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Programs:
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Fri, Feb 24th, 2012
Sat, Feb 25th, 2012
Sun, Feb 26th, 2012
Mon, Feb 27th, 2012
Tue, Feb 28th, 2012
Wed, Feb 29th, 2012
Thu, Mar 1st, 2012
Fri, Mar 2nd, 2012
Sat, Mar 3rd, 2012
Presenter/Committee Chair:
All
Aaron Robinson, Envirotronics, Inc
Adam Yin, Gardien Pacific Ltd.
Ahne Oosterhof
Aidan Turnbull Ph.D., Environ UK L
Aimee Siegler, Benchmark Electroni
Alan Albee, Teradyne Inc.
Alan Rae Ph.D., TPF Enterprises LL
Alexander Ippich, Multek Europe Gm
Allen Anderson, Fees & Burgess, P.
Amy Hagnauer, Raytheon Company
Andrew Brooks, Semblant Ltd.
Andrew Hamelynck, L-3 Communicatio
Anthony Suto, Teradyne Inc.
Antonio Senese, Panasonic Electric
Anurag Bansal, Cisco Systems Inc.
Aravind Munukutla, Intel Corporati
Barry Ritchie, Dow Corning Corpora
Beverley Christian Ph.D., Research
Bhanu Sood Ph.D., University of Ma
Bhawnesh Mathur, Epic Technologies
Bill Haas, Seagate
Blair Jacks, Adtran Inc.
Blake Stevens, HzO
Bob Klenke, ITM Consulting Inc.
Bob Willis, National Physical Labo
Bob Willis, ASKbobwillis.com
Bolaji Ojo, EBN
Brandon Judd, Indium Corporation o
Brett Miller, USA Harness, Inc.
Brian Toleno Ph.D., Henkel Corpora
Carlos Montemayor, Dow Corning Cor
Carlyn Smith, Harris Corporation,
Carmina Laentzsch, LaserJob GmbH
Carol Handwerker Sc.D., Purdue Uni
Cary Wood, Sparton Corporation
Cherie Chen, Integrated Service Te
Cheryl Tulkoff, DfR Solutions
Chris Hunrath, Integral Technology
Chris Mahanna, Robisan Laboratory
Christian Ott, SEHO Toratec Shangh
Christopher Cain, Agilent Technolo
Christopher Hunt Ph.D., National P
Christopher Muller, Purafil, Inc.
Christopher Ryder, AT&S Austria Te
Christopher Schwarz, Canyon Snow C
Clark Webster, ALL Flex LLC
Clive Ashmore, DEK International G
Constantino Gonzalez MIT, ACME Tra
Craig Pynn, SiFO
Dale Lee, Plexus Corp.
Daniel Cavasin, Advanced Micro Dev
Daniel DiTuro, Honeywell Internati
Daniel Foster CIT, U.S. Army Aviat
Daniel Gamota, Printovate Technolo
Darin Moreira, Intel Microelectron
Dave Doherty, Digi-Key Corporation
Dave Torp, IPC
David Hillman, Rockwell Collins
David Lee Ph.D., Johns Hopkins Uni
David Pinsky, Raytheon Company
David Ravivo, Camtek USA, Inc.
David Rund, Christopher Associates
David Scheiner, Kester
David Wolf, Conductor Analysis Tec
Debbie Wade MIT, Advanced Rework T
Dennis Fritz, MacDermid, Inc.
Dennis Willie, Flextronics
Didier Orlhac, Air Liquide
Dieter Bergman, IPC
Don Banfield, Conductive Compounds
Don DeGroot, CCNi
Don Dupriest, Lockheed Martin Miss
Don Schmieder III, Plexus Electron
Don Schroeder, CTS
Don Turner, DWT Management
Donald Walsh, Uyemura Internationa
Dongkai Shangguan Ph.D., Flextroni
Douglas Pauls, Rockwell Collins
Douglas Sober, Kaneka Texas Corpor
Dr. Hans-Peter Tranitz, Continenta
Duane Mahnke, DBMahnke Consulting
Eddie Hofer, Rockwell Collins
Edward Kelley, Isola Group SARL
Edward Peters Ph.D., Sabic Innovat
Edward Sandor, Taconic Advanced Di
Eric Bastow, Indium Corporation of
Fern Abrams, IPC
Frank Egitto, Endicott Interconnec
Gabe Cherian, Cherian Enterprises
Garry McGuire, NASA Marshall Space
Gary Brist, Intel Corporation
Gary Ferrari CID+, FTG Circuits
Gary Long, Intel Corporation
George Milad, Uyemura Internationa
George Oxx Jr., Jabil Circuit, Inc
George Shangguan, University of Ca
Gerard O'Brien, Solderability Test
Glenn Oliver, DuPont
Gordon O'Hara, Flextronics
Greg Hurst, BAE Systems
Greg Papandrew, Bare Board Group
Gregory Munie, IPC
Gustavo Ramos, Atotech Deutschland
Hans-Peter Tranitz, Continental Au
Harald Wack Ph.D., ZESTRON America
Hartmut Berndt, B.E. STAT Elektron
Ivan Castellanos, Indium Corporati
J. Lee Parker Ph.D., JLP
Jack McCullen, Intel Corporation
James Carrigan, Premier Semiconduc
James Haley, Ormet Circuits, Inc.
James W. Hall, ITM Consulting Inc.
James Williams, Polyonics, Inc.
Jamin Taylor, Minco Products, Inc.
Jan Obrzut Ph.D., NIST
Jan Vandaman, TechSearch Internati
Jane Feng, Flextronics
Jasbir Bath, Christopher Associate
Jason Ferguson, NSWC Crane
Jason Keeping, Celestica
Jay Desai, M-Flex (Multi-Fineline
Jeffrey Roth, Fees & Burgess, P.C.
Jennie Hwang Ph.D., H-Technologies
Jennifer Day CIT, U.S. Army Aviati
Jennifer Nguyen, Flextronics Inter
Jeramie Winch, IBM Corporation
Jeremy Wu, Huizhou King Brother Ci
Jerry Chia, Intel Corporation
Jianbiao Pan, Cal Poly State Unive
Jianmou Qiu, Pulse Engineering
Jie Zhang, Institute of Materials
Jim Garner, 2BG Solar
Jim Griffin, Integral Technology
Jim Quilici, Radial Electronics
Jim Sweeney, PTC
Jim Vanden Hogen, Plexus Corporati
Jinho (Paul) Kim, Samsung Electro-
Joe Fjelstad, Verdant Electronics
Joe McGurran, Atotech USA Inc.
Joel Yocom, Reshore America
John Ciba Jr., Brady Corporation
John Coonrod, Rogers Corporation
John Davignon, Intel Corporation
John Fisher, Interconnect Technolo
John McMahon, Celestica
John Nelson, Siemens PLM Software
John Pendlebury, Agilent Technolog
John Plyler, RIM
John Radman, Trace Laboratories -
John Sharp, TriQuint Semiconductor
John Waryold, HumiSeal Division of
Jorgen Vos, PTC
Joseph Belmonte, ITM Consulting In
Joseph Flanagan, Purdue University
Joseph Russeau, Precision Analytic
Joseph Thomas, ZN Technologies
Julie Silk, Agilent Technologies
Karen McConnell CID, Northrop Grum
Karen Moore-Watts, DEK UK
Karl Sauter, Oracle America, Inc.
Karl Seelig, AIM, Inc.
Kate Maureen Mayer CID+
Keith Sweatman, Nihon Superior Co.
Kelly Bo, University of Maryland
Kelly St. Andre, PTC
Kevin Ye, Guangdong Shengyi Sci.Te
Koh ET (Eng Thiem), Optosem Techno
Krista Crotty, Alberi EcoTech
Lameck Banda Ph.D., Dow Chemical U
Lars-Olof Wallin, IPC European Rep
Laurent Coudurier, Air Liquide
Lee Ritchey, Speeding Edge
Lee Wilmot, TTM Technologies, Inc.
Leo Lambert MIT, EPTAC Corporation
Leo Van de Vall, Assembleon Americ
Loc Nguyen, San Jose State Univers
Lorena Martinez, EPIC Technologies
Louis Hart, Compunetics Inc.
Louis Ungar, A.T.E. (Advanced Test
Maggie Man, Guangdong Shengyi Sci.
Marc Carter, IPC
Maria Nikolova, MacDermid, Inc.
Mario Scalzo III, Indium Corporati
Mark Beesley, AT&S Austria Technol
Mark Buechner, BAE Systems
Mark Finstad CID, Flexible Circuit
Mark Frimann, Texas Instruments In
Mark Northrup, IEC Electronics Cor
Mark Poliks Ph.D., Endicott Interc
Mark Verbrugge CID, Pica Manufactu
Markus Leitgeb, AT&S Austria Techn
Markus Riester, maris TechCon
Martin Anselm, Universal Instrumen
Mary Muller, Crane Aerospace & Ele
Matthew Vandiver, Flextronics
Matthias Zapatka, Ingun
Mei Ming Khaw, Agilent Technologie
Mel Parrish, STI Electronics, Inc.
Michael Azarian, University of Mar
Michael Carano, OMG Electronic Che
Michael Cieslinski, Panasonic Fact
Michael Ford, Mentor Graphics
Michael Green, Lockheed Martin Spa
Michael Haller, Fischer Technology
Michael Hill, DDi
Michael Janezic Ph.D., NIST
Michael Luke CID+
Michael Moisan, TTM Technologies
Michael Osterman Ph.D., University
Michael Palazzola, Atotech USA Inc
Michael Smith, Teradyne
Michael Szuch, Nordson Asymtek
Mike Bixenman DBA, Kyzen Corporati
Mike Nager, Phoenix Contact
Mike Tucker, Colonial Circuits Inc
Mikel Williams, Ddi Corp
Mo Biglari, Mat-Tech BV
Mumtaz Bora CID, Peregrine Semicon
Mustafa Oezkoek, Atotech Deutschla
Neil Bolding, MacDermid Autotype I
Nicholas Leonardi, Premier Semicon
Nick Koop CID, Minco Products, Inc
Nicole Palma, Indium Corporation o
Ning-Cheng Lee Ph.D., Indium Corpo
Norman Mier MIT, BEST Inc.
Ovidiu Munteanu, Underwriters Labo
Patricia Goldman, P. J. Goldman Co
Patrick Schuchardt, GOEPEL Electro
Patty Miller, Phoenix Contact
Paul Reid, PWB Interconnect Soluti
Peter Bigelow, IMI Inc.
Peter Borg, Research In Motion Lim
Peter Irvine, DuPont
Peter Robinson, Total Parts Plus
Phil Kinner, PVA
Phil Plonski, Prismark Partners
Phil Zarrow, ITM Consulting Inc.
R. Johnson Ph.D., Auburn Universit
Raiyomand Aspandiar, Intel Corpora
Rajat S. Basu Ph.D., Honeywell
Rajesh Kumar, DDi Corp.
Ramon Tapia, Celestica Monterrey
Randy McNutt, Northrop Grumman Cor
Randy Reed, Viasystems Group, Inc.
Ray Prasad, Ray Prasad Consultancy
Raymond Gales, Circuit Foil Luxemb
Renee Michalkiewicz MIT, Trace Lab
Reza Ghaffarian Ph.D., Jet Propuls
Richard Almeida, DownStream Techno
Richard Coyle, Alcatel-Lucent
Richard Fitzgerald, Qual-Pro Corpo
Richard Hartley CID, L-3 Avionics
Richard Mellitz, Intel Corporation
Richard Rumas CIT, Honeywell Canad
Richard Snogren CID, Bristlecone L
Rick Stanton CIT, ProSkill Trainin
Rita Mohanty Ph.D., Speedline Tech
Robert Cooke CIT, NASA Johnson Spa
Robert Toppel, Axiom Electronics,
Robert Wettermann MIT, BEST Inc.
Rocky Hilburn, Insulectro
Roger Engle, AESCO Electronics
Rolland Savage, High Performance C
Ronald Lasky Ph.D., Indium Corpora
Russell Dudek, Compunetics Inc.
Russell Nowland, Alcatel-Lucent
Russell Shepherd MIT, Microtek Lab
S. Manian Ramkumar Ph.D., Rocheste
Sal Sparacino, ZESTRON America
Satish Parupalli, Intel Corporatio
Scott Gordon, DuPont
Scott Hinaga, Cisco Systems Inc.
Shawn DuBravac, Consumer Electroni
Stephen Hall, Intel Corporation
Stephen Pudles, Spectral Response,
Stephen Tisdale, Intel Corporation
Steve Tomas, Flexcon Company
Steven Martell, Sonoscan Inc.
Steven McEuen, Epic Technologies
Steven Williams, Williams Consulti
Susan Landry, Albemarle Corporatio
Susan Mucha, Powell-Mucha Consulti
Susy Webb CID, FairfieldNodal
Syed Sajid Ahmad, North Dakota Sta
T. John Laser MIT, L-3 Communicati
Takeo Negishi, Gardien Japan Co. L
Teresa Rowe CIT, AAI Corporation
Theron Lewis, IBM Corporation
Thomas Cipielewski, Jabil Circuit,
Thomas Fritzler, University of Mar
Thomas Hausherr CID+, PCB Librarie
Thomas Kemp CIT, Rockwell Collins
Thomas Kolbusch, Coatema Coating M
Thomas Lesniewski, Northrop Grumma
Tim Pearson, Iowa State University
Tim Von Werne, Semblant Ltd.
Timothy Estes, Conductor Analysis
Todd Kolmodin, Gardien Services US
Tomer Segev, Camtek USA, Inc.
Tony Zhou, RayVal (Suzhou) Technol
Umut Tosun, ZESTRON America
Vern Solberg, Solberg Technical Co
Vijay Prasad, Ops A La Carte LLC
Voya Markovich, Endicott Interconn
Walter Moser, AT&S Austria Technol
Ward Gatza, Agilent Technologies
WeiBing Qian, Flextronics Tech (Sh
William Coleman Ph.D., Photo Stenc
William Ortloff Sr., Raytheon Comp
Xiang Wei, Kester
Xiaofei He, University of Maryland
Xiaowei Teng, University of New Ha
Ya Jun Gu, Flextronics Tech (Shang
Yakov Bulayev, Hamamatsu Corporati
Yeonseop Yu, Samsung Electro-Mecha
Yin Simon, Shengyi Technology Co.,
Location:
All
18
6A
San Diego Convention Center
Topic/Track:
All
Assembly Processes for Lead Free and Tin Lead
Cleaning/Coating/Contamination
Design
Emerging Technologies
Environmental Issues and Compliance
PCB Fabrication and Materials
Printed Electronics
Quality, Reliability and Test
Supply Chain/Busines Issues
Supply Chain/Business Issues
Event Type:
All
Buzz Session
Committee
Designer
Management
Poster
Professional Development
Special Event
Standard Development Committee Meeting
Technical Conference Session
General Committee:
All
Assembly and Joining
Assembly Equipment
Base Materials
Cleaning and Coating
Electronic Documentation Technology
Electronic Product Data Description
Embedded Devices
Environment, Health & Safety (EHS)
Fabrication Processes
Flexible and Rigid-Flex Printed Boards
High Speed/High Frequency Interconnections
Management
Packaged Electronic Components
Printed Board Design Technology
Printed Electronics
Process Control
Product Assurance
Product Reliability
Rigid Printed Boards
Terms and Definitions
Testing
Xtras
Level:
All
Advanced
Basic
Intermediate
Room:
All
10
11A
11B
12
13
14
14A
14B
15A
15B
18
1A
1B
2
3
4
5A
5B
6A
6C
6D
6E
6F
7A
7B
8
9
Sails Pavillion Entrance
Show Floor
West Terrace
Keyword:
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Programs: 21 - 30 of 250
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Sun, Feb 26, 2012 - 9:00 AM to 12:00 PM
PD14: Signal Integrity Problem Prevention: High-Speed Routing & Termination
Presenter/Committee Chair(s):
Richard Hartley CID, Sr. Principal Engineer, L-3 Avionics Systems Inc.
Location: San Diego Convention Center
Topic/Track: Design
Event Type: Professional Development
Level: Intermediate
Room: 11A
Add to Planner
Sun, Feb 26, 2012 - 9:00 AM to 12:00 PM
PD21: Basics of PCB Design
Presenter/Committee Chair(s):
Susy Webb CID, Senior PCB Designer, FairfieldNodal
Location: San Diego Convention Center
Topic/Track: Design
Event Type: Professional Development
Level: Basic
Room: 5B
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Sun, Feb 26, 2012 - 9:00 AM to 12:00 PM
PD25: Conformal Coatings: Types, Uses and Specifications
Presenter/Committee Chair(s):
Douglas Pauls, Pr Matl & Process Engr, Rockwell Collins
Location: San Diego Convention Center
Topic/Track: Cleaning/Coating/Contamination
Event Type: Professional Development
Level: Basic
Room: 8
Add to Planner
Sun, Feb 26, 2012 - 9:00 AM to 12:00 PM
PD31: SMT Process Fundamentals for Tin-Lead and Lead-Free Assembly
Presenter/Committee Chair(s):
S. Manian Ramkumar Ph.D., Prof&Dir Elct Mfg&Assmbly, Rochester Institute of Technology
Location: San Diego Convention Center
Topic/Track: Assembly Processes for Lead Free and Tin Lead
Event Type: Professional Development
Level: Basic
Room: 5A
Add to Planner
Sun, Feb 26, 2012 - 9:00 AM to 12:00 PM
PD50: Flexible and Rigid-Flex Circuit Design Principles and Fabrication
Presenter/Committee Chair(s):
Vern Solberg, Senior Consultant, Solberg Technical Consulting
Location: San Diego Convention Center
Topic/Track: PCB Fabrication and Materials
Event Type: Professional Development
Level: Basic
Room: 1B
Add to Planner
Sun, Feb 26, 2012 - 10:00 AM to 6:00 PM
4-33A: Low-Halogen Guideline Task Group
Presenter/Committee Chair(s):
Mark Frimann, Product Stewardship Mgmnt, Texas Instruments Inc.
John Sharp, Corporate Product Compliance Manager, TriQuint Semiconductor Inc.
Location: San Diego Convention Center
Topic/Track: Environmental Issues and Compliance
Event Type: Standard Development Committee Meeting
General Committee: Environment, Health & Safety (EHS)
Room: 15B
Add to Planner
Sun, Feb 26, 2012 - 10:00 AM to 9:00 PM
IPC APEX EXPO Golf Tournament & Reception
Event Type: Special Event
Add to Planner
Sun, Feb 26, 2012 - 2:00 PM to 5:00 PM
PD02: PCB Fabrication Basics: Process and Specification (Part 2)
Presenter/Committee Chair(s):
Jim Vanden Hogen, Sr PCB Commodity Spclst, Plexus Corporation
Don Schmieder III, PCB Commodity Manager, Plexus Electronic Assembly Corporation
Location: San Diego Convention Center
Topic/Track: PCB Fabrication and Materials
Event Type: Professional Development
Level: Basic
Room: 4
Add to Planner
Sun, Feb 26, 2012 - 2:00 PM to 5:00 PM
PD10: Final Finishes - Compatibility with Lead-Free Assembly
Presenter/Committee Chair(s):
Michael Carano, VP of Technical Operations for Electronic Chemicals, OMG Electronic Chemicals, LLC
Location: San Diego Convention Center
Topic/Track: PCB Fabrication and Materials
Event Type: Professional Development
Level: Intermediate
Room: 1A
Add to Planner
Sun, Feb 26, 2012 - 2:00 PM to 5:00 PM
PD16: Mastering Lead-Free and Tin-Lead Selective Soldering
Presenter/Committee Chair(s):
Bob Klenke, Principal Consultant, ITM Consulting Inc.
Location: San Diego Convention Center
Topic/Track: Assembly Processes for Lead Free and Tin Lead
Event Type: Professional Development
Level: Intermediate
Room: 7B
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Programs: 21 - 30 of 250
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