|
Tue, Feb 28, 2012 - 7:30 AM to 8:30 AM
FREE! First-Timers' Welcome Breakfast
Location: San Diego Convention Center
Event Type: Special Event
Room: 4
|
Tue, Feb 28, 2012 - 8:00 AM to 1:00 PM
Introduction to EMS Training and Program Management
Location: San Diego Convention Center
Topic/Track: Supply Chain/Business Issues
Event Type: Management
Room: 13
|
Tue, Feb 28, 2012 - 8:00 AM to 5:00 PM
B-10A/JADEC: Joint Meeting - Plastic Chip Carrier Cracking Task Group and JEDEC JC-14.1
Location: San Diego Convention Center
Topic/Track: Quality, Reliability and Test
Event Type: Standard Development Committee Meeting
General Committee: Packaged Electronic Components
Room: 11B
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Tue, Feb 28, 2012 - 8:00 AM to 10:00 AM
6-10C: Plated-Through Via Reliability-Accelerated Test Methods Task Group
Location: San Diego Convention Center
Topic/Track: Quality, Reliability and Test
Event Type: Standard Development Committee Meeting
General Committee: Product Reliability
Room: 5B
|
Tue, Feb 28, 2012 - 8:30 AM to 9:30 AM
FREE! Opening Keynote Session
Captain's Log - Boldly going where no man has gone before....
Location: San Diego Convention Center
Event Type: Special Event
Room: 6A
|
Tue, Feb 28, 2012 - 9:45 AM to 10:00 AM
Location: San Diego Convention Center
Event Type: Special Event
Room: Sails Pavillion Entrance
|
Tue, Feb 28, 2012 - 10:00 AM to 12:00 PM
7-35: Assembly and Joining Handbook Subcommittee
Location: San Diego Convention Center
Topic/Track: Assembly Processes for Lead Free and Tin Lead
Event Type: Standard Development Committee Meeting
General Committee: Assembly and Joining
Room: 11A
|
Tue, Feb 28, 2012 - 10:00 AM to 12:00 PM
5-21F: Ball Grid Array Task Group
Location: San Diego Convention Center
Topic/Track: Assembly Processes for Lead Free and Tin Lead
Event Type: Standard Development Committee Meeting
General Committee: Assembly and Joining
Room: 15B
|
Tue, Feb 28, 2012 - 10:00 AM to 12:00 PM
5-31: Cleaning and Alternatives Subcommittee
Location: San Diego Convention Center
Topic/Track: Cleaning/Coating/Contamination
Event Type: Standard Development Committee Meeting
General Committee: Cleaning and Coating
Room: 15A
|
Tue, Feb 28, 2012 - 10:00 AM to 12:00 PM
Location: San Diego Convention Center
Topic/Track: Emerging Technologies
Event Type: Standard Development Committee Meeting
General Committee: Embedded Devices
Room: 7A
|
Tue, Feb 28, 2012 - 10:00 AM to 11:30 AM
V9-20: IPC PCB Management Council Steering Committee(By Invitation Only)
Location: San Diego Convention Center
Event Type: Standard Development Committee Meeting
Room: 14A
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Tue, Feb 28, 2012 - 10:00 AM to 12:00 PM
2-18J: Laboratory Report Declaration
Presenter/Committee Chair(s): Bill Haas, Seagate
Location: San Diego Convention Center
Topic/Track: Supply Chain/Business Issues
Event Type: Standard Development Committee Meeting
General Committee: Electronic Product Data Description
Room: 7B
|
Tue, Feb 28, 2012 - 10:00 AM to 12:00 PM
3-12A: Metallic Foil Task Group
Location: San Diego Convention Center
Topic/Track: PCB Fabrication and Materials
Event Type: Standard Development Committee Meeting
General Committee: Base Materials
Room: 9
|
Tue, Feb 28, 2012 - 10:00 AM to 12:00 PM
5-24C: Solder Alloy Task Group
Location: San Diego Convention Center
Topic/Track: Quality, Reliability and Test
Event Type: Standard Development Committee Meeting
General Committee: Assembly and Joining
Room: 10
|
Tue, Feb 28, 2012 - 10:00 AM to 5:00 PM
7-31F: Wire Harness Acceptability Task Group
Location: San Diego Convention Center
Topic/Track: Assembly Processes for Lead Free and Tin Lead
Event Type: Standard Development Committee Meeting
General Committee: Product Assurance
Room: 14B
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Tue, Feb 28, 2012 - 11:00 AM to 12:00 PM
FREE! IPC Government Relations Committee Open Forum
Location: San Diego Convention Center
Topic/Track: Supply Chain/Business Issues
Event Type: Standard Development Committee Meeting
General Committee: Xtras
Room: 8
|
Tue, Feb 28, 2012 - 12:00 PM to 1:30 PM
Event Luncheon & IPC Annual Meeting
Location: San Diego Convention Center
Event Type: Special Event
Room: 6A
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Tue, Feb 28, 2012 - 1:30 PM to 3:00 PM
5-32E: Conductive Anodic Filament (CAF) Task Group
Location: San Diego Convention Center
Topic/Track: Cleaning/Coating/Contamination
Event Type: Standard Development Committee Meeting
General Committee: Cleaning and Coating
Room: 9
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Tue, Feb 28, 2012 - 1:30 PM to 5:00 PM
5-33C: Conformal Coating Handbook Task Group
Location: San Diego Convention Center
Topic/Track: Cleaning/Coating/Contamination
Event Type: Standard Development Committee Meeting
General Committee: Cleaning and Coating
Room: 10
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Tue, Feb 28, 2012 - 1:30 PM to 5:00 PM
D-55: Embedded Devices Process Implementation Subcommittee
Location: San Diego Convention Center
Topic/Track: Design
Event Type: Standard Development Committee Meeting
General Committee: Embedded Devices
Room: 15A
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Tue, Feb 28, 2012 - 1:30 PM to 5:00 PM
4-30: Environment, Health & Safety Steering Committee
Location: San Diego Convention Center
Topic/Track: Environmental Issues and Compliance
Event Type: Standard Development Committee Meeting
General Committee: Environment, Health & Safety (EHS)
Room: 7B
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Tue, Feb 28, 2012 - 1:30 PM to 3:00 PM
5-24A: Flux Specifications Task Group
Location: San Diego Convention Center
Topic/Track: Quality, Reliability and Test
Event Type: Standard Development Committee Meeting
General Committee: Assembly and Joining
Room: 11A
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Tue, Feb 28, 2012 - 1:30 PM to 5:00 PM
D-31B: IPC-2221/2222 Task Group
Location: San Diego Convention Center
Topic/Track: Design
Event Type: Standard Development Committee Meeting
General Committee: Printed Board Design Technology
Room: 7A
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Tue, Feb 28, 2012 - 1:30 PM to 5:00 PM
7-24: Printed Board Process Effects Handbook Subcommittee
Location: San Diego Convention Center
Topic/Track: Quality, Reliability and Test
Event Type: Standard Development Committee Meeting
General Committee: Process Control
Room: 15B
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Tue, Feb 28, 2012 - 1:30 PM to 3:00 PM
D-24B: Propagation Loss Test Method Task Group
Location: San Diego Convention Center
Topic/Track: Quality, Reliability and Test
Event Type: Standard Development Committee Meeting
General Committee: High Speed/High Frequency Interconnections
Room: 5A
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Tue, Feb 28, 2012 - 1:30 PM to 3:00 PM
6-10D: SMT Attachment Reliability Test Methods Task Group
Location: San Diego Convention Center
Topic/Track: Quality, Reliability and Test
Event Type: Standard Development Committee Meeting
General Committee: Product Reliability
Room: 5B
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Tue, Feb 28, 2012 - 1:30 PM to 3:00 PM
Tin Whiskers, Delamination, Copper Dissolution, CAF, Coating Adhesion
Location: San Diego Convention Center
Topic/Track: Assembly Processes for Lead Free and Tin Lead
Event Type: Buzz Session
Room: 6F
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Tue, Feb 28, 2012 - 1:30 PM to 3:00 PM
Location: San Diego Convention Center
Topic/Track: PCB Fabrication and Materials
Event Type: Standard Development Committee Meeting
General Committee: Base Materials
Room: 9
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Tue, Feb 28, 2012 - 1:30 PM to 3:00 PM
Location: San Diego Convention Center
Topic/Track: Environmental Issues and Compliance
Event Type: Technical Conference Session
Room: 1B
|
Tue, Feb 28, 2012 - 1:30 PM to 3:00 PM
Presenter/Committee Chair(s): David Hillman, Pr. Mat l & Process Engr, Rockwell CollinsDavid Lee Ph.D., Engineer Assistant, Johns Hopkins UniversityJames Carrigan, Director, Strategic Accounts, Premier Semiconductor Services, LLCHans-Peter Tranitz, Project Manager Advanced Technologies, Continental Automotive GmbH
Location: San Diego Convention Center
Topic/Track: Quality, Reliability and Test
Event Type: Technical Conference Session
Room: 6D
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Tue, Feb 28, 2012 - 1:30 PM to 3:00 PM
Location: San Diego Convention Center
Topic/Track: Quality, Reliability and Test
Event Type: Technical Conference Session
Room: 2
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Tue, Feb 28, 2012 - 1:30 PM to 3:00 PM
Voiding I: Process and Test
Presenter/Committee Chair(s): Gordon O'Hara, Process Engineering Manager, FlextronicsJianbiao Pan, Assistant Professor, Cal Poly State UniversityChristian Ott, Sr. Sales Project Manager, SEHO Toratec ShanghaiWard Gatza, Materials Engineer, Agilent TechnologiesMatthew Vandiver, Structural Test Engineering Manager, Flextronics
Location: San Diego Convention Center
Topic/Track: Quality, Reliability and Test
Event Type: Technical Conference Session
Room: 3
|
Tue, Feb 28, 2012 - 1:30 PM to 3:00 PM
Location: San Diego Convention Center
Topic/Track: Design
Event Type: Technical Conference Session
Room: 6C
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Tue, Feb 28, 2012 - 3:00 PM to 4:00 PM
V9-40D: IPC PCB New Technology Subcommittee Meeting
Location: San Diego Convention Center
Event Type: Standard Development Committee Meeting
Room: 14A
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Tue, Feb 28, 2012 - 3:15 PM to 4:45 PM
2012 IPC International Technology Roadmap
Presenter/Committee Chair(s): Dieter Bergman, Director, Technology Transfer, IPCJohn Fisher, Interconnect Technology Analysis, Inc.Marc Carter, Director, Technology Transfer, IPCJoe Fjelstad, Founder, Verdant Electronics
Location: San Diego Convention Center
Topic/Track: Emerging Technologies
Event Type: Buzz Session
Room: 6F
|
Tue, Feb 28, 2012 - 3:15 PM to 5:00 PM
7-11: Test Methods Subcommittee
Location: San Diego Convention Center
Topic/Track: Quality, Reliability and Test
Event Type: Standard Development Committee Meeting
General Committee: Testing
Room: 5B
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Tue, Feb 28, 2012 - 3:15 PM to 4:45 PM
Location: San Diego Convention Center
Topic/Track: Assembly Processes for Lead Free and Tin Lead
Event Type: Technical Conference Session
Room: 1B
|
Tue, Feb 28, 2012 - 3:15 PM to 4:45 PM
Presenter/Committee Chair(s): Gary Brist, PCB Technologist, Intel CorporationGreg Papandrew, President, Bare Board GroupJerry Chia, Principal Engineer, Intel CorporationLouis Hart, Engineering Quality, Compunetics Inc.Didier Orlhac, T&R Marketing Director, Air Liquide
Location: San Diego Convention Center
Topic/Track: PCB Fabrication and Materials
Event Type: Technical Conference Session
Room: 6D
|
Tue, Feb 28, 2012 - 3:15 PM to 4:45 PM
Location: San Diego Convention Center
Topic/Track: Quality, Reliability and Test
Event Type: Technical Conference Session
Room: 2
|
Tue, Feb 28, 2012 - 3:15 PM to 4:45 PM
Voiding II: Component Effects
Location: San Diego Convention Center
Topic/Track: Assembly Processes for Lead Free and Tin Lead
Event Type: Technical Conference Session
Room: 3
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Tue, Feb 28, 2012 - 3:15 PM to 4:45 PM
Location: San Diego Convention Center
Topic/Track: Assembly Processes for Lead Free and Tin Lead
Event Type: Technical Conference Session
Room: 6C
|
Tue, Feb 28, 2012 - 4:00 PM to 5:00 PM
V9-10A: IPC EMS Management Council Steering Committee(By Invitation Only)
Location: San Diego Convention Center
Event Type: Standard Development Committee Meeting
Room: 14A
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Tue, Feb 28, 2012 - 6:00 PM to 9:00 PM
Executive Market & Technology Steering Committee(By Invitation)
Presenter/Committee Chair(s): Don Schroeder, CTS
Location: San Diego Convention Center
Event Type: Committee
Room: 14A
|
Wed, Feb 29, 2012 - 3:30 AM to 4:30 PM
Embedded Magnetics Technology Overview
Topic/Track: Emerging Technologies
Event Type: Poster
Room: 6A
|
Wed, Feb 29, 2012 - 7:00 AM to 8:00 AM
V9-34: SMEMA Statistical Subcommittee(By Invitation)
Location: San Diego Convention Center
Event Type: Standard Development Committee Meeting
Room: 14A
|
Wed, Feb 29, 2012 - 7:30 AM to 8:30 AM
FREE! Women in Electronics Networking Meeting
Location: San Diego Convention Center
Event Type: Special Event
Room: 4
|
Wed, Feb 29, 2012 - 8:00 AM to 12:00 PM
7-23: Assembly Process Effects Handbook Subcommittee
Location: San Diego Convention Center
Topic/Track: Quality, Reliability and Test
Event Type: Standard Development Committee Meeting
General Committee: Process Control
Room: 15B
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Wed, Feb 29, 2012 - 8:00 AM to 10:00 AM
5-33A: Conformal Coating Task Group
Location: San Diego Convention Center
Topic/Track: Cleaning/Coating/Contamination
Event Type: Standard Development Committee Meeting
General Committee: Cleaning and Coating
Room: 5A
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Wed, Feb 29, 2012 - 8:00 AM to 12:00 PM
2-18G: Declaration of Batteries and Battery Materials Task Group
Location: San Diego Convention Center
Topic/Track: Supply Chain/Business Issues
Event Type: Standard Development Committee Meeting
General Committee: Electronic Product Data Description
Room: 7B
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Wed, Feb 29, 2012 - 8:00 AM to 10:00 AM
D-15: Flexible Circuits Test Methods Subcommittee
Location: San Diego Convention Center
Topic/Track: PCB Fabrication and Materials
Event Type: Standard Development Committee Meeting
General Committee: Flexible and Rigid-Flex Printed Boards
Room: 10
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Wed, Feb 29, 2012 - 8:00 AM to 10:00 AM
D-22: High Speed/High Frequency Board Performance Subcommittee
Presenter/Committee Chair(s): Michael Luke CID+
Location: San Diego Convention Center
Topic/Track: PCB Fabrication and Materials
Event Type: Standard Development Committee Meeting
General Committee: High Speed/High Frequency Interconnections
Room: 9
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Wed, Feb 29, 2012 - 8:00 AM to 5:00 PM
7-31J: IPC-A-630 Requirements for Structural Enclosure Task Group
Location: San Diego Convention Center
Topic/Track: Quality, Reliability and Test
Event Type: Standard Development Committee Meeting
General Committee: Product Assurance
Room: 5B
|
Wed, Feb 29, 2012 - 8:00 AM to 9:30 AM
FREE! Keynote: Gazing into the Crystal Ball
Presenter/Committee Chair(s): Phil Plonski, Managing Partner, Prismark PartnersLars-Olof Wallin, IPC European Representative, IPC European Representative OfficeMikel Williams, President & CEO, Ddi CorpCary Wood, Sparton CorporationJan Vandaman, President, TechSearch International IncBolaji Ojo, Editor-in-chief, EBN
Location: San Diego Convention Center
Event Type: Special Event
Room: 6A
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Wed, Feb 29, 2012 - 8:00 AM to 12:00 PM
7-34T: Repair Training Technical Task Group
Location: San Diego Convention Center
Topic/Track: Assembly Processes for Lead Free and Tin Lead
Event Type: Standard Development Committee Meeting
General Committee: Product Assurance
Room: 15A
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Wed, Feb 29, 2012 - 8:00 AM to 5:00 PM
7-31FS: Space Electronic Assemblies IPC/WHMA-A-620 Addendum Task Group
Location: San Diego Convention Center
Topic/Track: Assembly Processes for Lead Free and Tin Lead
Event Type: Standard Development Committee Meeting
General Committee: Product Assurance
Room: 14B
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Wed, Feb 29, 2012 - 8:00 AM to 10:00 AM
7-32C: Electrical Continuity Testing Task Group
Location: San Diego Convention Center
Topic/Track: Assembly Processes for Lead Free and Tin Lead
Event Type: Standard Development Committee Meeting
General Committee: Product Assurance
Room: 11A
|
Wed, Feb 29, 2012 - 9:00 AM to 10:00 AM
Embedded: Emerging Technologies
Location: San Diego Convention Center
Topic/Track: Emerging Technologies
Event Type: Buzz Session
Room: 6F
|
Wed, Feb 29, 2012 - 9:00 AM to 10:00 AM
Location: San Diego Convention Center
Topic/Track: Assembly Processes for Lead Free and Tin Lead
Event Type: Technical Conference Session
Room: 6D
|
Wed, Feb 29, 2012 - 9:00 AM to 10:00 AM
Location: San Diego Convention Center
Topic/Track: Assembly Processes for Lead Free and Tin Lead
Event Type: Technical Conference Session
Room: 6C
|
Wed, Feb 29, 2012 - 9:00 AM to 10:00 AM
Location: San Diego Convention Center
Topic/Track: Quality, Reliability and Test
Event Type: Technical Conference Session
Room: 1B
|
Wed, Feb 29, 2012 - 9:00 AM to 10:00 AM
Location: San Diego Convention Center
Topic/Track: Cleaning/Coating/Contamination
Event Type: Technical Conference Session
Room: 2
|
Wed, Feb 29, 2012 - 9:00 AM to 10:00 AM
Location: San Diego Convention Center
Topic/Track: Quality, Reliability and Test
Event Type: Technical Conference Session
Room: 3
|
Wed, Feb 29, 2012 - 9:00 AM to 10:00 AM
Location: San Diego Convention Center
Topic/Track: Printed Electronics
Event Type: Technical Conference Session
Room: 6E
|
Wed, Feb 29, 2012 - 10:15 AM to 11:45 AM
Are Conflict Minerals the New RoHS?
Location: San Diego Convention Center
Topic/Track: PCB Fabrication and Materials
Event Type: Buzz Session
Room: 6F
|
Wed, Feb 29, 2012 - 10:15 AM to 12:00 PM
5-33C: Conformal Coating Handbook Task Group
Location: San Diego Convention Center
Topic/Track: Cleaning/Coating/Contamination
Event Type: Standard Development Committee Meeting
General Committee: Cleaning and Coating
Room: 5A
|
Wed, Feb 29, 2012 - 10:15 AM to 12:00 PM
D-12: Flexible Circuits Specifications Subcommittee
Location: San Diego Convention Center
Topic/Track: PCB Fabrication and Materials
Event Type: Standard Development Committee Meeting
General Committee: Flexible and Rigid-Flex Printed Boards
Room: 10
|
Wed, Feb 29, 2012 - 10:15 AM to 12:00 PM
D-23: High Speed/High Frequency Base Materials Subcommittee
Location: San Diego Convention Center
Topic/Track: PCB Fabrication and Materials
Event Type: Standard Development Committee Meeting
General Committee: High Speed/High Frequency Interconnections
Room: 9
|
Wed, Feb 29, 2012 - 10:15 AM to 12:00 PM
4-14: Plating Processes Subcommittee
Location: San Diego Convention Center
Topic/Track: PCB Fabrication and Materials
Event Type: Standard Development Committee Meeting
General Committee: Fabrication Processes
Room: 14A
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Wed, Feb 29, 2012 - 10:15 AM to 12:00 PM
5-24B: Solder Paste Task Group
Location: San Diego Convention Center
Topic/Track: Quality, Reliability and Test
Event Type: Standard Development Committee Meeting
General Committee: Assembly and Joining
Room: 8
|
Wed, Feb 29, 2012 - 10:15 AM to 11:45 AM
Location: San Diego Convention Center
Topic/Track: Emerging Technologies
Event Type: Technical Conference Session
Room: 6D
|
Wed, Feb 29, 2012 - 10:15 AM to 11:45 AM
Location: San Diego Convention Center
Topic/Track: Assembly Processes for Lead Free and Tin Lead
Event Type: Technical Conference Session
Room: 6C
|
Wed, Feb 29, 2012 - 10:15 AM to 11:45 AM
Location: San Diego Convention Center
Topic/Track: Assembly Processes for Lead Free and Tin Lead
Event Type: Technical Conference Session
Room: 1B
|
Wed, Feb 29, 2012 - 10:15 AM to 11:45 AM
Location: San Diego Convention Center
Topic/Track: PCB Fabrication and Materials
Event Type: Technical Conference Session
Room: 2
|
Wed, Feb 29, 2012 - 10:15 AM to 11:45 AM
Location: San Diego Convention Center
Topic/Track: Environmental Issues and Compliance
Event Type: Technical Conference Session
Room: 3
|
Wed, Feb 29, 2012 - 10:15 AM to 11:45 AM
Advanced Materials for Printed Electronics
Location: San Diego Convention Center
Topic/Track: Printed Electronics
Event Type: Technical Conference Session
Room: 6E
|
Wed, Feb 29, 2012 - 10:30 AM to 12:00 PM
V9-40B: Process Consumables Statistical Subcommittee(By Invitation)
Location: San Diego Convention Center
Event Type: Standard Development Committee Meeting
Room: 12
|
Wed, Feb 29, 2012 - 12:00 PM to 1:30 PM
Location: San Diego Convention Center
Event Type: Special Event
Room: 6A
|
Wed, Feb 29, 2012 - 1:30 PM to 5:00 PM
7-31FT: A-620 Technical Training Task Group
Location: San Diego Convention Center
Topic/Track: Assembly Processes for Lead Free and Tin Lead
Event Type: Standard Development Committee Meeting
General Committee: Product Assurance
Room: 15A
|
Wed, Feb 29, 2012 - 1:30 PM to 5:00 PM
2-18F: Declaration of Shipping, Packing and Packaging Materials Task Group
Location: San Diego Convention Center
Topic/Track: Supply Chain/Business Issues
Event Type: Standard Development Committee Meeting
General Committee: Electronic Product Data Description
Room: 7B
|
Wed, Feb 29, 2012 - 1:30 PM to 3:00 PM
D-54: Embedded Devices Test Methods Subcommittee
Location: San Diego Convention Center
Topic/Track: Emerging Technologies
Event Type: Standard Development Committee Meeting
General Committee: Embedded Devices
Room: 14A
|
Wed, Feb 29, 2012 - 1:30 PM to 3:00 PM
E-21: EMS IP Subcommittee
Location: San Diego Convention Center
Topic/Track: Assembly Processes for Lead Free and Tin Lead
Event Type: Standard Development Committee Meeting
General Committee: Management
Room: 8
|
Wed, Feb 29, 2012 - 1:30 PM to 3:00 PM
D-11: Flexible Circuits Design Subcommittee
Location: San Diego Convention Center
Topic/Track: PCB Fabrication and Materials
Event Type: Standard Development Committee Meeting
General Committee: Flexible and Rigid-Flex Printed Boards
Room: 10
|
Wed, Feb 29, 2012 - 1:30 PM to 3:00 PM
5-32A: Ion Chromatography/Ionic Conductivity Task Group
Location: San Diego Convention Center
Topic/Track: Cleaning/Coating/Contamination
Event Type: Standard Development Committee Meeting
General Committee: Cleaning and Coating
Room: 11A
|
Wed, Feb 29, 2012 - 1:30 PM to 5:00 PM
2-18C: Laminate Declaration Task Group
Location: San Diego Convention Center
Topic/Track: Supply Chain/Business Issues
Event Type: Standard Development Committee Meeting
General Committee: Electronic Product Data Description
Room: 15B
|
Wed, Feb 29, 2012 - 1:30 PM to 5:00 PM
7-12: Microsection Subcommittee
Location: San Diego Convention Center
Topic/Track: Quality, Reliability and Test
Event Type: Standard Development Committee Meeting
General Committee: Testing
Room: 9
|
Wed, Feb 29, 2012 - 1:30 PM to 3:30 PM
Solar Standards for Electronics Assemblers - IPC-8701 The Next Generation of Standardization
Presenter/Committee Chair(s): Dongkai Shangguan Ph.D., Vice President - Advanced Technology, Flextronics InternationalThomas Cipielewski, Global Operations Services-Mfg. Eng. Director, Jabil Circuit, Inc. (HQ)Jim Garner, 2BG SolarDennis Willie, Engineering Manager, FlextronicsDave Torp, VP, Standards & Technology, IPC
Location: San Diego Convention Center
Topic/Track: Emerging Technologies
Event Type: Buzz Session
Room: 6F
|
Wed, Feb 29, 2012 - 1:30 PM to 5:00 PM
5-24F: Underfill Adhesives for Flip Chip Applications
Location: San Diego Convention Center
Topic/Track: Cleaning/Coating/Contamination
Event Type: Standard Development Committee Meeting
General Committee: Assembly and Joining
Room: 7A
|
Wed, Feb 29, 2012 - 1:30 PM to 3:00 PM
6-11: Printed Board Coplanarity Subcommittee
Location: 18
Topic/Track: Quality, Reliability and Test
Event Type: Standard Development Committee Meeting
General Committee: Product Assurance
|
Wed, Feb 29, 2012 - 1:30 PM to 3:30 PM
Solder Joint Testing and Performance
Location: San Diego Convention Center
Topic/Track: Quality, Reliability and Test
Event Type: Technical Conference Session
Room: 6D
|
Wed, Feb 29, 2012 - 1:30 PM to 3:30 PM
Surface Insulation Resistance
Location: San Diego Convention Center
Topic/Track: Cleaning/Coating/Contamination
Event Type: Technical Conference Session
Room: 6C
|
Wed, Feb 29, 2012 - 1:30 PM to 3:30 PM
Test Process and Specification
Location: San Diego Convention Center
Topic/Track: Quality, Reliability and Test
Event Type: Technical Conference Session
Room: 1B
|
Wed, Feb 29, 2012 - 1:30 PM to 3:30 PM
Signal Integrity II: High Speed
Location: San Diego Convention Center
Topic/Track: PCB Fabrication and Materials
Event Type: Technical Conference Session
Room: 2
|
Wed, Feb 29, 2012 - 1:30 PM to 2:30 PM
Location: San Diego Convention Center
Topic/Track: Cleaning/Coating/Contamination
Event Type: Technical Conference Session
Room: 3
|
Wed, Feb 29, 2012 - 1:30 PM to 3:30 PM
Emerging Technologies and Manufacturing Processes for Printed Electronics
Presenter/Committee Chair(s): Voya Markovich, Sr. VP and CTO, Endicott Interconnect Technologies IncDon Banfield, Product Manager, Conductive CompoundsMark Poliks Ph.D., Director, Research and Development, Endicott Interconnect Technologies IncSteve Tomas, Director, Flexible Electronics, Flexcon CompanyFrank Egitto, R&D Manager, Endicott Interconnect Technologies Inc
Location: San Diego Convention Center
Topic/Track: Printed Electronics
Event Type: Technical Conference Session
Room: 6E
|
Wed, Feb 29, 2012 - 2:30 PM to 3:30 PM
Location: San Diego Convention Center
Topic/Track: Assembly Processes for Lead Free and Tin Lead
Event Type: Technical Conference Session
Room: 3
|
Wed, Feb 29, 2012 - 3:00 PM to 4:00 PM
Laminate Statistical Committee
Location: San Diego Convention Center
Event Type: Committee
Room: 5A
|
Wed, Feb 29, 2012 - 3:15 PM to 5:00 PM
5-32C: Bare Board Cleanliness Assessment Task Group
Location: San Diego Convention Center
Topic/Track: Cleaning/Coating/Contamination
Event Type: Standard Development Committee Meeting
General Committee: Cleaning and Coating
Room: 11A
|
Wed, Feb 29, 2012 - 3:15 PM to 5:00 PM
D-13: Flexible Circuits Base Materials Subcommittee
Location: San Diego Convention Center
Topic/Track: PCB Fabrication and Materials
Event Type: Standard Development Committee Meeting
General Committee: Flexible and Rigid-Flex Printed Boards
Room: 10
|
Wed, Feb 29, 2012 - 3:15 PM to 5:00 PM
E-20: Intellectual Property Standard Committee
Location: San Diego Convention Center
Topic/Track: Supply Chain/Business Issues
Event Type: Standard Development Committee Meeting
General Committee: Management
Room: 8
|
Wed, Feb 29, 2012 - 3:30 PM to 4:30 PM
Mag Pac (Magnetic Package) PCB Research and Development
Topic/Track: PCB Fabrication and Materials
Event Type: Poster
Room: 6A
|
Wed, Feb 29, 2012 - 3:30 PM to 4:30 PM
Mag Pac PCB Research Presentation
Topic/Track: PCB Fabrication and Materials
Event Type: Poster
Room: 6A
|
Wed, Feb 29, 2012 - 3:30 PM to 4:30 PM
Topic/Track: Quality, Reliability and Test
Event Type: Poster
Room: 6A
|
Wed, Feb 29, 2012 - 3:30 PM to 4:30 PM
PCB Housings for Industrial Applications
Topic/Track: PCB Fabrication and Materials
Event Type: Poster
Room: 6A
|
Wed, Feb 29, 2012 - 3:30 PM to 4:30 PM
Solutions Against Esd (Electrostatic Discharge) In a Production Line (Smt) - Today and in the Future - International Esd and Semiconductor Roadmap
Topic/Track: Emerging Technologies
Event Type: Poster
Room: 6A
|
Wed, Feb 29, 2012 - 3:30 PM to 4:30 PM
The Research of Pad Adhesive on Different Lead Free and Halogen Free Materials
Topic/Track: Assembly Processes for Lead Free and Tin Lead
Event Type: Poster
Room: 6A
|
Wed, Feb 29, 2012 - 3:30 PM to 4:30 PM
Step Stencil Applications
Topic/Track: Printed Electronics
Event Type: Poster
Room: 6A
|
Wed, Feb 29, 2012 - 3:30 PM to 4:30 PM
Frequency and Time Domain Analysis of Thin Flexible and Rigid Copper Clad Laminates
Topic/Track: Quality, Reliability and Test
Event Type: Poster
Room: 6A
|
Wed, Feb 29, 2012 - 3:30 PM to 4:30 PM
How to Improve QFN Solder Quality through X-ray Inspection
Topic/Track: Quality, Reliability and Test
Event Type: Poster
Room: 6A
|
Wed, Feb 29, 2012 - 3:30 PM to 4:30 PM
Any Layer Via Interconnects Using Sintered Paste: Capacity Expansion at Lower Cost
Topic/Track: Cleaning/Coating/Contamination
Event Type: Poster
Room: 6A
|
Wed, Feb 29, 2012 - 3:30 PM to 4:30 PM
Novel Technologies for Mass-Production Test Probes: Design and Challenges
Topic/Track: Emerging Technologies
Event Type: Poster
Room: 6A
|
Wed, Feb 29, 2012 - 3:30 PM to 4:30 PM
Three-Dimensional X-Ray Inspection for Void Detection in Power Electronics
Topic/Track: Emerging Technologies
Event Type: Poster
Room: 6A
|
Wed, Feb 29, 2012 - 3:30 PM to 4:30 PM
Hot Nitrogen for Waves Soldering
Topic/Track: Design
Event Type: Poster
Room: 6A
|
Wed, Feb 29, 2012 - 3:30 PM to 4:30 PM
Environmental Protection for Consumer Electronics
Topic/Track: Environmental Issues and Compliance
Event Type: Poster
Room: 6A
|
Wed, Feb 29, 2012 - 3:30 PM to 4:30 PM
Application of Build-in Self-Test in Functional Test of DSL
Topic/Track: Quality, Reliability and Test
Event Type: Poster
Room: 6A
|
Wed, Feb 29, 2012 - 3:30 PM to 4:30 PM
Impact of Tin Grain Aspect Ratios on the Whiskering of Plated Films
Location: 6A
Topic/Track: Quality, Reliability and Test
Event Type: Poster
|
Wed, Feb 29, 2012 - 3:30 PM to 4:30 PM
Production Technologies for Large Area Printed Flexible Electronics
Topic/Track: Printed Electronics
Event Type: Poster
Room: 6A
|
Wed, Feb 29, 2012 - 3:30 PM to 4:30 PM
Embedded vs. SMT: A Comparative Analysis of Reliability – Part II
Topic/Track: Quality, Reliability and Test
Event Type: Poster
Room: 6A
|
Wed, Feb 29, 2012 - 3:30 PM to 4:30 PM
Indium Surface Whiskers under Corrosive Gas Conditions and Alternative Surface Finishes at Press-in Technology
Topic/Track: Cleaning/Coating/Contamination
Event Type: Poster
Room: 6A
|
Wed, Feb 29, 2012 - 3:30 PM to 4:30 PM
HzO WaterBlock - Moisture Protection from the Inside Out:
Presenter/Committee Chair(s): Blake Stevens, CSO, HzO
Topic/Track: Emerging Technologies
Event Type: Poster
Room: 6A
|
Wed, Feb 29, 2012 - 3:30 PM to 4:30 PM
Equipping the PCB Design and Supply Chain with 21st Century Data
Topic/Track: PCB Fabrication and Materials
Event Type: Poster
Room: 6A
|
Wed, Feb 29, 2012 - 3:30 PM to 4:30 PM
Lights Out Printing Comes of Age
Topic/Track: Emerging Technologies
Event Type: Poster
Room: 6A
|
Wed, Feb 29, 2012 - 3:30 PM to 4:30 PM
Silver Nanoparticle Synthesis and Process Design for Printable Conductive Media
Topic/Track: Assembly Processes for Lead Free and Tin Lead
Event Type: Poster
Room: 6A
|
Wed, Feb 29, 2012 - 4:00 PM to 6:00 PM
FREE! Show Floor Reception
Location: San Diego Convention Center
Event Type: Special Event
Room: Show Floor
|
Thu, Mar 1, 2012 - 7:00 AM to 9:00 AM
SMEMA Council (By Invitation)
Location: San Diego Convention Center
Event Type: Standard Development Committee Meeting
Room: 14B
|
Thu, Mar 1, 2012 - 8:00 AM to 12:00 PM
E-30: Conflict Minerals Due Diligence Committee
Location: San Diego Convention Center
Topic/Track: Supply Chain/Business Issues
Event Type: Standard Development Committee Meeting
General Committee: Management
Room: 7B
|
Thu, Mar 1, 2012 - 8:00 AM to 10:00 AM
3-11G: Corrosion of Metal Finishes Task Group
Location: San Diego Convention Center
Topic/Track: PCB Fabrication and Materials
Event Type: Standard Development Committee Meeting
General Committee: Base Materials
Room: 5B
|
Thu, Mar 1, 2012 - 8:00 AM to 5:00 PM
Location: San Diego Convention Center
Topic/Track: Supply Chain/Business Issues
Event Type: Management
Room: 13
|
Thu, Mar 1, 2012 - 8:00 AM to 5:00 PM
Presenter/Committee Chair(s): Ray Prasad, President, Ray Prasad Consultancy GroupRobert Toppel, President, Axiom Electronics, LLCJeffrey Roth, Attorney/Shareholder, Fees & Burgess, P.C.Blair Jacks, Director, Financial & Business Intelligence Systems, Adtran Inc.
Location: San Diego Convention Center
Topic/Track: Supply Chain/Business Issues
Event Type: Management
Room: 12
|
Thu, Mar 1, 2012 - 8:00 AM to 9:30 AM
V9-40: PCB Suppliers Council Steering Committee Meeting
Location: San Diego Convention Center
Event Type: Standard Development Committee Meeting
Room: 14
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Thu, Mar 1, 2012 - 8:00 AM to 10:00 AM
D-61: Printed Electronics Design Subcommittee
Location: San Diego Convention Center
Topic/Track: Design
Event Type: Standard Development Committee Meeting
General Committee: Printed Electronics
Room: 7A
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Thu, Mar 1, 2012 - 8:00 AM to 12:00 PM
7-31K: Wire Harness Design Task Group
Location: San Diego Convention Center
Topic/Track: Assembly Processes for Lead Free and Tin Lead
Event Type: Standard Development Committee Meeting
General Committee: Product Assurance
Room: 15B
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Thu, Mar 1, 2012 - 8:30 AM to 10:00 AM
International Academic Paper Competition
Location: San Diego Convention Center
Topic/Track: Design
Event Type: Buzz Session
Room: 6F
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Thu, Mar 1, 2012 - 9:00 AM to 12:00 PM
PD12: Design and Packaging for Space and Other High-Reliability etc.
Location: San Diego Convention Center
Topic/Track: Design
Event Type: Professional Development
Level: Intermediate
Room: 11A
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Thu, Mar 1, 2012 - 9:00 AM to 12:00 PM
PD32: Survival Is Not Mandatory: 10 Things Every Manager Should Know about Lean
Location: San Diego Convention Center
Topic/Track: Supply Chain/Business Issues
Event Type: Professional Development
Level: Intermediate
Room: 11B
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Thu, Mar 1, 2012 - 9:00 AM to 12:00 PM
PD45: Front-End Engineering Perspective on Design Issues
Location: San Diego Convention Center
Topic/Track: PCB Fabrication and Materials
Event Type: Professional Development
Level: Basic
Room: 9
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Thu, Mar 1, 2012 - 9:00 AM to 12:00 PM
PD47: Contracting With the Customer: What the EMS Manager Needs to Know - Part I
Location: San Diego Convention Center
Topic/Track: Supply Chain/Business Issues
Event Type: Professional Development
Level: Advanced
Room: 8
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Thu, Mar 1, 2012 - 9:00 AM to 12:00 PM
PD51: Practical Tips for Rework of Advanced Packages - Reballing BGAs, Leadless Device Rework
Location: San Diego Convention Center
Topic/Track: Assembly Processes for Lead Free and Tin Lead
Event Type: Professional Development
Level: Intermediate
Room: 10
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Thu, Mar 1, 2012 - 9:00 AM to 10:00 AM
Location: San Diego Convention Center
Topic/Track: Assembly Processes for Lead Free and Tin Lead
Event Type: Technical Conference Session
Room: 6D
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Thu, Mar 1, 2012 - 9:00 AM to 9:30 AM
Location: San Diego Convention Center
Topic/Track: Assembly Processes for Lead Free and Tin Lead
Event Type: Technical Conference Session
Room: 6C
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Thu, Mar 1, 2012 - 9:00 AM to 10:00 AM
Location: San Diego Convention Center
Topic/Track: Quality, Reliability and Test
Event Type: Technical Conference Session
Room: 1B
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Thu, Mar 1, 2012 - 9:00 AM to 10:00 AM
Location: San Diego Convention Center
Topic/Track: PCB Fabrication and Materials
Event Type: Technical Conference Session
Room: 2
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Thu, Mar 1, 2012 - 9:00 AM to 10:00 AM
Signal Integrity III: Flex and Rigid
Location: San Diego Convention Center
Topic/Track: PCB Fabrication and Materials
Event Type: Technical Conference Session
Room: 3
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Thu, Mar 1, 2012 - 10:00 AM to 12:00 PM
Industry Advisory Group (IAG) for UL
Location: San Diego Convention Center
Topic/Track: Quality, Reliability and Test
Event Type: Standard Development Committee Meeting
General Committee: Testing
Room: 5A
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Thu, Mar 1, 2012 - 10:00 AM to 12:00 PM
D-62: Printed Electronics Base Material/Substrates Subcommittee
Location: San Diego Convention Center
Topic/Track: Design
Event Type: Standard Development Committee Meeting
General Committee: Printed Electronics
Room: 7A
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Thu, Mar 1, 2012 - 10:15 AM to 11:45 AM
Location: San Diego Convention Center
Topic/Track: Supply Chain/Business Issues
Event Type: Buzz Session
Room: 6F
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Thu, Mar 1, 2012 - 10:15 AM to 11:45 AM
Location: San Diego Convention Center
Topic/Track: Assembly Processes for Lead Free and Tin Lead
Event Type: Technical Conference Session
Room: 6C
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Thu, Mar 1, 2012 - 10:15 AM to 11:45 AM
Location: San Diego Convention Center
Topic/Track: Quality, Reliability and Test
Event Type: Technical Conference Session
Room: 6D
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Thu, Mar 1, 2012 - 10:15 AM to 11:45 AM
Location: San Diego Convention Center
Topic/Track: Quality, Reliability and Test
Event Type: Technical Conference Session
Room: 1B
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Thu, Mar 1, 2012 - 10:15 AM to 11:45 AM
Location: San Diego Convention Center
Topic/Track: PCB Fabrication and Materials
Event Type: Technical Conference Session
Room: 2
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Thu, Mar 1, 2012 - 10:15 AM to 11:45 AM
Presenter/Committee Chair(s): Dennis Fritz, Technology Consultant, MacDermid, Inc.John Coonrod, Mkt. Dev. Engineer, Rogers CorporationSusan Landry, Advisor, Fire Safety & Advocacy, Albemarle CorporationYin Simon, CTI RCC Material, Shengyi Technology Co., Ltd.
Location: San Diego Convention Center
Topic/Track: Supply Chain/Busines Issues
Event Type: Technical Conference Session
Room: 3
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Thu, Mar 1, 2012 - 1:00 PM to 3:00 PM
D-63: Printed Electronics Functional Materials Subcommittee
Location: San Diego Convention Center
Topic/Track: Design
Event Type: Standard Development Committee Meeting
General Committee: Printed Electronics
Room: 7A
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Thu, Mar 1, 2012 - 1:30 PM to 5:00 PM
2-18H: Conflict Minerals Data Exchange Task Group
Location: San Diego Convention Center
Topic/Track: Supply Chain/Business Issues
Event Type: Standard Development Committee Meeting
General Committee: Electronic Product Data Description
Room: 7B
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Thu, Mar 1, 2012 - 1:30 PM to 5:00 PM
7-31H: IPC-HDBK-620 Handbook Task Group
Location: San Diego Convention Center
Topic/Track: Assembly Processes for Lead Free and Tin Lead
Event Type: Standard Development Committee Meeting
General Committee: Product Assurance
Room: 15B
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Thu, Mar 1, 2012 - 2:00 PM to 5:00 PM
PD48: Contracting With the Customer: What the EMS Manager Needs to Know - Part II
Location: San Diego Convention Center
Topic/Track: Supply Chain/Business Issues
Event Type: Professional Development
Level: Advanced
Room: 8
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Thu, Mar 1, 2012 - 3:00 PM to 5:00 PM
D-64: Printed Electronics Final Assembly Subcommittee
Location: San Diego Convention Center
Topic/Track: Design
Event Type: Standard Development Committee Meeting
General Committee: Printed Electronics
Room: 7A
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Fri, Mar 2, 2012 - 8:00 AM to 5:00 PM
Location: San Diego Convention Center
Topic/Track: Supply Chain/Business Issues
Event Type: Management
Room: 13
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Fri, Mar 2, 2012 - 8:00 AM to 5:00 PM
Presenter/Committee Chair(s): Ray Prasad, President, Ray Prasad Consultancy GroupRobert Toppel, President, Axiom Electronics, LLCJeffrey Roth, Attorney/Shareholder, Fees & Burgess, P.C.Blair Jacks, Director, Financial & Business Intelligence Systems, Adtran Inc.
Location: San Diego Convention Center
Topic/Track: Supply Chain/Business Issues
Event Type: Management
Room: 12
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Fri, Mar 2, 2012 - 8:00 AM to 12:00 PM
2-18: Supplier Declaration Subcommittee
Location: San Diego Convention Center
Topic/Track: Supply Chain/Business Issues
Event Type: Standard Development Committee Meeting
General Committee: Electronic Product Data Description
Room: 7B
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Fri, Mar 2, 2012 - 8:00 AM to 12:00 PM
8-61: Printed Electronics Technology Roadmap Subcommittee
Location: San Diego Convention Center
Topic/Track: Printed Electronics
Event Type: Standard Development Committee Meeting
General Committee: Management
Room: 5B
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Sat, Mar 3, 2012 - 8:00 AM to 5:00 PM
EMS Program Manager Training and Certification Exam
Location: San Diego Convention Center
Topic/Track: Supply Chain/Business Issues
Event Type: Management
Room: 12
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