AIT is an ISO9001 certified facility that manufactures flexible “Stress-free” adhesives, films, pastes and thermal gels and grease. Products are available in syringes, jars, premixed & frozen or separated in Part A & Part B for ambient storage. Epoxies are used for die-attach, lid sealing, BGA, multichip modules, and wafer lamination.
Our IMTS uses proprietary flexible thermal dielectric insulating layer resulting in stress and warp-free thermal copper-clad laminates. New in 2012 is our “MODIFIED”- COOL-SILVER 3G “non-silicone” grease for increased thermal performance.